Industry Directory | Manufacturer
Wafer Dicing, Die Attach, Wirebond, Glob Top, Semiconductor Packaging, RF Assemblies, SMT, PCB Assembly, Chip-on-Board, Multi-Chip Modules, Die Stacking, Flipchip, Stud Bumping, Prototyping, Process Development, Proof of Concept.
Industry Directory | Manufacturer
Manufactures and Provides: thermal interface materials (TIM) including insulated-metal-substrates, gap-filling compressible phase-change pads, thermal gels-greases,(EMI/RFI) mitigation conductive gaskets and other products.
Customer demand for highly sophisticated and ever smaller devices has made semiconductor packaging a vital contributor to system performance. As integrated circuits have become faster and more complex, the cost and performance of the interconnect bet
Aluminum Wirebonding Gold Wirebonding Gold Ribbonbonding Wafer Bumping Flip Chip Packaging BGA LGA SMT Direct Chip Attach System In Package Hybrid MCM Stacked Die 3D Packaging 3D Memory Rad Hard RF Packaging
Electronics Forum | Thu Dec 06 23:34:25 EST 2001 | Beny
Pls. help. I�ve problem with non-wetting defect at capacitor termination. I have faced this problem at the 2 kinds of termination. One is chip capacitor 0603 that its outer termination surface composed with 100 Sn (Lead free) and another one is Sta
Electronics Forum | Mon May 15 18:05:11 EDT 2000 | Ashok Dhawan
Busko I could not find anything related to chip stacking in IPC-7711. I guess you meant that some changes will be coming. Probably , a task group is working on that. Can you fax or e-mail that info so that I can have access to that info ? I will ap
Used SMT Equipment | Flexible Mounters
Product Name: Samsung CP40L multi-function chip mounter Product number: CP40L Detailed product introduction Samsung CP40L multi-function chip mounter Mounting head: 3 On the way: linear laser (Ji Guangtou) Substrate size: 460*400*4.2mm Min:50*
Used SMT Equipment | SMT Equipment
Product Name: Samsung CP40L multi-function chip mounter Product number: CP40L Detailed product introduction Samsung CP40L multi-function chip mounter Mounting head: 3 On the way: linear laser (Ji Guangtou) Substrate size: 460*400*4.2mm Min:50*
Industry News | 2003-05-30 08:26:20.0
The inventors of this module type and holders of the patent are chief technical officer Kenneth J. Kledzik and president Jason C. Engle, both of San Clemente, California.
Industry News | 2003-05-28 08:28:54.0
For June 2-4 (Mon. - Wed.)Design Automation Conference 2003
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Parts & Supplies | SMT Equipment
E28057150A0 IC BOX ASM. E2806715000 SPONGE B E2807715000 IC BOX B E2807729000 ROLLER GUIDE F (30) E2808729000 ROLLER GUIDE C E2811721000 CHIP BOX E2811725000 TIP BOX STAY E2812721000 CHIP BOX E2813729000 ROLLER GUIDE RM (30) E281470
Parts & Supplies | SMT Equipment
Original Smt spare parts JUKI 40113084 2070 2080 SAFETY CONTROL PCB JUKI Nozzle Specifications: Brand Name JUKI SAFETY PCB Part Number 40113084 Model Number Ensure Tested buy juki Guarantee 1 month usage for machine JUKI KE2070 KE2080 Se
Technical Library | 2014-02-27 15:30:20.0
Silicon dioxide is normally used as filler in underfill. The thermal conductivity of underfill is less than 1 w/mk, which is not able to meet the current flip chip application requirements such as 3D stacked multi-chips packaging. No matter which direction the heat will be dissipated through PCB or chip, the heat has to pass through the underfill in 3D stacked chips. Therefore the increase of thermal conductivity of underfill can significantly enhance the reliability of electronic devices, particularly in 3D package devices
Technical Library | 2008-02-26 15:02:19.0
More and more chip packages need multi-GHz RF structures to meet their performance targets. The ideal chip package needs to combine RF features with Digital features for these applications. They drive low-loss, controlled impedance transmission lines, flexibility in assigned signal and power layers, and clearances of various shapes in power layers. Building these features in a chip package is difficult without making the stack-up very thick or compromising the reliability of the product. In the present paper, we have designed and built a flip-chip package test vehicle (TV) to make new RF structures, using Z-axis interconnection (Zinterconnect) building blocks.
Hot Sale pcb Push-up stacker for chip mounter Assembly Line Product introduction: 1.This unit is used to send bare PCBs into SMT production line. 2.Stable and reliable PLC control system; 3.Easy to operate LED touch screen control interface; 4.U
Hot Sale pcb Push-up stacker for chip mounter Assembly Line Product introduction: 1.This equipment is used to collect bare PCBs at the end of SMT production line 2.Stable and reliable PLC control system; 3.Easy to operate LED touch screen control
Training Courses | | | PCB Design Courses
The PCB design courses teach students the process, techniques and tools needed to design layout of printed circuit boards.
Events Calendar | Mon Apr 23 00:00:00 EDT 2018 - Thu Apr 26 00:00:00 EDT 2018 | Shanghai, China
SMTA China East Conference 2018
Career Center | San Jose, California USA | Engineering,Research and Development
www.srqconsultants.com : for job reqs Type of job background: Design for Test (DFT), with ATE Test development experience, and an IC design generalist. Job Summary Must have +5 years industry experience combination in IC Design and ATE test. Som
Career Center | Phoenix, Arizona | Engineering,Management,Production,Quality Control,Research and Development,Sales/Marketing,Technical Support
• Highly motivated, solution oriented professional with proven record synergizing scientific, engineering, and business administration backgrounds to drive and sustain customer satisfaction and long term improvements. • Articulate communicator that a
Career Center | , District of Columbia | Engineering,Management,Production,Sales/Marketing
• Strong technical leadership and decision-making skills; strong verbal and written communication skills to provide clear, crisp direction for key issue resolution; and good team skills to facilitate cross-functional cross -site team effectiveness.
SMTnet Express, May 14, 2015, Subscribers: 22,738, Members: Companies: 14,345 , Users: 38,183 Reliability of Stacked Microvia Hardeep Heer, Ryan Wong; Firan Technology Group The Printed Circuit Board industry has seen a steady reduction in pitch
SMTnet Express, February 27, 2014, Subscribers: 22818, Members: Companies: 13775, Users: 35799 A Novel High Thermal Conductive Underfill For Flip Chip Appliation. Dr. Mary Liu and Dr. Wusheng Yin; YINCAE Advanced Materials, LLC. Silicon dioxide
Surface Mount Technology Association (SMTA) | https://www.smta.org/panpac/call_for_papers.cfm
& Posts MCM/SiP Advances Module Stacking Origami Flex Packages Package on Package (PoP) Shaped Circuits Thru Si Vias (TSV) Emerging Technologies Advanced Connectors Embedded Assembly (Passive & Active
ASCEN Technology | https://www.ascen.ltd/Video_Channel/PCB_conveyor_system/1081.html
> SMEMA port connect for PCB turn conveyor/PCB loader unloader ASCEN PCB laser marking conveyor|fiber laser marker machine PCB stacking unloader|PCB destacker
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