Precision Engineered Ceramics, Inc. produces precision machined ceramic spares for semiconductor wafer processing equipment. In addition, we offer fast delivery of complex geometry ceramic components made from high purity aluminum oxide (alumina).
Industry Directory | Manufacturer
Porous ceramic vacuum chuck table or Polishing Chuck table supplied to semiconductor industry for silicon wafer dicing or finishing purposes. This product is an uniform compact frame, high strength, g
30KV 151 150PF Radial Lead High Voltage Ceramic Capacitor Product Name:30KV High Voltage Ceramic Disc Capacitor Series:CT81 Operating Temperature Range°C:-30~+85°C Working Voltage Range:30KVDC Capacitance Range:100PF~10000PF High Voltage Cera
30KV 102 1000PF High Voltage Ceramic Capacitor Product Name:30KV High Voltage Ceramic Disc Capacitor Series:CT81 Operating Temperature Range°C:-30~+85°C Working Voltage Range:30KVDC Capacitance Range:100PF~10000PF High Voltage Ceramic Disc Ca
Electronics Forum | Fri May 25 08:06:19 EDT 2007 | davef
Soldering PTFE boards * Exposure to the high temperatures needed for solder reflow poses no problem of loss of peel strength since the exposure times are relatively short. * There are many different types of PTFE based products that may perform diff
Electronics Forum | Fri Sep 09 07:55:08 EDT 2005 | davef
This pattern indicates flex cracking due to excessive bending of the board or fixture after soldering. Ceramic is strong in compression, but weak in tension. When bending causes damaged parts, look at: * Board flexes, ceramic is strong in compressio
Industry News | 2003-04-15 08:57:18.0
First Implementation of the Package Platform Delivers 50-percent Cost, 60-percent Height, and 75-percent Area Reductions over Conventional RF Module Technologies
Industry News | 2003-07-10 08:36:25.0
To execute this strategic plan, KEMET is reorganizing its operations around the world.
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Parts & Supplies | Pick and Place/Feeders
NXT nozzle can be divided into a variety of various models, a variety of styles, a variety of specifications. Commercially available nozzle has: NXT original nozzle, NXT imitation nozzle, NXT three generations nozzle, NXT generation nozzle, NXT M
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Parts & Supplies | Pick and Place/Feeders
Product Description NXT nozzle can be divided into a variety of various models, a variety of styles, a variety of specifications. Commercially available nozzle has: NXT original nozzle, NXT imitation nozzle, NXT three generations nozzl
Technical Library | 2016-01-12 11:03:35.0
With the pitch size of interconnect getting finer and finer, the bonding strength between flexible and rigid (e.g. PCB, ceramic) substrates becomes a serious issue because it is not strong enough to meet the customer’s requirement. Capillary underfill has been used to enhance the bonding strength between flexible and rigid substrates, but the enhancement is very limited, particularly for high temperature application. The bonding strength of underfilled flexible/rigid interconnect is dramatically decreased after being used at 180◦C, and the interconnects are weakened by the internal stress caused by the expansion of underfill at high temperatures. In order to resolve reliability issues of the interconnect between flexible/rigid substrates, solder joint encapsulant was implemented into the thermal compression bonding process, which was used to manufacture the interconnect between flexible/rigid substrates. Compared to the traditional process, the strength of the interconnect was doubled and the reliability was significantly improved in high temperature application.
Technical Library | 2023-08-04 15:27:30.0
A designed experiment evaluated the influence of several variables on appearance and strength of Pb-free solder joints. Components, with leads finished with nickel-palladium-gold (NiPdAu), were used from Texas Instruments (TI) and two other integrated circuit suppliers. Pb-free solder paste used was tin-silver-copper (SnAgCu) alloy. Variables were printed wiring board (PWB) pad size/stencil aperture (the pad finish was consistent; electrolysis Ni/immersion Au), reflow atmosphere, reflow temperature, Pd thickness in the NiPdAu finish, and thermal aging. Height of solder wetting to component lead sides was measured for both ceramic plate and PWB soldering. A third response was solder joint strength; a "lead pull" test determined the maximum force needed to pull the component lead from the PWB. This paper presents a statistical analysis of the designed experiment. Reflow atmosphere and pad size/stencil aperture have the greatest contribution to the height of lead side wetting. Reflow temperature, palladium thickness, and preconditioning had very little impact on side-wetting height. For lead pull, variance in the data was relatively small and the factors tested had little impact.
Solution for stress free depanelization Fixture-based highly efficient dust vacuum system Clean and precise depanelization for densely populated PCBs Advanced image-processing software offers point-and-click operation for programming router paths
355nm 10W /15W High-Precision CCD FPC/PCB UV Laser Cutting Machine With Perfect CAM interface, it supports the mainstream of the drilling and milling file format; man-machine interface is friendly; optical path is sealed, and it also has stable an
Career Center | , Maryland USA | Engineering
Late stage start-up company, well into commercialization, that develops and manufactures products to precisely control the instantaneous release of heat energy for reaction initiation and joining applications. Building from its strengths in material
Career Center | Stoneham, Massachusetts | Engineering,Production,Research and Development,Technical Support
Warren P. Pumyea 8 Beacon Street Stoneham, Massachusetts 02180 Cell #: 978-821-7335 * E-mail: warren@pumyea.com http://www.pumyea.com/Process_Manufacturing_Engineer.doc Objective: Seeking a position as an engineer or related discipline whic
ORION Industries | http://orionindustries.com/pdfs/300lse.pdf
Adhesive 300LSE is a hi-strength acrylic adhesive that provides a very high bond strength to most surfaces. • Excellent bond to low surface energy plastics, such as polypropylene and powder coatings
GPD Global | https://www.gpd-global.com/co_website/features-needlecalibration-max.php
Nozzles Real Time Process Control (FPC) Lead Formers Lead Formers Selection Axial Lead Former Radial Lead Former Peel Force Tester Peel Back Force Tester Applications APPLICATIONS OVERVIEW Conductive Adhesive Non-Conductive Adhesive Dam
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