Complete supplier of EMI-shielding, conductive, resistive, & MW-absorptive materials - metallized fabrics, polypyrrole-coated fabrics, carbon nonwovens, magram, C-loaded foams, conductive fibers & filler, EMI gaskets, & resistive wire
Industry Directory | Manufacturer
Electronic shielding manufacturer, specializing fabric-over-foam profile gaskets, shielding tapes, fabric-over-foam I/O gaskets, cable shielding, shielding laminates, board-level shielding and selectively coated, thermoformed shields.
Conductive property good for grounding IC leads against ESD damage Suitable for semiconductors storing and shipping Non-corrosive and good cushioning effect Available in high density, semi-hard and low density foam Surface resistivity
PillowStat ESD, CCI's new concept in component packaging includes (2) 1/4" conductive foam 'pillow pads' inside a static shielding injection molded plastic box. This package is designed to safely package one or more ESd sensitive devices without cust
Electronics Forum | Tue Oct 14 07:30:00 EDT 2014 | rob
For low voltage and current applications there are also some nice SMT conductive foam pads that come in on tape. http://www.gore.com/MungoBlobs/621/772/SMT_Grounding_Pads.pdf I think Laird also do something similar. We place them with no problem.
Electronics Forum | Thu Aug 19 11:58:12 EDT 2010 | davef
From "Universal Instruments Packaging Specification" ... [snip] Packing Of Populated Boards · These parts require individual separation and protection to prevent electro static discharge and structural damage. They shall be packed in sealed, anti-st
Used SMT Equipment | General Purpose Equipment
The EMI Shielding Gaskets are made of spong and conductive fabric which can be used in the gap of the equipments and provide a connection.They have good shield efficiency,impedance of clip measurement,it can be used for the high radiation instrum
Used SMT Equipment | General Purpose Equipment
Omni-directional conductive sponge are ventilate and flexible,use for making shielding gasket,I/O gasket.Soft conductive foam EMI gaskets are ideal for applications that require conformability,excellent EMI shielding,and superior conductivity at
Industry News | 2018-03-20 12:41:26.0
BEST Inc announces the availability of a custom ESD packaging service for electronic assemblies and components.
Industry News | 2008-11-12 18:12:27.0
TORRANCE, CA � November 2008 � Seika Machinery, Inc., a leading provider of advanced machinery, materials and engineering services, introduces the SC-5000 tabletop ultrasonic stencil and misprint cleaner, which is part of its SAWA platform of products. The system comes complete with cleaning head, generator, foot pedal, large 32 x 32 tray and 30 foam pads.
Parts & Supplies | X-Ray Inspection
Omni-directional conductive sponge are ventilate and flexible,use for making shielding gasket,I/O gasket.Soft conductive foam EMI gaskets are ideal for applications that require conformability,excellent EMI shielding,and superior conductivity at low
Technical Library | 2020-08-27 01:22:45.0
Initially adopted internal specifications for acceptance of printed circuit boards (PCBs) used for wire bonding was that there were no nodules or scratches allowed on the wirebond pads when inspected under 20X magnification. The nodules and scratches were not defined by measurable dimensions and were considered to be unacceptable if there was any sign of a visual blemish on wire-bondable features. Analysis of the yield at a PCB manufacturer monitored monthly for over two years indicated that the target yield could not be achieved, and the main reasons for yield loss were due to nodules and scratches on the wirebonding pads. The PCB manufacturer attempted to eliminate nodules and scratches. First, a light-scrubbing step was added after electroless copper plating to remove any co-deposited fine particles that acted as a seed for nodules at the time of copper plating. Then, the electrolytic copper plating tank was emptied, fully cleaned, and filtered to eliminate the possibility of co-deposited particles in the electroplating process. Both actions greatly reduced the density of the nodules but did not fully eliminate them. Even though there was only one nodule on any wire-bonding pad, the board was still considered a reject. To reduce scratches on wirebonding pads, the PCB manufacturer utilized foam trays after routing the boards so that they did not make direct contact with other boards. This action significantly reduced the scratches on wire-bonding pads, even though some isolated scratches still appeared from time to time, which caused the boards to be rejected. Even with these significant improvements, the target yield remained unachievable. Another approach was then taken to consider if wire bonding could be successfully performed over nodules and scratches and if there was a dimensional threshold where wire bonding could be successful. A gold ball bonding process called either stand-off-stitch bonding (SSB) or ball-stitch-on-ball bonding (BSOB) was used to determine the effects of nodules and scratches on wire bonds. The dimension of nodules, including height, and the size of scratches, including width, were measured before wire bonding. Wire bonding was then performed directly on various sizes of nodules and scratches on the bonding pad, and the evaluation of wire bonds was conducted using wire pull tests before and after reliability testing. Based on the results of the wire-bonding evaluation, the internal specification for nodules and scratches for wirebondable PCBs was modified to allow nodules and scratches with a certain height and a width limitation compared to initially adopted internal specifications of no nodules and no scratches. Such an approach resulted in improved yield at the PCB manufacturer.
Career Center | chennai, India | Engineering,Maintenance
Nokia India Pvt LTD. Sriperumpudur – Board Assembler Maintenance Technician from Sep 2009 to till now. Machines Handled Pick & Place : FUJI NXT Machines FUJI NXT - M3 II ,M3S. Reflow oven: Hot flow 3/20, 2/14. Stencil Pr
Career Center | Melbourne, Florida USA | Management,Production,Quality Control
Technical Skills/Abilities: � Management � Quality Assurance � Strong Troubleshooting Skills � Strategic Planning � Employee Training � Quality Assurance � Problem Resolution � Mechanical/Technical Aptitude
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/industries/battery?con=t&page=3
. Whether it’s our comprehensive portfolio of extrusion and coating technologies for lithium-ion battery manufacturers, or our world-leading knowledge of dispensing thermally conductive adhesive for electric
| http://etasmt.com/cc?ID=te_news_industry,26762&url=_print
. Printed circuit boards hit the scene and changed the game. Taking away the physical wires, copper tracks were printed into circuit boards, building conductive tracks that connected two points