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New Equipment | Industrial Automation
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Electronics Forum | Tue Nov 27 19:42:58 EST 2001 | mparker
Dave - will placing MELF's in SMT eliminate the original problem? Is the flux aggressive enough to clean mold release agents from the component manufacturer? Good point about LT reliability, just wondering what would happen if glue was eliminated fr
Electronics Forum | Tue Jun 02 14:32:58 EDT 1998 | Chris Fontaine
We have experienced poor adhesion of acrylic conformal coating to plastic bodied IC�s. The observed symptoms of this are a blistering or lifting of the coating at the surface of the component, although peel testing has revealed that this is not alwa
Industry News | 2011-09-23 22:31:43.0
Kyzen announces that Dr. Mike Bixenman will present “Compatibility of Cleaning Agents with Nano-Coated Stencils” at the upcoming SMTA International Conference & Exhibition
Industry News | 2021-01-26 04:57:21.0
Plasma surface treatment equipment is one of the most effective treatment processes for surface cleaning, activation and coating. It can be used to treat various materials, including plastic, metal or glass.
Technical Library | 2013-03-12 13:25:18.0
High density and miniaturized circuit assemblies challenge the solder paste printing process. The use of small components such as 0201, 01005 and μBGA devices require good paste release to prevent solder paste bridging and misalignment. When placing these miniaturized components, taller paste deposits are often required. To improve solder paste deposition, a nano-coating is applied to laser cut stencils to improve transfer efficiency. One concern is the compatibility of the nano-coating with cleaning agents used in understencil wipe and stencil cleaning. The purpose of this research is to test the chemical compatibility of common cleaning agents used in understencil wipe and stencil cleaning processes.Compatibility of Cleaning Agents With Nano-Coated Stencils
SMTnet Express, September 24, 2015, Subscribers: 23,507, Members: Companies: 14,658, Users: 39,014 Gold Stud Bump Flip Chip Bonding on Molded Interconnect Devices Dick Pang, Weifeng Liu, Anwar Mohammed, Elissa Mckay, Teresita Villavert and Murad
| https://www.smtfactory.com/What-are-the-working-principles-and-usage-skills-of-Full-auto-SMT-Stencil-Printer-id3506468.html
, the requirements for Full-auto SMT Stencil Printer are very high, the solder paste release effect is good, the printing process is relatively stable, and it is suitable for the printing of fine-pitch components
| http://www.thebranfordgroup.com/dnn3/Auction/TSLE0523.aspx
) Coordinate the removal of those purchased items to meet the time deadlines indicated on this page. 3) Submit an " Agent Release Authorization " form which will allow The Branford Group to release items to a third party contractor for shipping, crating or packing purposes
