Electronics Forum | Tue Nov 27 08:47:24 EST 2007 | ratsalad
The letter below was dated December 13, 2006 from Kester's Senior Market Development Engineer. I guess since then they have moved production back to Mexico. We no longer use EM907 as our primary Pb-free paste so I haven't seen any containers in a w
Industry News | 2009-03-05 15:12:58.0
ITASCA, IL � March 2009 � Kester is proud to announce that Peter Biocca and David Scheiner will hold a technical session titled �PCB Metalization� at the upcoming APEX Conference and Exhibition. Biocca, Kester's Senior Market Development Engineer, will be the moderator at the conference, which is scheduled to take place on Wednesday, April 1, from 10:15�11:45 a.m. in the South Pacific room.
Industry News | 2010-10-04 17:03:39.0
Kester announces that Peter Biocca, Senior Market Development Engineer, will Co-Chair Session PRC2, titled “Strategies for Optimizing AOI and X-Ray Inspection” at the upcoming SMTA International, scheduled to take place October 24 - 28, 2010 at the Walt Disney World Swan and Dolphin Resort in Orlando, FL. The session will take place Wednesday, October 27, 2010 from 10:30 a.m.-12 p.m. in room Europe 1.
Technical Library | 2008-01-03 17:50:51.0
Lead-free SMT can be achieved reliably if several process requirements are implemented carefully. Some of the variables to account for are listed below. The most common alloys used in lead-free SMT are tin-silver-copper alloys; these alloys all have a meting range between 217- 220°C. These alloys all melt at higher temperatures than traditional leaded solders such as the 63/37which has a melting point of 183 °C.
Technical Library | 2009-01-15 00:42:58.0
Tin-silver-copper has received much publicity in recent years as the lead-free solder of choice. SAC305 was endorsed by the IPC Solder Value Product Council in the United States as the preferred option for SMT assembly; most assemblers have transitioned to this alloy for their solder paste requirements. The SAC305 alloy due to its 3.0% content of silver is expensive when compared to traditional 63/37 for this reason many wave assemblers are opting for less costly options such as tin-copper based solders for their wave, selective and dip tinning operations.
Developing a Reliable Lead-free SMT Assembly Process Developing a Reliable Lead-free SMT Assembly Process What are the key process requirements to achieve reliable lead-free SMT assembly? Lead-free SMT can be achieved reliably if several
