Industry Directory: bga bridge (5)

Beau Tech

Beau Tech

Industry Directory | Manufacturer

A US manufacturer of quality hand tools for those engaged in the repair, rework, R & D, testing, and assembly of electronic components and printed circuit boards from Through Hole to 2Mil Pitch Surface Mount.

InnerStep

Industry Directory | Manufacturer

pcb construction@testing using surface mount and through hole components.

New SMT Equipment: bga bridge (11)

PCB Rework, PCB Repair Services

PCB Rework, PCB Repair Services

New Equipment | Rework & Repair Services

On the cutting edge of technology, we offer a full line of high tech services to assist contract manufacturer's and  product  research and developers.  Specializing in quick turn around times to help get your product to market on time. Training Serv

Precision PCB Services, Inc

Solder Training and Solder Certification Courses

New Equipment | Education/Training

Solder Training and Solder Certification Courses Taught in Accordance With IPC Soldering Guidelines. We offer a variety of customized courses set up specifically for our customers requirements.  An example would be our combination type certificate t

Precision PCB Services, Inc

Electronics Forum: bga bridge (157)

bga warp

Electronics Forum | Thu Sep 05 03:23:14 EDT 2002 | manic

Hi, I encountered a problem with pbga. One edge either warp downwards or upwards creating bridging or open. This pbga have fr4 at the bottom (compound molding at the top). The fr4 is bigger than the top compound by 3mm at each edge. Pls help. Than

BGA solder bridge

Electronics Forum | Mon Feb 28 23:07:04 EST 2011 | kemasta

It is random. By the way, this board pass thought wave process, (BGA is at the top), will that cause the older short issue?

Used SMT Equipment: bga bridge (9)

Panasonic  NPM module

Panasonic NPM module

Used SMT Equipment | SMT Equipment

Product Name :Panasoinc  NPM module Product number: two modules NPM Detailed product introduction 2D inspection head function of NPM tape coating machine: 1, NPM check head resolution: 9 m 2, NPM check head vision: 21.1 * 17.6mm 3, check proc

DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD

Panasonic original NPM module

Panasonic original NPM module

Used SMT Equipment | SMT Equipment

Product Name :Panasoinc  NPM module Product number: two modules NPM Detailed product introduction 2D inspection head function of NPM tape coating machine: 1, NPM check head resolution: 9 m 2, NPM check head vision: 21.1 * 17.6mm 3, check proc

DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD

Industry News: bga bridge (43)

Ball Grid Array (BGA) Package

Industry News | 2018-12-08 03:31:22.0

Ball Grid Array (BGA) Package

Flason Electronic Co.,limited

Five IPC APEX EXPO Exhibiting Companies Earn 2019 Innovation Awards Winners push boundaries of technology with innovative product submissions

Industry News | 2019-01-12 07:42:28.0

IPC – Association Connecting Electronics Industries® announces the winners of the IPC APEX EXPO 2019 Innovation Awards, a celebration of the innovators and forward thinkers who are changing the technological landscape of the electronics industry.

Association Connecting Electronics Industries (IPC)

Parts & Supplies: bga bridge (12)

Juki WS0820002KN SPRING WASHER M8

Parts & Supplies | Pick and Place/Feeders

> FUJINTAI TECHNOLOGY CO.,LTD JUKI E9572729CA0 LA (L) CABLE ASM. www.fujintai.com JUKI E95737290A0 MTC I/F(L) CABLE ASM. FUJINTAI TECHNOLOGY CO.,LTD JUKI E95738550A0 DISPESE SV ASM www.fujintai.com JUKI E95747210A0 BAD MARK SENSOR CABLE ASM. FUJI

FUJINTAI TECHNOLOGY CO.,LIMITED

Juki 40000479 UPS BRAKET

Parts & Supplies | Pick and Place/Feeders

> FUJINTAI TECHNOLOGY CO.,LTD JUKI E9572729CA0 LA (L) CABLE ASM. www.fujintai.com JUKI E95737290A0 MTC I/F(L) CABLE ASM. FUJINTAI TECHNOLOGY CO.,LTD JUKI E95738550A0 DISPESE SV ASM www.fujintai.com JUKI E95747210A0 BAD MARK SENSOR CABLE ASM. FUJI

FUJINTAI TECHNOLOGY CO.,LIMITED

Technical Library: bga bridge (1)

Compatibility of Cleaning Agents With Nano-Coated Stencils

Technical Library | 2013-03-12 13:25:18.0

High density and miniaturized circuit assemblies challenge the solder paste printing process. The use of small components such as 0201, 01005 and μBGA devices require good paste release to prevent solder paste bridging and misalignment. When placing these miniaturized components, taller paste deposits are often required. To improve solder paste deposition, a nano-coating is applied to laser cut stencils to improve transfer efficiency. One concern is the compatibility of the nano-coating with cleaning agents used in understencil wipe and stencil cleaning. The purpose of this research is to test the chemical compatibility of common cleaning agents used in understencil wipe and stencil cleaning processes.Compatibility of Cleaning Agents With Nano-Coated Stencils

KYZEN Corporation

Videos: bga bridge (12)

SMTA International Exhibition 2015 - Electronics Manufacturing

SMTA International Exhibition 2015 - Electronics Manufacturing

Videos

SMTA International Electronics Exhibition Tuesday, September 29: 9am-5pm Wednesday, September 30: 9am-4pm Donald Stephens Convention Center Rosemont, IL See More Equipment & Technology Than Ever Before! Many of the 160 exhibiting companies will bri

Surface Mount Technology Association (SMTA)

NF120(200 nano resolution) X-ray Inspection System

NF120(200 nano resolution) X-ray Inspection System

Videos

#Xray#Inspection#SEC Nano-focus Tube of 200 nano resolution which is specialized for sub-micron defects of Semiconductor Packaging, Wafer Level Packaging(WLP). -Non-destructive Analysis System -High-Resolution Image with Dual Type CTs -Application

SEC

Training Courses: bga bridge (3)

BGA Inspection, Rework and Repair Course

Training Courses | | | PCB Inspection Courses

The PCB inspection courses focus on improving PCB yield and reliability through validation and detection of defects on electronics assemblies.

ACI Technologies, Inc.

IPC-7711/7721 Specialist (CIS) Certification Training Course

Training Courses | | | IPC-7711/7721 Specialist (CIS)

The Certified IPC-7711/7721 Specialist (CIS) training focuses on rework of electronic assemblies and repair and modification of printed boards and electronic assemblies.

Justice Electronic Training Services

Events Calendar: bga bridge (1)

SMTA International 2020 Conference & Exhibition

Events Calendar | Sun Sep 27 00:00:00 EDT 2020 - Thu Oct 01 00:00:00 EDT 2020 | Rosemont, Illinois USA

SMTA International 2020 Conference & Exhibition

Surface Mount Technology Association (SMTA)

Career Center - Resumes: bga bridge (3)

SMT QUALITY ENGINEER

Career Center | INDIA, India | Engineering,Quality Control

BACHELOR OF ENGINEERING IN ELECTRICAL AND ELECTRONICS ENGINEERING EXPERIENCE IN SURFACE MOUNT MANUFACTURING TECHNOLOGY.

Equipment Maintenance Technician

Career Center | San Isidro Cabuyao Laguna, Philippines | Engineering,Maintenance,Production,Technical Support

                                                 Duties & Responsibilities (Equipment Technician):  Production line support, conduct setup and troubleshooting on handled machines such as COB and backend equipment.  Conduct Preventive maintenance

Express Newsletter: bga bridge (472)

SMT Express, Issue No. 3 - from SMTnet.com

SMT Express, Issue No. 3 - from SMTnet.com Volume 1, Issue No. 3 Wednesday, August 18, 1999 Featured Article Return to Previous Page BGA REWORK Earl Moon Proof Of Design (POD) PRE OPERATIONAL REQUIREMENTS The following requirements shall

Partner Websites: bga bridge (5)

Buy Equipment - Lewis and Clark, Inc.

Lewis & Clark | https://www.lewis-clark.com/buy-equipment/

+ Paste Inspection and Bridge Detection Quik-Tool Compliant Tooling (4 x 18″ modules) Ergo Arm Monitor Integrated Stencil Adapter (23″ to 29″ Stencil Frames) Power: 110/240V ~ 50/60Hz ~ Single Phase ~ 1500 Watts Max Condition

Lewis & Clark

Vacuum Fluxless Reflow Technology for Fine Pitch First Level Interconnect Bumping Applications

Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/06/Vacuum-Fluxless-Reflow-Technology-for-Fine-Pitch.pdf

. Embedded Multi-die Interconnect Bridge (EMIB) technology is an advanced, cost-effective approach to in-package high density interconnect of heterogeneous chips, providing high density I/O, and controlled electrical interconnect paths between

Heller Industries Inc.


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