Industry Directory | Manufacturer
R&D Technical Services was formed in 1996 to support the Vapor Reflow market and is currently the leading source of Vapor Phase equipment.
Industry Directory | Manufacturer
Manufacturer of convection reflow ovens, vapor phase ovens, convection curing, and IR curing ovens.
Flux Free Formic Reflow Reflow in Formic Acid Vapor Heller has designed and built an production ready horizontal reflow oven for formic acid vapor. This new oven has been designed to meet Semi S2/S8 safety standards (including toxic gases). Form
V3/V4/V5 vapor phase reflow oven Model: V3/V4/V5 Product Description Product introduction: The name V3/V4/V5 is called according Vacuum , means professional industrial Vacuum reflow oven . Why chose Vacuum reflow oven? Recently ,the main weld
Electronics Forum | Wed Nov 17 09:28:40 EST 1999 | Steve Z
Hello, I am new to the SMT area and I need to know what a "good" vapor phase reflow profile should look like. The fluids we are using have a BP of 45 C and 219 C. Thanks,
Electronics Forum | Fri Nov 19 05:12:21 EST 1999 | Graham Naisbitt
Steve, If you can get me your snail-mail address, I will send you some latest information. We actually have a totally new system called Delta 5. It is Condensation Soldering rather than Vapour phase, the difference being that we solder in an air ti
Used SMT Equipment | Soldering - Reflow
REHM Condenso-Batch Vacuum Vapor Phase Reflow Oven Year 2008 Tension: 3 x 400V 50 Hz Power 20 kW Cooling 20 l/m Compressed air 8 bar Aspiration 400 m3/h Length 290 cm, Width 130 cm, Height 165 cm
Used SMT Equipment | Soldering - Reflow
REHM Condenso-Batch Vacuum Vapor Phase Reflow Oven Year 2008 Tension: 3 x 400V 50 Hz Power 20 kW Cooling 20 l/m Compressed air 8 bar Aspiration 400 m3/h Length 290 cm, Width 130 cm, Height 165 cm
Industry News | 2013-08-07 09:58:46.0
The SMTA launched an online re-certification program for engineers whose 10-year SMT Processes Certification is expiring.
Industry News | 2009-04-23 20:54:01.0
MINNEAPOLIS, MN � The SMTA is pleased to announce its latest technical event in Penang, Malaysia. The SMTA South East Asia Technical Conference on Electronics Assembly Technologies will be held November 19-20, 2009 at the Equatorial Hotel in Penang, Malaysia. Presentations are currently being solicited for the following key technology tracks:
Technical Library | 2014-03-20 12:37:39.0
In the beginning of SMT, Vapor Phase Soldering was the preferred reflow soldering technology because of its excellent heat transfer capabilities. There were also some disadvantages like fast temperature rise, nearly no influence on the temperature profiles and high costs. So the use of Vapor Phase Soldering was reduced to special applications with high mass or complex boards in low numbers (e.g. for military or aerospace use).
Technical Library | 2013-03-27 23:43:40.0
Vapor phase, once cast to the annals’ of history is making a comeback. Why? Reflow technology is well developed and has served the industry for many years, it is simple and it is consistent. All points are true – when dealing with the centre section of the bell curve. Today’s PCB manufacturers are faced with many designs which no longer fall into that polite category but rather test the process engineering groups with heavier and larger panels, large ground planes located in tricky places, component mass densities which are poorly distributed, ever changing Pb Free alloys and higher process temperatures. All the time the costs for the panels increase, availability of “process trial” boards diminishes and yields are expected to be extremely high with zero scrap rates. The final process in the assembly line has the capacity to secure all the value of the assembly or destroy it. If a panel is poorly soldered due to poor Oven setup or incorrect programming of the profile the recovery of the panel is at best expensive, at worst a loss. For these challenges people are turning to Vapor Phase.
Nano-copper sintering in formic acid vapor.
ASSCON’s vacuum soldering process combines the average of the vapor-phase with the vaccum process. The vaccum module consists of the evacuation unit mounted in the process chamber where it is secured with quick-locks for fast and easy removal f
Training Courses | | | PCB Assembly Courses
The PCB assembly courses provide knowledge of different processes and equipment used in TH and SMT assembly of printed circuit boards.
Events Calendar | Mon Apr 12 00:00:00 EDT 2021 - Mon Apr 12 00:00:00 EDT 2021 | ,
Europe Chapter Webinar: Tombstoning Components during Reflow Soldering - Causes & Cures
Events Calendar | Mon Apr 23 00:00:00 EDT 2018 - Thu Apr 26 00:00:00 EDT 2018 | Shanghai, China
SMTA China East Conference 2018
Career Center | binan city, Laguna Philippines | Engineering,Maintenance,Technical Support
6.5 Years Experience in Semiconductor Industry Specializing in Dispensing process and Equipment. 5.0 Years of Experience in Field Service Engineering. Machine Commissioning / Customer support 24 / 7, Technical Support for Customer machine and process
Career Center | tulsa, Oklahoma | Engineering
Printed Circuit Assembly Process Engineer. Seeking a position in a high-technology operation, utilizing my background supporting a progressive and growth-oriented organization. Offering the technical experience, expertise, and skills gained during th
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vapor phase reflow soldering. The reason for such defects is usually caused by the fact that the thermal conductivity of the relevant component leads is too high, and the temperature rises too fast, which causes the upturn of the
