Electronics Forum | Sat May 26 05:11:43 EDT 2001 | Brian Sloth Bentzen
Dear Philip. BGA�s are very forgiven components when it comes to misplacement. In my experience, 1.27 mm ball pitch BGA�s, can be misplaces by up to 50% of the solder pad. They can easily be placed using only backlighted vision. It will however be a
Electronics Forum | Thu Oct 29 17:43:46 EST 1998 | Guillermo Villegas
Does anybody know how to update a different nozzle than the standard one on a Fuji IP3 machine? I want to use a 15.8 mm height nozzle, but the limit on height size is 10 mm for IP3.I know, I need to use a special nozzle, so I�m trying with a 16.00 m
