Electronics Forum | Fri Apr 16 08:20:58 EDT 2004 | Bob L.
We've seen problems with BGA balls breaking at in-circuit test. I did some bend testing and found that our large BGA's can handle amazing stresses at low strain rates but we get brittle fractures at high strain rates, especially with Ni/Au surface f
Electronics Forum | Tue Nov 10 07:35:04 EST 2009 | scottp
Step 1 is to find out what kind of opens you're getting through a cross-section or die & pry. Are they head in pillow, brittle fracture at the intermetallic, bulk solder cracks, ball separation from interposer? Without some basic failure analysis a
Industry News | 2011-02-24 20:35:03.0
The SMTA is pleased to announce the program for the 2011 International Conference on Soldering and Reliability being held May 3-6 in Toronto, Ontario, Canada.
Industry News | 2025-03-17 19:03:37.0
SHENMAO America, Inc. continues to advance soldering solutions with its PF925 High-Reliability Solder, designed to improve mechanical strength, thermal stress resistance, and defect prevention in high-reliability electronics manufacturing. The PF925 alloy enhances solder joint integrity through dispersion strengthening, solid solution strengthening, and inhibition of brittle intermetallic compound (IMC) growth, ensuring long-term durability in demanding applications.
SMTnet Express, January 27, 2022, Subscribers: 25,985, Companies: 11,506, Users: 27,032 Fracture Toughness Analysis of Epoxy-Recycled Rubber-Based Composite Reinforced with Graphene Nanoplatelets for Structural Applications
| https://www.eptac.com/faqs/ask-helena-leo/ask/problems-with-pcb-micro-voiding
. The true root cause is still under investigation, but a Kirkendall voiding mechanism may play a part. These voids can affect solder joint reliability, particularly in instances when brittle fracture is initiated within the IMC during drop or mechanical hock to the solder joint
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/pan_APEX06.pdf
), “Transitioning to Lead-free Assemblies,” Printed Circuit Design and Manufracture, March 2005, pp. 17-23. Newman, K., “BGA Brittle Fracture Alternative Solder Joint Integrity Test Methods,” Proceedings of IEEE/ECTC the 55th Electronic Components and Technology
