Industry Directory | Manufacturer
CableTest's high voltage interconnect equipment can test your cables, wiring harnesses, power cords, and backplanes with speed, accuracy and reliability.
Testronics provides a complete line of electrical testers and optical inspection systems for the loaded board & backplane industry.Some of the featured products include low cost bench top MDA�s, low cost AOI, and high pin count backplane test systems
dataCon has designed and manufactured many of the current backplane technologies such as VME 64X, PCI, and VXI. We can provide substrate procurement (from one of our partner companies or the customer's approved supply base), press fit and solder asse
Our experienced engineers will design an electro/mechanical solution to interface between your product and your test instruments. Circuit Check develops hot mock-up and custom stand-alone functional tests for circuit cards, backplane boards and card
Electronics Forum | Fri Apr 05 01:52:57 EDT 2024 | ddfreeze
Samsung SM321 machine fails to initialize when booting software. I have swapped PCI and communication boards, all resulting the same, I replaced the CMOS battery on communications board, tested the voltage on the backplane, and reloaded the software
Electronics Forum | Wed Oct 27 10:22:15 EDT 1999 | a.blair
Fuji is usually the cheapest you will find. I think around $750 for them to repair it. the last time I checked they have an exclusive patent on their PCB backplane design so there would not be any real way to bench test it. they also have rights to t
Used SMT Equipment | General Purpose Test & Measurement
Highly expandable, plug-in, modular design bit error rate tester (BERT) Bit Error Rate test from 0.1 Gbit/s to 32.1 Gbit/s; 64.2 Gbit/s with external MUX/DeMUX Supports signal integrity analysis for a variety of 100G+ applications High speed ba
Used SMT Equipment | In-Circuit Testers
Teradyne 8852 fully refurbished. Configuration: Wired for 2560 Test Points 10 x CC2 Cards P/N (048-830-00) 1280 Test Points 1 x High Voltage Prism (051-004-00) Rev W.O 1 x VXI-VP2 32Mb (051-116-01) Rev G 1 x Mini Fib (051-059-00) Rev E 1 x D
Industry News | 2003-03-12 09:10:10.0
As part of the opening celebration, Teradyne will be exhibiting this week at SEMICON China and in April at Nepcon Shanghai.
Industry News | 2014-01-03 18:29:15.0
Surface Mount Technologies, Inc. announces that it has teamed with Eruston Corporation to offer complete turnkey manufacturing.
Parts & Supplies | Assembly Accessories
Siemens SMT Spare Part Original New Nozzle 714 914 00321861-07 Model NO.: 00321861-07 Type: High-speed Chip Mounter Quality: 100% Tested Lead Time: 1--3 Days After Payment Usage: SMT Production Line Shipping Ways: DHL,FedEx,TNT,UPS,EMS,by Sea Trade
Parts & Supplies | Pick and Place/Feeders
We also supply following Siemens Spare parts : 00349121-02 MICRO STEP POWER OUTPUT SMC 44 00349122-01 FLAT-TAPE 12/1143 TG20 00349123-01 FLATTAPE 12/1655 TG20 00349124-01 FLAT-TAPE, 12/2460 TG20 00349189-01 I/O PCB (MIXED) KSP-P219-A32 003
Technical Library | 2023-09-07 14:38:31.0
A repeat customer specializing in high-technology interconnect, sensor, and antenna solutions, partnered with us to dispense small volumes of solder paste (Indium 10.1 SAC305 T6SG 78%m) onto backplane connectors – gold pads 0.175mm x 0.225mm. We performed a test requiring 0.200mm diameter or smaller dots to demonstrate the dispensing capability required.
Technical Library | 2022-08-08 15:06:06.0
Selective soldering has evolved to become a standard production process within the electronics assembly industry, and now accommodates a wide variety of through-hole component formats in numerous applications. Most through-hole components can be easily soldered with the selective soldering process without difficulty however some types of challenging components require additional attention to ensure that optimum quality is maintained. Several high thermal mass components can place demands on the selective soldering process, while the use of specialized solder fixtures, or solder pallets, often places additional thermal demand on the preheating process. Fine-pitch through-hole components and connectors place a different set of demands on the selective soldering process and typically require special attention to lead projection and traverse speed to minimize bridging between adjacent pins. Dual in-line memory module (DIMM) connectors, compact peripheral component interface (cPCI) connectors, coax connectors and other high thermal mass components as well as fine-pitch microconnectors, can present challenges when soldered into backplanes or multilayer printed circuit board assemblies. Adding to this challenge, compact peripheral component interface connectors can present additional solderability issues because of their beryllium copper base metal pins. Key Terms: Selective soldering, drop-jet fluxing, sustained preheating, flux migration, adjacent clearance, lead-to-hole aspect ratio, lead projection, thermal reliefs, gold embrittlement, solderability testing.
“The Ultimate Probing Machine”. Ultra Fast full Function Patented Double-sided, Closed Loop 22-probe System, All probes are Analog, Digital, Boundary Scan, and Vectorless Test enabled. Use it In-Line or manual operation with AOI capabilities. The
Contact Us Sales manager: Mac Xie Mobile: +8618020714662(WhatsApp) Email: at@mooreplc.com Skype: +8618020714662 Contact Us ✭Product Overview✭ Manufacturer Rockwell Automation Dimensions 17.5 x 14.5 x 13.7 cm (6.9 x 5.7 x 5.4 in.) Weight
Career Center | Burlington, Massachusetts USA | Clerical
DataCon, Inc. is seeking an experienced Cost Estimator with the ability to take charge in developing successful bid packages in response to our customer RFQs. We are located in Burlington, MA, renowned for providing external manufacturing services fo
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