Industry Directory | Manufacturer
The exclusive supplier of SIPAD Solid Solder Deposit in North America and the only SIPAD Solid Solder Deposit (SSD) coating service bureau in the world.
Welcome to the next generation in PWB test solutions. We combine an exceptional team of technology and applications experts with HIOKI's industry-leading systems to enhance your reliability and to speed up your product development process.
Ersa HOTFLOW 4/8 Reflow Oven Working width: 45-560 mm Process Length: 3,260 mm Length Heated: 1,525 mm Length Cooled: 1,735 mm Weight app. 1,100 kg Dimension: 3,905x1,410x1,350 mm Ersa HOTFLOW 4/8 Reflow Oven Ersa HOTFLOW 4/8 Reflow Oven High
This oven is used for electron production and maintain of SMT technique. The product adopts the far-infrared heating components and excellent sense temperature materials. Through the precise control of the microcomputer, make the temperature control
Electronics Forum | Mon Jan 19 14:54:38 EST 2004 | cyber_wolf
How did you come to the conclusion that you are having a cold joint problem. Just by appearance ? As Dave stated if you have any of the metals that he listed in the joints they will appear to be dull and grainy sometimes. But... Dave, I will have t
Electronics Forum | Tue May 30 13:50:40 EDT 2006 | Dragan
Hi, I ran into a problem and need a solution. It is a 3cm*4cm*1mm 2 layer PCB (6x6 panel) with a LQFP128 package Microcontroller, a resonator and 2 capacitors. What happens is: When i recieve the assembled pcbs from the assembly plant they wor
Industry News | 2018-10-18 09:02:41.0
How to Solder a Surface Mount Device to a PCB Pad
Industry News | 2018-10-18 08:17:09.0
How to Prevent Solder Joint Voiding and Cold Solder Defects during the SMT Reflow Process
Parts & Supplies | SPI / Solder Paste Inspection
Quick programming, friendly programming interface Multiple measurement methods True one-button measurement Eight-way motion button, one-click focus Adjustable scanning pitch Solder paste 3D simulation function Powerful SPC function MARK
Parts & Supplies | SMD Placement Machines
PANASERT / UNIVERSAL / DYNAPERT PARTS FOR SALE N434UQ04041 Tube BLKE01252 FUSE 5A 40833025 FUSE 1.5A 42453904 FUSE 5A 42453907 FUSE 1A 46347803 Relay 40525301 SHOCK ABSORBER KXF0DSSAA00 46849802 SENSOR 46347803 RELAY 47323702 PROX SWITCH PNP N
Technical Library | 2018-09-26 20:33:26.0
Bottom terminated components, or BTCs, have been rapidly incorporated into PCB designs because of their low cost, small footprint and overall reliability. The combination of leadless terminations with underside ground/thermal pads have presented a multitude of challenges to PCB assemblers, including tilting, poor solder fillet formation, difficult inspection and – most notably – center pad voiding. Voids in large SMT solder joints can be difficult to predict and control due to the variety of input variables that can influence their formation. Solder paste chemistries, PCB final finishes, and reflow profiles and atmospheres have all been scrutinized, and their effects well documented. Additionally, many of the published center pad voiding studies have focused on optimizing center pad footprint and stencil aperture designs. This study focuses on I/O pad stencil modifications rather than center pad modifications. It shows a no-cost, easily implemented I/O design guideline that can be deployed to consistently and repeatedly reduce void formation on BTC-style packages.
Technical Library | 2019-05-29 01:47:22.0
1.Vias near SMD pads: Solder can flow into the via after melted. As a result cold joint will appear in the end. Check the picture below. 2.Vias on SMD pads: Solder can flow into the via more easier after melted. Check the picture below. 3.Via opening without soldermask covered. When workers solder TH parts by hand, soldering iron can touch vias sometime, then tiny amounts molten solder will stay on vias. This can lead to electrical short easily. We recommend you make all vias tenting (covered by solder mask) if it is possible.
PCBNPI-Professional PCB Fab/PCB Assembly Service Provider From China
Lyra Reflow Oven is a soft soldering that realizes the mechanical and electrical connection between the solder ends of surface mount components or the pins and the printed board pads by remelting the solder paste pre-distributed on the printed board
I.C.T Provide SMT Production Line solutions with Automated Optical Inspection (AOI) AOI is short for Automated Optical Inspection, which is widely used in the electronics industry to check the appearance of PCBA assembly at the back end of the cir
Training Courses | | | IPC-7711/7721 Specialist (CIS)
The Certified IPC-7711/7721 Specialist (CIS) training focuses on rework of electronic assemblies and repair and modification of printed boards and electronic assemblies.
Training Courses | | | IPC-7711/7721 Trainer (CIT)
The Certified IPC-7711/7721 Trainer (CIT) courses recognize individuals as qualified trainers in the area of rework and repair of printed boards and electronic assemblies and prepares them to deliver Certified IPC-7711/7721 (CIS) training.
Events Calendar | Mon Apr 23 00:00:00 EDT 2018 - Thu Apr 26 00:00:00 EDT 2018 | Shanghai, China
SMTA China East Conference 2018
Career Center | Oakville, Ontario Canada | Production
Technicians / Technologists To help us continue setting the pace in a rapidly changing manufacturing environment, we need people to operate state of the art manufacturing equipment, perform failure analysis and quality inspection on a wide variety o
Career Center | Oakville, Ontario Canada | Engineering,Production,Quality Control
Technicians / Technologists To help us continue setting the pace in a rapidly changing manufacturing environment, we need people to operate state of the art manufacturing equipment, perform failure analysis and quality inspection on a wide variety
Career Center | , | Engineering,Sales/Marketing,Technical Support
Applications Engineer with over 20 years of combined Manufacturing/Field Service/Applications Engineering experience in the SMT industry.
Career Center | Reno, Nevada USA | Engineering,Maintenance,Production,Quality Control,Research and Development,Sales/Marketing,Technical Support
Extensive technical background including tenures providing robotics technology expertise to diverse national and international clients and supporting surface mount technologies for printed circuit board (PCB) manufacturing processes. Results-oriente
SMTnet Express, May 9, 2019, Subscribers: 31,902, Companies: 10,760, Users: 26,083 Cold Ball Pull Test Efficiency for the PCB Pad Cratering Validation with the Ultra Low Loss Dielectric Material Credits: iNEMI (International Electronics
PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/pad-to-pad-space-in-3pin-sofl_topic2836.html
. The pin pitch is between the Center of the Body and the center of the pin. You need to double to pin pitch to 0.35 mm. But I would also change the solder joint goals downward slightly
GPD Global | https://www.gpd-global.com/lead-free-solder-paste-dispensing.php
Lead Free Solder Paste Dispensing, Leaded Solder Paste Dispensing Home Products Fluid Dispensing Equipment High Precision Dispenser - MAX Series Large Format Board Dispensing - DS Series Table Top Dispensing Equipment Loader
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