Industry Directory: 280750 timing 20x (2)

UltraCAD Design, Inc.

Industry Directory | Consultant / Service Provider

A printed circuit board design service bureau located in the great Pacific Northwest. We specialize in large, complex, fast turn designs common in the video processing and data processing industries.

Advanced Assembly, LLC.

Industry Directory | Consultant / Service Provider / Manufacturer

Advanced Assembly provides quality PCB assembly services for prototypes and low-quantity orders 87% faster than other shops.

New SMT Equipment: 280750 timing 20x (63)

DP8051 - 5th generation of World's most popular 8051 core - now almost 20x faster

New Equipment | Other

Overview • Almost 20.faster than the original 80C51 at the same frequency • Up to 14.632 VAX MIPS at 100 MHz • Pipelined RISC architecture The DP8051 is an ultra high performance, speed optimized soft core, of a single-chip 8-bit embedded con

Digital Core Design

Ultra V High Speed In-Line AOI

Ultra V High Speed In-Line AOI

New Equipment | Inspection

The Ultra V is MVP’s fastest AOI system, designed for manufacturers with the need for the fastest beat rates. The Ultra V Series deploys the highest speed interfaces, computers and camera technologies to provide the fastest inspection times without

Machine Vision Products, Inc

Electronics Forum: 280750 timing 20x (20)

No such thing as a Compact Reflow Oven?

Electronics Forum | Tue Mar 20 11:50:05 EDT 2018 | jimpat

Another option to consider is ATCO (http://www.atco-us.com/products/item/5-pro-1600-smt-reflow-ovens). Cycle time is around 5 minutes and your throughput will depend on on how many panels will fit in the 20" x 20" work area.

Boards getting

Electronics Forum | Fri Jul 22 16:42:50 EDT 2005 | campos

hello all, I�m experiencing problems with "warped" boards after first reflow, some of them i just can�t print side two due to this problem,,is it related only to reflow? i�m using a linear profile (225� peak / 70s time above) with a tin lead paste,t

Used SMT Equipment: 280750 timing 20x (23)

YesTech YTV 2050

YesTech YTV 2050

Used SMT Equipment | AOI / Automated Optical Inspection

Capture on the fly technology 3D Fusion Lighting (RGB+White LED's) 5 megapixel color imaging 2 top-down and 4 side angle cameras Quick set-up High speed, high defect coverage Low false failure rate Programmable conveyor for boards up to 20 x 2

Baja Bid

Hexi RFN1020/N

Hexi RFN1020/N

Used SMT Equipment | Soldering - Reflow

HEXI, Lead-Free reflow soldering machine, type RFN1020/N, s.n. 0611018, Left to Right, with 10 heating heads plus cooling head, lenght of heating zones 3365mm,max width of PCB 450 mm, width of conveyor 50 to 450 mm, height of conveyor 920 +/_ 20 mm,

Baja Bid

Industry News: 280750 timing 20x (60)

The Murray Percival Company Announces End of Summer Inspection Sale

Industry News | 2019-07-21 19:29:16.0

Murray Percival Company is pleased to announce an end of summer inspection sale on products from Vision Engineering.

Murray Percival

Fleetwood Group Places Order for Juki’s FlexSolderWave FSW620

Industry News | 2011-06-29 16:14:19.0

Juki Automation Systems has received a purchase order from Fleetwood Group for its FlexSolderWave FSW620.

Juki Automation Systems

Parts & Supplies: 280750 timing 20x (905)

MPM timing printer belt

MPM timing printer belt

Parts & Supplies | SMT Equipment

MPM 1014951 timing printer belt More SMT parts available H1067R A12GD25-1L-Z FUJI CP6 Solenoid valve H1068Z PCD2413-NB-D24 FUJI CP643 13 Solenoid valve H1082T RCS-242-M3-D24MP Solenoid valve H1084A SS23H-M5-D24-UPK Sensor H1124D FUJI XP242 243

DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD

Yamaha  KHY-M4570-20X  BOARD ASSY used

Yamaha KHY-M4570-20X BOARD ASSY used

Parts & Supplies | SMT Equipment

YAMAHA KHY-M4570-20X  BOARD ASSY if need more info about the products , pls don’t hesitate to contact with us at any time.More info pls visit our website:www.ksunsmt.com. Email: alice@ksunsmt.com Skype: alice@ksunsmt.com Whats app: +86 1

DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD

Technical Library: 280750 timing 20x (1)

Approaches to Overcome Nodules and Scratches on Wire Bondable Plating on PCBs

Technical Library | 2020-08-27 01:22:45.0

Initially adopted internal specifications for acceptance of printed circuit boards (PCBs) used for wire bonding was that there were no nodules or scratches allowed on the wirebond pads when inspected under 20X magnification. The nodules and scratches were not defined by measurable dimensions and were considered to be unacceptable if there was any sign of a visual blemish on wire-bondable features. Analysis of the yield at a PCB manufacturer monitored monthly for over two years indicated that the target yield could not be achieved, and the main reasons for yield loss were due to nodules and scratches on the wirebonding pads. The PCB manufacturer attempted to eliminate nodules and scratches. First, a light-scrubbing step was added after electroless copper plating to remove any co-deposited fine particles that acted as a seed for nodules at the time of copper plating. Then, the electrolytic copper plating tank was emptied, fully cleaned, and filtered to eliminate the possibility of co-deposited particles in the electroplating process. Both actions greatly reduced the density of the nodules but did not fully eliminate them. Even though there was only one nodule on any wire-bonding pad, the board was still considered a reject. To reduce scratches on wirebonding pads, the PCB manufacturer utilized foam trays after routing the boards so that they did not make direct contact with other boards. This action significantly reduced the scratches on wire-bonding pads, even though some isolated scratches still appeared from time to time, which caused the boards to be rejected. Even with these significant improvements, the target yield remained unachievable. Another approach was then taken to consider if wire bonding could be successfully performed over nodules and scratches and if there was a dimensional threshold where wire bonding could be successful. A gold ball bonding process called either stand-off-stitch bonding (SSB) or ball-stitch-on-ball bonding (BSOB) was used to determine the effects of nodules and scratches on wire bonds. The dimension of nodules, including height, and the size of scratches, including width, were measured before wire bonding. Wire bonding was then performed directly on various sizes of nodules and scratches on the bonding pad, and the evaluation of wire bonds was conducted using wire pull tests before and after reliability testing. Based on the results of the wire-bonding evaluation, the internal specification for nodules and scratches for wirebondable PCBs was modified to allow nodules and scratches with a certain height and a width limitation compared to initially adopted internal specifications of no nodules and no scratches. Such an approach resulted in improved yield at the PCB manufacturer.

Teledyne DALSA

Videos: 280750 timing 20x (21)

Siemens BELT GUIDE Y-AXIS 00321607-03

Videos

03037000-01 Guide rail 4 left side    03037001-01 Guide rail 5 left side    03037002-01 Guide rail 6 left side    03037017-01 RETRO FIT KIT KGT 20x12    03037268S01 CPU-Bg. SMP16-CPU076 650MHz 128MB    03037619-01 Silencer/Pneumatic System HS   

Qinyi Electronics Co.,Ltd

Panasonic AM100 SMT Pick and Place Machine

Panasonic AM100 SMT Pick and Place Machine

Videos

Panasonic AM100 SMT Pick and Place Machine If you could not find any similar items you want, you may send some photos to us. because our catalog and website haven't included allof our products. Pick and place machine, SMT pick and place machine

Dongguan Intercontinental Technology Co., Ltd.

Express Newsletter: 280750 timing 20x (494)

Partner Websites: 280750 timing 20x (24)

YAMAHA 71F Nozzles KV8-M71N1-A0X SMT Feeder Parts

| https://www.feedersupplier.com/sale-13119055-yamaha-71f-nozzles-kv8-m71n1-a0x-smt-feeder-parts.html

=0.8 KM4-M7113-10X YV64D DISP. NZ. 2D/2S OD 0.8/ ID 0.5 P=1.0 KM4-M7113-20X YV64D DISP. NZ. 1D/2S OD 0.6/ ID 0.3 KM4-M7113-30X YV64D


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