MEV is a custom software development company that helps clients build amazing software products. It doesn't matter if you're a pre-seed startup or well-established enterprise - MEV works with you to let you get to your goals using
New Equipment | Rework & Repair Equipment
BGA Rework Stations from the BGA Experts with over 25 years rework process experience and customer support! For high volume BGA Rework on even the largest computer and networking boards! The model SV560A has a high resolution optical system for pla
1.Suitable for low and middle viscosity materials 2.The material of valve's body has been hardened. 3.The latest technology of diaphragm has been applied. 4.The material of the parts touched fluid is corrosion-resistant and flexible. 5.The liqui
Electronics Forum | Thu Jun 02 15:56:42 EDT 2005 | jimmygam
run the board thru both backward and sideways and see what happens
Electronics Forum | Fri Mar 22 04:43:59 EDT 2019 | andyharrold
One step forward, two backwards. Seems these have been discontinued.
Used SMT Equipment | General Purpose Test & Measurement
Main features： • 90 GHz bandwidth• Custom host for optical, electrical and TDR/S parameter analysis• Ultra-low jitter of 100 fs RMS and down to 250 μV ensures fast, accurate and consistent jitter measurements• Access to over 50 built-in standard te
Used SMT Equipment | General Purpose Test & Measurement
100 GHz Customize the mainframe for optical, electrical, and TDR/S-parameter analysis Perform fast, accurate, and compliant jitter measurements with ultra-low jitter of 100 fs RMS and noise as low as 250 µV Get more than 50 built-in standards-base
Industry News | 2013-05-21 22:12:09.0
Based on its recent analysis of the surface mount technology (SMT) reflow soldering equipment market, Frost & Sullivan recognizes Heller Industries, Inc. with the 2013 Global Frost & Sullivan Award for Market Share Leadership.
Industry News | 2008-04-22 20:31:31.0
MINNEAPOLIS, MN � The SMTA is pleased to announce the return of their renowned Lead-Free Symposium, scheduled to run during their annual conference, SMTA International, at Disney�s Coronado Springs Resort and Convention Center in Orlando, Florida, August 17-21. Being held for the 8th consecutive year, some of the industry�s finest Lead-Free research is presented at this symposium.
_1.jpg)
Parts & Supplies | Pick and Place/Feeders
J90650166C AS Forming Assembly (8mm Feeder) J9055159C NOZZLE CN140 ASSY [J9055159C] J9060014B CONVEYOR PACK BOARD ASSY [30-CONV3-IO BOA J6708018A FILTER ELEMENT [AF40P-060S] J9058076A FILTER ASSY J7154098B HARNESS PLATE-X [J7154098B] J4809054A
Parts & Supplies | Pick and Place/Feeders
Samsung SM421 J6708020A VACUUM PART VKM-SET Other Samsung parts: J9080328B Z2 MOTOR CABLE[CP60HP-TH-HD-01-02] J7066239A REEL POST 24[SM1-MF24-016-04] J7265173A REMO TAKE UP REEL 24[SM1-MF24-041-01] J7066253A REMO VINYL RING 24[SM1-MF24-041-02]
Technical Library | 2012-06-21 23:06:06.0
First published in the 2012 IPC APEX EXPO technical conference proceedings. Most high reliability electronic equipment producers continue to manufacture and support tin-lead (SnPb) electronic products despite the increasing trend for design and conversion
Technical Library | 2015-11-19 18:15:07.0
The move to lead free (Pb-free) electronics by the commercial industry has resulted in an increasing number of ball grid array components (BGAs) which are only available with Pb-free solder balls. The reliability of these devices is not well established when assembled using a standard tin-lead (SnPb) solder paste and reflow profile, known as a backward compatible process. Previous studies in processing mixed alloy solder joints have demonstrated the importance of using a reflow temperature high enough to achieve complete mixing of the SnPb solder paste with the Pb-free solder ball. Research has indicated that complete mixing can occur below the melting point of the Pb-free alloy and is dependent on a number of factors including solder ball composition, solder ball to solder paste ratio, and peak reflow times and temperatures. Increasing the lead content in the system enables full mixing of the solder joint with a reduced peak reflow temperature, however, previous research is conflicting regarding the effect that lead percentage has on solder joint reliability in this mixed alloy solder joint.
ALPHA® TETRABOND™ is the culmination of "frameless" stencil development; an elegantly simple system designed to enhance the rigidity of the foil, making safe mounting and demounting an easier proposition. Innovatively encompassed in a thin, one piece
A sneak peek at SparkFun's new LEADSMT Stencil Printer Tags: Business Talent: Robert Hunke
Career Center | Rochester, New York USA | Engineering
I have done my undergraduate studies in Mechanical Engineering. I am pursuing my Master's Program in Electronics Packaging. I am currently working as a Research Assistant for RIT-CEMA (Center for Electronics Manufacturing and Assembly). My research
Career Center | Muzzaffarnagar, India | Production
Complete programming of Pick & Place as per BOM. Working with both low & high Profile solder Paste, and Glue. Accurate Placement of all SMT Component like Chip, SOT, SOD, QFP, Tantalum Capacitor & etc. Familiar with the critical problem in process
The Relationship between Backward Compatible Assembly and Microstructure on the Thermal Fatigue Reliability of an Extremely Large Ball Grid Array SMTnet Express June 22, 2012, Subscribers: 25283, Members: Companies: 8903, Users: 33267
HALT Testing of Backward Soldered BGAs on a Military Product Online Version SMTnet Express, December 10, 2015, Subscribers: 23,782, Members: Companies: 14,767, Users: 39,402 Packaging Technology and Design Challenge for Fine Pitch Micro-Bump Cu
Qinyi Electronics Co.,Ltd | https://www.qy-smt.com/shop/x01l00110-pallet-parts-chuck-positioning-jig-216994?page=179&order=list_price+asc
PANASONIC cut claw forward/backward positioning stoper jig X01L00110 | QYSMT × Home About US ABOUT US FAQ SMT spare parts SMT Surplus equipments SMT peripheral equipments News Contact US 0 0 Sign in Contact Us Products Pallet parts chuck positioning jig Public Pricelist Public
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/adhesive-dispensing-systems/products/accessories-kits-and-auxiliary-equipment/easyon-gun-technology
. Modules fit existing Nordson guns (backward compatibility). Achieve better performance with a simpler, more robust design. Reduce inventory and costs
