STATS ChipPAC is a leading provider of advanced semiconductor packaging and test services to global customers in the communication, consumer and computing markets.
Industry Directory | Consultant / Service Provider / Distributor / Manufacturer's Representative
PollEx Software is used for reviewing and analyzing PCB design and manufacturing process. It reads any ECAD formats and supports DFM, DFA, DFE , 3-D Package Library features.
The world-class precision and quality Spectrum® II system for assembly of mobile electronics, semiconductors, MEMS, and PCBs High Speed, High Accuracy, Precision Dispensing System. Higher consistency leads to higher yield and maximum profitability
New Equipment | Test Equipment
Koh Young KY8080 3D SPI Min component: 01005 PCB size:350x330mm Dimension:1000x1335x1627mm weight:600kg Product description: Koh Young KY8080 3D SPI, Min component: 01005, PCB size:350x330mm, weight:600kg, Dimension:1000x1335x1627mm Koh Young KY808
Electronics Forum | Thu May 10 13:58:26 EDT 2001 | tomgervascio
It sounds like 3D imaging is much better at fault detection for partially visible leads like SOJ packages. Can any of the 2D systems actually do a solderjoint inspection on the outer rows of BGAs or is the angle too acute to accurately look at these.
Electronics Forum | Fri Aug 04 10:09:47 EDT 2017 | ks0707
Good morning, I looked one cycle of programming of Koh Young 3D AOI machine first, and will do same thing for JUKI Pick & Place and Mechatronic 2D AOI machine soon. BTW, I found from User manual of Koh Young 3D AOI that it allowed Mento Export file
Used SMT Equipment | AOI / Automated Optical Inspection
3D Wafer Bump &Wire Bonding AOI Inspection system Highest quality 3D Wire-Inspection. With high-resolution, complete inspection is possible even for Foot-shape. Inspect Mirror-surface without Reflection problem. As for PEMTRON'S unique optical techn
Used SMT Equipment | AOI / Automated Optical Inspection
Key Features Ultimate Solution for Inspection Challenges Circuit boards are becoming more complex with new products. An AOI machine is becoming even more crucial to the electronics manufacturing lines. The industry has many2D, 2.5D and pseudo
Industry News | 2003-05-30 08:26:20.0
The inventors of this module type and holders of the patent are chief technical officer Kenneth J. Kledzik and president Jason C. Engle, both of San Clemente, California.
Industry News | 2003-06-17 08:07:40.0
The Radiall SMT coupler range now includes the new 14.2 x 5.1mm mini type.
Parts & Supplies | Pick and Place/Feeders
N610119576AA 付属品(LNB/HUB/左/右コンベア):NPM-D N210126417AD COVER N610147510AA BRACKET N610123959AA 銘板・警告ラベル(コンヘアステーション):NPM-D N510048038AA NUT N610119573AA 銘板・警告ラベル(コンベア ステーション):NPM-D N210077946AB STOPPER N510033553AA SPRING N210158977AA BAR N5100
Parts & Supplies | SMT Equipment
00386587-02 Retrofit Kit LCD Monitor on SIPLACE S/F 00386900-02 Upgrade Package SIPLACE Pro (V5.2) 00386901-01 Setup Center update Package V3.0 00386910-01 Software-Update (unattended) WIN XP SP3 00386960-02 Siplace Pro V5.2 - LANGUAGE PACK 0038
Technical Library | 2025-08-29 13:53:05.0
In electronics manufacturing, "underfill" refers to a material that is applied to fill the gap between a semiconductor device, such as flip-chip assemblies, Ball Grid Arrays (BGA), or Chip Scale Packages (CSP), and the substrate, such as a PCB or flex circuit. It is also important in 3D ICs and advanced packaging technologies that involve stacking multiple chips or integrating multiple functions into a single package.
Technical Library | 2012-12-17 22:05:22.0
Package on Package (PoP) has become a relatively common component being used in mobile electronics as it allows for saving space in the board layout due to the 3D package layout. To insure device reliability through drop tests and thermal cycling as well as for protecting proprietary programming of the device either one or both interconnect layers are typically underfilled. When underfill is applied to a PoP, or any component for that matter, there is a requirement that the board layout is such that there is room for an underfill reservoir so that the underfill material does not come in contact with surrounding components. The preferred method to dispensing the underfill material is through a jetting process that minimizes the wet out area of the fluid reservoir compared to traditional needle dispensing. To further minimize the wet out area multiple passes are used so that the material required to underfill the component is not dispensed at once requiring a greater wet out area. Dispensing the underfill material in multiple passes is an effective way to reduce the wet out area and decrease the distance that surrounding components can be placed, however, this comes with a process compromise of additional processing time in the underfill dispenser. The purpose of this paper is to provide insight to the inverse relationship that exists between the wet out area of the underfill reservoir and the production time for the underfill process.
Why you should attend International Wafer-Level Packaging Conference, October 23 - 25, 2018 in San Jose, California, USA.
SMTA International Electronics Exhibition Tuesday, September 29: 9am-5pm Wednesday, September 30: 9am-4pm Donald Stephens Convention Center Rosemont, IL See More Equipment & Technology Than Ever Before! Many of the 160 exhibiting companies will bri
Training Courses | | | PCB Design Courses
The PCB design courses teach students the process, techniques and tools needed to design layout of printed circuit boards.
Events Calendar | Tue Feb 15 00:00:00 EST 2022 - Thu Feb 17 00:00:00 EST 2022 | San Jose, California USA
Wafer-Level Packaging Symposium
Events Calendar | Tue Oct 13 00:00:00 EDT 2020 - Thu Oct 15 00:00:00 EDT 2020 | San Jose, California USA
International Wafer-Level Packaging Conference (IWLPC)
Career Center | Dallas, Texas USA | Engineering
Skills/Requirements: Experience in solid Edge CAD/CAM 3D system software and electronic packaging, Prior experience designing packaging systems a plus. Duties/Functions: Responsibility for the design of mechanical systems for electronic packaging. W
Career Center | Seymour, Connecticut USA | Engineering
Develop and manage SMT assembly and soldering processes and associated staff in medium volume/high-mix printed circuit board assembly operation for complex quality class 2/3 assemblies. DUTIES AND RESPONSIBILITIES: Plan and develop processes a
Career Center | Bangalore, India | Engineering,Management,Production,Quality Control,Technical Support
WORK EXPERIENCE DETAILS: 7+ Years of Experience in manufacturing & hardware testing of Protocol conveter & Commissioning, Products delivery and QA/QC. 2+ Years of Experience in Hardware testing and Package Level testing. 2+ Years of Experience in
Career Center | Nariveles, Philippines | 2019-11-21 13:32:04.0
Failure Analysis Technician Quality-driven and goal-focused with strong research, planning and Problem-solving abilities. Gifted in being a technical knowledge base, Organizing workflow and improving processes.
Modern 2D / 3D X-Ray Inspection - Emphasis on BGA, QFN, 3D Packages, and Counterfeit Components Modern 2D / 3D X-Ray Inspection - Emphasis on BGA, QFN, 3D Packages, and Counterfeit Components With PCB complexity and density increasing and also
3D IC Development Needs Innovative Socket Solution 3D IC Development Needs Innovative Socket Solution Evolution from cell phones with only a base-band processor and limited memory to today's high-end phones with an additional applications
PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/ferrite-beads-in-chip-packaging_topic679_post2325.html
Ferrite Beads in Chip Packaging - PCB Libraries Forum Forum Home > Libraries > Footprints / Land Patterns New Posts FAQ Search Events Register Login Ferrite Beads in Chip Packaging
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