Industry Directory | Manufacturer
ROBOTHERM is an engineering and manufacturing company specialized in the field of semiconductor, smart cards, C.O.B (Chip on Board), C.O.F (Chip on Flex), S.M.T (Surface Mounted Technology) and hybrids applications.
Industry Directory | Manufacturer
PCBA, SMT, COB, RFID Card
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High Speed PCB Separator CNC Router Cutting PCB Stree Free I. Hardware SPINDLE Morning Star spindle and inverter CCD:Sony 520 line industrial cameras LENS:Computar EX2C Screw:TBI Precision ground ball screw imports Guide:HIWIN widening I
1. Parts List I. Hardware SPINDLE Morning Star spindle CCD Sony 520 line industrial cameras LENS Computar EX2C Screw TBI Precision ground ball screw imports Guide HIWIN wide
Used SMT Equipment | In-Circuit Testers
• [1] Windows Controller • [2] ASRU C Cards • [2] Control XTp Cards • [18] Hybrid 6Mp/s Double Density Cards • [2] 6624A Power Supplies
Used SMT Equipment | In-Circuit Testers
2) Controller(s) B180L & RP5700 ** includes switch boxes and cables ** (2) ASRU C Cards (2) Control Xt Cards (18) Hybrid Double Density Pin Cards (2) 6624 Power Supplies (1) Printer Condition: Complete & Operational “Passes Diagnostics”
Industry News | 2003-03-26 08:25:40.0
The QVE00033 transmissive switch's small size, surface mount package and performance make it ideal for noncontact switching applications in disk drives, card detectors, mise and trackballs.
Industry News | 2003-02-25 09:10:01.0
The CSPEMI400 complements California Micro Devices' broad portfolio of CSP (chip scale package) devices for stand-alone ESD protection and EMI filter arrays with ESD protection, making it the most extensive in the industry.
Technical Library | 2024-07-24 00:51:44.0
A blade server system (BSS) utilizes voltage regulator modules (VRMs), in the form of quad flat no-lead (QFN) devices, to provide power distribution to various components on the system board. Depending on the power requirements of the circuit, these VRMs can be mounted as single devices or banked together. In addition, the power density of the VRM can be high enough to warrant heat dissipation through the use of a heat sink. Typically, at field conditions (FCs), the BSS are powered on and off up to four times per day, with their ambient temperature cycling between 258C and 808C. This cyclical temperature gradient drives inelastic strain in the solder joints due to the coefficient of thermal expansion (CTE) mismatch between the QFN and the circuit card. In addition, the heat sink, coupled with the QFN and the circuit card, can induce additional inelastic solder joint strain, resulting in early solder joint fatigue failure. To understand the effect of the heat sink mounting, a FEM (finite element model of four QFNs mounted to a BSS circuit card was developed. The model was exercised to calculate the maximum strain energy in a critical joint due to cyclic strain, and the results were compared for a QFN with and without a heat sink. It was determined that the presence of the heat sink did contribute to higher strain energy and therefore could lead to earlier joint failure. Although the presence of the heat sink is required, careful design of the mounting should be employed to provide lateral slip, essentially decoupling the heat sink from the QFN joint strain. Details of the modeling and results, along with DIC (digital image correlation) measurements of heat sink lateral slip, are presented.
Technical Library | 2022-10-11 20:29:31.0
Electronic assemblies deployed in harsh environments may be subjected to multiple thermal environments during the use-life of the equipment. Often the equipment may not have any macro-indicators of damage such as cracks or delamination. Quantiication of thermal environments during use-life is often not feasible because of the data-capture and storage requirements, and the overhead on core-system functionality. There is need for tools and techniques to quantify damage in deployed systems in absence of macro-indicators of damage without knowledge of prior stress history. The presented PHM framework is targeted towards high reliability applications such as avionic and space systems. In this paper, Sn3.0Ag0.5Cu alloy packages have been subjected to multiple thermal cycling environments including -55 to 125C and 0 to 100C. Assemblies investigated include area-array packages soldered on FR4 printed circuit cards. The methodology involves the use of condition monitoring devices, for gathering data on damage pre-cursors at periodic intervals. Damage-state interrogation technique has been developed based on the Levenberg-Marquardt Algorithm in conjunction with the microstructural damage evolution proxies. The presented technique is applicable to electronic assemblies which have been deployed on one thermal environment, then withdrawn from service and targeted for redeployment in a different thermal environment. Test cases have been presented to demonstrate the viability of the technique for assessment of prior damage, operational readiness and residual life for assemblies exposed to multiple thermo-mechanical environments. Prognosticated prior damage and the residual life show good correlation with experimental data, demonstrating the validity of the presented technique for multiple thermo-mechanical environments.
03006727S01 Silicone rubber hose Di 8 Da 12 el.conductive 03006730-02 PROTECTION FLAP FOR PLUG 03006742S04 BE-Sensor/C+P20 03006746-03 SLIDE 03006765-01 Kabel:Versorgung BE-Tisch ext. 03006767-03 Linear-motor Y-axis 03006775-
E1503716000 TRAY DOOR E1503719000 CORNER COVER BRACET E1503726000 SHUTTER SP E1503729000 COVER SBL (ML) E150375500B COVER joinT TL E1504716000 DOOR HANDLE E150475500B COVER joinT UL(Z) E1505716000 TOP COVER E1505717000 ST TRAY GUIDE
Career Center | Fremont, California USA | Engineering
Define validation test plan for SSD’s and other Flash products. Implement a test plan strategy and to develop test methodologies to cover product specification for SSD’s and other Flash products. Assist in selection of test hardware and writi
Career Center | Clifton, New Jersey USA | Engineering,Production
L3Harris is seeking an engineer to lead manufacturing and space vehicle integration related activities on the GPSIIIF and NTS3 program. The type of space flight hardware produced at this L3Harris location includes complex circuit card assemblies (CCA
L3 Communications, Telemetry and Instrumentation-LP Harris Technology
Career Center | Gurgaon, Haryana, (INDIA, India | Maintenance,Production,Quality Control
Senior Engineer - SMT �� New product introduction. �� Provide all of required Quality System documentation to include process definition, process flow, process Control plans, FMEAs, capability determination and operator instruction �� Definying and
Career Center | San Diego, California USA | Engineering,Management,Quality Control,Research and Development
ENGINEER, NPI, MANUFACTURING ASSEMBLY PROCESSES, 23 years experience #11;SOLDERING, MTLS & PROCESS ENGINEER, CIRCUIT CARD ASSEMBLY, ESDS PROGRAM MANAGER, QUALITY ENGINEER. Former Mil Spec INSTRUCTOR/EXAMINER (Cat C),
Lewis & Clark | http://www.lewis-clark.com/product-tag/asru-c/
ASRU C Archives - Lewis and Clark Skip to content My Cart: 0 View Cart Checkout No products in the cart. Subtotal: View Cart Checkout Lewis and Clark We Discover Equipment Opportunities NH: 603-594-4229 FL: 813-888-7436 sales@lewis
QYSMT SOLUTION USA LLC / Qinyi Electronics Co.,Ltd | https://www.qy-smt.com/shop/ja-m00220-1-c-nc-card-n1j2201c-210850?page=69&category=1122
PANASONIC NC card (N1J2201C) JA-M00220-1-C | QYSMT × Home about Us ABOUT US FAQ SMT spare parts SMT surplus equipment SMT peripheral equipments News Contact US 0 0 Sign in contact us Products PANASONIC NC card (N1J2201C
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