Gold / Aluminum / Copper Bonding Wires The bonding wires is the most important material used in making electrical connections between the chip and the external circuit. It has good conductivity and corrosion resistance, and it could be used for extr
Electronics Forum | Thu Nov 23 23:59:25 EST 2000 | terry sun
Hello to all out there, We're considering CC process,and would like to know some defferences between SSC3 of Electrolube and Humiseal 1B73, yes,I know that SSC3 is silicone one,and Humiseal 1B73 is solvent based acrylic as well as other basic propert
Electronics Forum | Wed Dec 02 00:31:37 EST 2009 | jlawson
UV40 for you info was developed in Humiseal EU and has been tested heavily against Dymax product. UV40 is a great product has many approvals from major auto and whitegoods makers.... I have seen comparisons UV40 to Dymax 984LV and Dymax comes out se
Industry News | 2014-11-03 19:13:50.0
Industry-leading associations IPC and SMTA jointly announce the High-Reliability Cleaning and Conformal Coating Conference scheduled to take place November 18-20, 2014 at the Chicago Marriott in Schaumburg, Illinois.
Industry News | 2015-05-21 22:04:20.0
Nordson ASYMTEK announces that registration for its 2015 Technology Days is now open. The event will focus on how innovation and continuous technological developments in fluid dispensing, jetting, and conformal coating improve the way companies bring their products to market. Technology Days is being held in Maastricht, The Netherlands on June 17 and 18, 2015.
Technical Library | 2020-08-05 18:49:32.0
The evolution of internet-enabled mobile devices has driven innovation in the manufacturing and design of technology capable of high-frequency electronic signal transfer. Among the primary factors affecting the integrity of high-frequency signals is the surface finish applied on PCB copper pads – a need commonly met through the electroless nickel immersion gold process, ENIG. However, there are well-documented limitations of ENIG due to the presence of nickel, the properties of which result in an overall reduced performance in high-frequency data transfer rate for ENIG-applied electronics, compared to bare copper. An innovation over traditional ENIG is a nickel-less approach involving a special nano-engineered barrier designed to coat copper contacts, finished with an outermost gold layer. In this paper, assemblies involving this nickel-less novel surface finish have been subjected to extended thermal exposure, then intermetallics analyses, contact/sheet resistance comparison after every reflow cycle (up to 6 reflow cycles) to assess the prevention of copper atoms diffusion into gold layer, solder ball pull and shear tests to evaluate the aging and long-term reliability of solder joints, and insertion loss testing to gauge whether this surface finish can be used for high-frequency, high density interconnect (HDI) applications.
Great improvements on Makerfabs Lora Soil Moisture Sensor V3!!! 1. TLC555 removed, while the Atmega328P(D9/Timer1) generates the 2 MHz pulse (only during measurement phase, switching off afterward), for capacitive moisture measurement. 2. Unique ID b
SMTnet Express, May 22, 2014, Subscribers: 22782, Members: Companies: 13894, Users: 36234 Pb-free solders: Comparison of different geometrical models in calculating of enthalpy of mixing of In-Sn-Zn ternary system. A. Boulouiz, M. El Moudane, M
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