Qualification of boards and assemblies is the comparison of the board or assembly to an industry standard. Specifically, we qualify printed circuit boards to IPC-6012 – Qualification and Performance Specifications for Rigid Printed Boards and
Manufacture capability Layers: 1-16 layers Materials: CEM1, CEM3, Teflon, Rogers,FR-4, High Tg FR-4, Aluminum Base, Halogen Free Max. Board Size: 510*1200mm Material: RoHS Directive-compliant PCB thickness: 1.6 ±0.1mm Out Layer Copper Thickn
Electronics Forum | Fri Oct 08 17:12:31 EDT 1999 | Dave F
| Hi, | | Does anybody know what is the minimum gold plating thickness on the PCB goldfinger required by the industrial specifications - IPC, Bellcore, etc. Where can I find the information? Appreciate for the help! | | Thanks, | Tony | Hi Tony:
Electronics Forum | Fri Jul 11 02:42:40 EDT 2008 | aj
Thanks Dave, IPC-6012 states min at 0.05um. Has this been a update or is it for a different class? thanks, aj...
Industry News | 2011-02-21 18:15:25.0
Count On Tools Inc., a leading provider of precision components and SMT spare parts, now offers an expanded selection of Juki SMT Tooling Nozzles, including the 500 and 800 series nozzles in both base designs (gold/silver). The nozzle designs enable highly accurate, repeatable and optimized chip placement.
Industry News | 2022-10-28 05:41:25.0
In conjunction with Instrutec 2022 and the Estonian Electronics Industries Association, IPC hosted its popular IPC Hand Soldering Competition in Tallinn, Estonia October 12-14, 2022, welcoming 31 competitors from 14 European electronics companies.
Technical Library | 2014-11-06 16:43:24.0
This paper summarizes the results of recent investigations to examine the effect of electroless nickel process variations with respect to Pb-free (Sn-3.0Ag-0.5Cu) solder connections. These investigations included both ENIG and NiPd as surface finishes intended for second level interconnects in BGA applications. Process variations that are suspected to weaken solder joint reliability, including treatment time and pH, were used to achieve differences in nickel layer composition. Immersion gold deposits were also varied, but were directly dependent upon the plated nickel characteristics. In contrast to gold, different electroless palladium thicknesses were independently achieved by treatment time adjustments.
Technical Library | 2013-05-30 17:33:26.0
This paper covers the following topics: The Measurement Application, Measurement Requirements, Measurement Problems, Measurement Results, Reference Samples, Conclusions
2 sets of L255 led production line for LED non-wire strip light for more detailed information about machine, please view: http://www.smdmachine.com
Career Center | Erode, Tamilnadu India | Engineering
Professional Summary 3+ years of experience in the PCB CAM engineering Exposure to FRONTLINE GENESIS 2000 Having exposure in UCAM Exposure to Create, Array & Panelize it for manufacturability Experienced in Creating impedance cou
Career Center | Stoneham, Massachusetts | Engineering,Production,Research and Development,Technical Support
Warren P. Pumyea 8 Beacon Street Stoneham, Massachusetts 02180 Cell #: 978-821-7335 * E-mail: warren@pumyea.com http://www.pumyea.com/Process_Manufacturing_Engineer.doc Objective: Seeking a position as an engineer or related discipline whic
SMTnet Express, August 7, 2014, Subscribers: 23058, Members: Companies: 13975, Users: 36604 Gold Embrittlement In Lead-Free Solder. Craig Hillman, Nathan Blattau, Joelle Arnold, Thomas Johnston, Stephanie Gulbrandsen; DfR Solutions , Julie Silk
Imagineering, Inc. | https://www.pcbnet.com/blog/class-ii-vs-class-iii-inspection-standards-in-pcb-assembly/
It’s not uncommon to get questions about the different IPC class assembly inspection standards when it comes to PCB assembly . Most often, the first question is regarding the difference between the assembly processes of IPC Class 2 and Class 3
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/asymtek/your-process/video-library/emi-conductive-coating-solution-achieving-a-target-thickness-of-25-um
EMI Conductive Coating Solution - Achieving a Target Thickness of 25 µm | Nordson ASYMTEK ASYMTEK Products Corporate | Global Directory | Languages Division Only All of Nordson Fluid Dispensing Systems Jets
