Industry Directory | Manufacturer
We are manufacturer of key products for semiconductor back end process and interconnect materials. Our main products:solder balls, Bonding wire (Au, Ag, Cu, Pd-Cu),sputtering target & EVM materials.
Industry Directory | Manufacturer's Representative
Specialty materials for SMT Assembly. Solder Paste, Spheres, Tac Fluxes, Flip Chip Fluxes, Solder wi
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New Equipment | Industrial Automation
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Sn/3.5Ag, Sn/0.7Cu, Sn/3.9Ag/0.6Cu, Sn/2.0Ag/0.7Cu (for Bar, Wire, Paste, BGA & Anode); Sn/Sb (for Bar); Sn (for Bar, Wire & Anode); Ni/Pd (for Bar, BGA & Anode); Conductive Adhesive (for Paste).
Electronics Forum | Thu Jul 06 02:36:31 EDT 2006 | visitor
I have question,is this the only Ag/Pd component in your board? If yes then concentrate on this component, I would suggest evaluating other component of the same value with Tin terminations. If I am not mistaken Ag/Pd plated components termination
Electronics Forum | Mon Oct 22 20:41:32 EDT 2007 | jkhiew
Hi Dave, The solder has tended to wet the component termination of Ag/Pd (chip capacitor) but has not wetted the pads, whereas the solder has wetted both termination & pads when using Ag/Ni/Sn finishes. Thks
Used SMT Equipment | Screen Printers
Make: Mycronic Model: My600 Jet Printer Vintage: 8/2016 Details: • Internal Conveyor • 2D Camera • Internal Injector Cooling Unit • Barcode Scanner USB • Network Interface • SMEMA Compliant • 2D Inspection & Repair • Offline PC with MYCAM
Industry News | 2011-11-30 13:07:59.0
Genuine electronics manufacturing industry concerns, challenges and problems will be addressed in 50 IPC APEX EXPO professional development courses, February 26–27 and March 1, 2012, at the San Diego Convention Center.
Industry News | 2020-03-19 13:12:42.0
The SMTA is pleased to announce the Best Papers from SMTA International 2019. As speakers at SMTA International, individuals make contributions to the industry by sharing their research and findings. For these exceptional achievements, a cash award and plaque are given to primary authors of all winning papers.
Parts & Supplies | Other Equipment
C20-CPU84-E C200H-CPU01 C2000HCPU01E2V C2000HCPU0IE2V1 C200H-CPU02 C200H-CPU03 C200h-CPU11 C200H-CPU21 C200HCPU3E2 C200H-CPU31 C200HCPU31E2 C200HS-CPU01 C200HS-CPU21 C200HS-CPU31 C200HE-CPU11 C200HE-CPU32 C200HE-CPU42 C200HG-CPU33 C200HG-CP
Parts & Supplies | Other Equipment
6ES7 312-1AD10-0AB0 6ES7 312-5BD01-0AB0 6ES7 313-5BE01-0AB0 6ES7 313-6BE01-0AB0 6ES7 313-6CE01-0AB0 6ES7 314-1AF11-0AB0 6ES7 314-6BF02-0AB0 6ES7 314-6CF02-0AB0 6ES7 315-2AG10-0AB0 6ES7 315-2EG10-0AB0 6ES7 315-6
Technical Library | 2012-12-13 21:20:05.0
First published in the 2012 IPC APEX EXPO technical conference proceedings. We investigated the micro-void formation of solder joints after reliability tests such as preconditioning (precon) and thermal cycle (TC) by varying the thickness of Palladium (Pd) in Electroless Nickel / Electroless Palladium / Immersion Gold (ENEPIG) surface finish. We used lead-free solder of Sn-1.2Ag-0.5Cu-Ni (LF35). We found multiple micro-voids of less than 10 µm line up within or above the intermetallic compound (IMC) layer. The number of micro-voids increased with the palladium (Pd) layer thickness. Our results revealed that the micro-void formation should be related to (Pd, Ni)Sn4 phase resulted from thick Pd layer. We propose that micro-voids may form due to either entrapping of volatile gas by (Pd, Ni)Sn4 or creeping of (Pd, Ni)Sn4.
Technical Library | 2022-03-02 21:26:51.0
The solderability of a nickel-palladium-gold (Ni-Pd-Au) finish on a Cu substrate was evaluated for the Pb-free solder, 95.5Sn-3.9Ag-0.6 Cu (wt.%, abbreviated Sn-Ag-Cu) and the eutectic 63Sn-37 Pb (Sn-Pb) alloy. The solder temperature was 245ºC. The flux was a rosin-based mildly activated (RMA) solution. The Ni-Pd-Au finish was tested in the as-fabricated condition as well as after exposure to one of the following accelerated storage (shelf life) regiments: (1) 33.6, 67.2, or 336 hours in the Battelle Class 2 flowing gas environment or (2) 5, 16, or 24 hours of steam aging (88ºC, 90%RH).
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Influence of Pd Thickness on Micro Void Formation of Solder Joints in ENEPIG Surface Finish SMTnet Express December 13, 2012, Subscribers: 26067, Members: Companies: 9068, Users: 34058 Influence of Pd Thickness on Micro Void Formation of Solder
SMTnet Express, March 10, 2016, Subscribers: 24,118, Companies: 14,735, Users: 39,803 Acceptance Testing Of Low-Ag Reflow Solder Alloys Kris Troxel, Aileen Allen, Elizabeth Elias Benedetto, Rahul Joshi; HP Inc. Since the implementation
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. If slowly cooled, large grains arise, the boundaries of which may serve as precipitation points for Sn, resulting in cracks. Tin-Silver. Sn-3.5%Ag exhibits good solderability and mechanical properties and has the longest history of reliable usage as a lead-free solder
Surface Mount Technology Association (SMTA) | https://www.smta.org/smtai/best_papers.cfm
: Yoshinori Ejiri, Hitachi Chemical Co., Ltd. " The Wire Bonding Reliability of Electroless Ni/Pd/Au Plating Influence of Electroless Pd Deposition Reaction " View past award winners 2018 1st Place: Richard Coyle, Ph. D
