Industry Directory | Consultant / Service Provider / Equipment Dealer / Broker / Auctions / Manufacturer's Representative / Training Provider
Products, services, training & consulting for the assembly, rework & repair of electronic assemblies. BGA process experts. Manufacturers Rep, Distributor & Service Provider for Seamark/Zhuomao and Shuttle Star BGA Rework Stations.
Industry Directory | Manufacturer
Shuttle Star Technology designs and builds advanced off-line 2.5D&3D x-ray inspection systems for solder joint and final assembly test inspection in SMT&EMS. It uses world-class X-ray techniques with advanced defect detection.
New Equipment | Rework & Repair Services
In order to maintain the highest level of quality in electronics, most manufacturers will employ some form of process control methodology to identify faulty conditions or potential quality variances. The feedback provided by such a system must natur
New Equipment | Test Equipment
SMT Offline X-ray X-7200 Products Introduction | I.C.T Group www.smt11.com www.smtfactory.com Full SMT Factory Solution Partner SMT Offline X-ray X-7200 Introduce: I.C.T X-7200 inspection machine has a wide range of applications. It is commonly use
Electronics Forum | Tue Sep 25 12:00:21 EDT 2012 | kkay
Thanks for fixing the picture. What you are looking at is a pad that the part was pried off of after reflow. The right side of the pad shows a good solder joint and underneath the part is where the voids occur. The outter solder joints show no voids
Electronics Forum | Thu Jan 02 22:09:15 EST 2020 | Zack
Hello, Can you give more detail on LGA parts in question? is 50 mm x 50 mm is overall size of the parts? What about pad pitch and how big is the pads individually? I assume that 50x50 mm is overall size. How about the stencil opening for the LGA pad
Used SMT Equipment | X-Ray Inspection
we are looking for wth following options: Automatic microfocus X-ray inspection system including: - 160 kV proprietary microfocus X-ray source (open design) with “unlimited” lifetime, including demountable collimator for enhanced image qualit
Used SMT Equipment | X-Ray Inspection
• Installed new in 2006 • Single Owner and used in a Lab Environment • Maintained by OEM and under OEM ASC, throughout original ownership • Currently offline and immediately available Tube Type: 160kv NF – Transmissive type (open tube ~ maintain
Industry News | 2003-03-11 08:16:17.0
Lightspeed has already shipped its first product, and has set up production in a new building with up to date facilities and equipment.
Industry News | 2015-11-12 20:58:32.0
MIRTEC and YXLON jointly received a 2015 Global Technology Award in the category of Software – Production for the new SmartLoop yield improvement system. The award was presented to the companies during a ceremony on Tuesday, Nov. 10, 2015 that took place at the Messe München exhibition center in Munich, Germany during Productronica.
.jpg)
Parts & Supplies | Assembly Accessories
12MM Calibration Tape .12MM Calibration Tape 20 Inch Folding Bike Ravel Case 20 Inch Folding Bike ravel Case 4*4.1200pcs/bag M0604 8MM Calibration Tape .8MM Calibration Tape 90 degree drive set 90 degree drive set A2E BGA Rework Station Temp Con
Technical Library | 2023-01-17 17:19:44.0
A test program was developed to evaluate the effectiveness of vacuum reflow processing on solder joint voiding and subsequent thermal cycling performance. Area array package test vehicles were assembled using conventional reflow processing and a solder paste that generated substantial void content in the solder joints. Half of the population of test vehicles then were re-processed (reflowed) using vacuum reflow. Transmission x-ray inspection showed a significant reduction in solder voiding after vacuum processing. The solder attachment reliability of the conventional and vacuum reflowed test vehicles was characterized and compared using two different accelerated thermal cycling profiles. The thermal cycling results are discussed in terms of the general impact of voiding on solder thermal fatigue reliability, results from the open literature, and the evolving industry standards for solder voiding. Recommendations are made for further work based on other void reduction methods and additional reliability studies.
Technical Library | 2023-01-17 17:12:33.0
Reflowed indium metal has for decades been the standard for solder thermal interface materials (solder TIMs or sTIMs) in most high-performance computing (HPC) TIM1 applications. The IEEE Heterogeneous Integration Thermal roadmap states that new thermal interface materials solutions must provide a path to the successful application of increased total-package die areas up to 100cm2. While GPU architectures are relatively isothermal during usage, CPU hotspots in complex heterogeneously-integrated modules will need to be able to handle heat flux hotspots up to 1000W/cm2 within the next two years. Indium and its alloys are used as reflowed solder thermal interface materials in both CPU and GPU "die to lid/heat spreader" (TIM1) applications. Their high bulk thermal conductivity and proven long-term reliability suit them well for extreme thermomechanical stresses. Voiding is the most important failure mode and has been studied by x-ray. The effects of surface pretreatment, pressure during reflow, solder flux type/fluxless processing, and preform design parameters, such as alloy type, are also examined. The paper includes data on both vacuum and pressure (autoclave) reflow of sTIMs, which is becoming necessary to meet upcoming requirements for ultralow voiding in some instances.
ACI Technologies Inc. (ACI) is a scientific research corporation dedicated to the advancement of electronics manufacturing processes and materials for The Department of Defense and industry. This video provides an overview of our commercial service
SMT PCBA X-ray Machine ETA-7900 If you could not find any similar items you want, you may send some photos to us. because our catalog and website haven't included all of our products. smt x ray,smt x ray machine,x-ray inspection machine,x-ray d
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Events Calendar | Tue Feb 12 00:00:00 EST 2019 - Tue Feb 12 00:00:00 EST 2019 | ,
Webinar: BGA and Area Array Process Defects - Causes & Cures
Events Calendar | Mon Apr 23 00:00:00 EDT 2018 - Thu Apr 26 00:00:00 EDT 2018 | Shanghai, China
SMTA China East Conference 2018
Career Center | Seymour, Connecticut USA | Engineering
Develop and manage SMT assembly and soldering processes and associated staff in medium volume/high-mix printed circuit board assembly operation for complex quality class 2/3 assemblies. DUTIES AND RESPONSIBILITIES: Plan and develop processes a
Career Center | Bangor, Maine USA | Engineering
Talent Acquisition Resources, Inc. is a boutique executive search firm that assisting a Client in the Bangor, Maine area in filling an SMT Process Engineer. Responsibilities � Sets up systems to monitor and report quality processes, using SPC to a
Career Center | , Israel | Engineering,Maintenance,Technical Support
I was born on June , 1972 in Khmelnitsky city , Ukraine . I am male. From 1979 to 1987 I was studying at secondary school #7, having finished which I entered the Technical College of Khmelnitsky in specialty Machine Tools with Computer Numeric Contr
Career Center | , California | Quality Control
Tammy T Vo P.O. Box 2213 (714) 254-5073 E-mail: nhutamvo@yahoo.com Position of Interest Senior Quality Inspector Aerospace Manufacturing. / Electronic PCBA/Advanced coating technologies Profile of Qualifications 12 years of experience wo
SMT Express, Issue No. 3 - from SMTnet.com Volume 1, Issue No. 3 Wednesday, August 18, 1999 Featured Article Return to Front Page BGA REWORK Earl Moon Proof Of Design (POD) COMPARE PART SQUARENESS TO BOARD'S SILK-SCREEN OR TRACES A part
SMTnet Express, October 3, 2018, Subscribers: 31,373, Companies: 11,056, Users: 25,258 Fill the Void II: An Investigation into Methods of Reducing Voiding Tony Lentz - FCT Assembly , Patty Chonis, JB Byers - A-Tek Systems Voids in solder joints
Lewis & Clark | http://www.lewis-clark.com/product-tag/x-ray-2/
|x X-ray System- 2005 Make: GE Model: Nanome|x Vintage: 2005 Operating System: Windows 2000 Details: BGA Analysis Wire Sweep Calculation Voiding Calculation Automatic Positioning Control 160kV Nanofocus X-ray Tube OVHM- Oblique View at Highest Magnification Rotary Table-Rotates 360
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/Vacuum-Void-Reduction-Reflow.pdf
processing. Cross sectional views of the voiding are shown in the optical photomicrographs in Figure 9. Many of the voids observed in the cross-sectional analysis exceed the IPC-JSTD-001 BGA maximum void criteria of 30% of the X-ray image area [23]. This
