Industry Directory | Consultant / Service Provider / Manufacturer
Increase your productivity and improve the quality of your products with Orenda Automation’s complete range of pulverisers and granulators.
Industry Directory | Consultant / Service Provider / Manufacturer / Other
We develop produce and supply innovative cost effective thermal control units to major Semiconductor Devices Manufacturers to test IC devices -LOW & HIGH Power devices for temp range -65°C to +200°C.
Ersa HOTFLOW 4/20 Reflow Oven Working width: 45-560 mm Process length: 5,920 mm Heated length: 3,805 mm Cooling length: 2,115 mm Weight appr. 2,600 kg Dimension: 6,600x1,410x1,350 mm Ersa HOTFLOW 4/20 Reflow Oven Ersa HOTFLOW 4/20 Reflow Oven
Ersa HOTFLOW 4/8 Reflow Oven Working width: 45-560 mm Process Length: 3,260 mm Length Heated: 1,525 mm Length Cooled: 1,735 mm Weight app. 1,100 kg Dimension: 3,905x1,410x1,350 mm Ersa HOTFLOW 4/8 Reflow Oven Ersa HOTFLOW 4/8 Reflow Oven High
Electronics Forum | Mon May 10 10:08:16 EDT 1999 | Rich Taylor
Can anyone tell me what the recommended "typical" cooling rates are after reflow? Are the cooling rates considered as critical to control as the heating rates and why/why not?
Electronics Forum | Mon May 10 13:55:22 EDT 1999 | Deon Nungaray
| Can anyone tell me what the recommended "typical" cooling rates are after reflow? Are the cooling rates considered as critical to control as the heating rates and why/why not? | I do not think there is a "typical" post reflow cooling rate out ther
Used SMT Equipment | General Purpose Equipment
Thermotron Environmental Test Chamber Cooling Heating and Vibration Model Number: F-110-CHV-25-25-VL Serial Number: 947/8885RF Year 2012 Temperature: 177C to -73 Ramp Rate: 7 degree per minute with a 500 lb. load Includes Console System with
Used SMT Equipment | General Purpose Equipment
Very Nice Blue M Oven For Sale See attached pictures and information below Equipment Description Blue M Oven Model Number: CC-09-C-P-E Serial Number: T02G-339526-TG Pro Master Temperature Controller Temperature Range: 350C 6 - 8 degrees/m
Industry News | 2003-06-23 08:49:39.0
Three Organizations from the US, Europe and Japan to
Industry News | 2018-10-18 09:37:27.0
How To Set Profile In SMT Reflow Oven
Parts & Supplies | Assembly Accessories
Detailed Product Description Features: 7 Channel Brand: KIC Part Name: X5 Reflow Profiler Model: X5 Condition: Original New Leadtime: 7days KIC X5 Thermal Profiler with SPC software and RF capability For Reflow Track More Data Points With 7,
Parts & Supplies | ESD Control Supplies
25KV Water Cooled Ceramic Capacitor Manufacturer Supply 25KV 5000pf 2000Kva Water Cool Ceramic capacitor High Frequency RF ceramic capacitor, Watercooled power RF capacitor, RF pot capacitor, water cool capacitor Specifications: Rated Voltage (V)
Technical Library | 2021-09-08 13:43:56.0
Manganese can be an optimal alloying addition in lead-free SAC (SnAgCu) solder alloys because of its low price and harmless nature. In this research, the mechanical properties of the novel SAC0307 (Sn/Ag0.3/Cu0.7) alloyed with 0.7 wt.% Mn (designated as SAC0307-Mn07) and those of the traditionally used SAC305 (Sn96.5/Ag3/Cu0.5) solder alloys were investigated by analyzing the shear force and Vickers hardness of reflowed solder balls. During the preparation of the reflowed solder balls, different cooling rates were used in the range from 2.7 K/s to 14.7 K/s.
Technical Library | 2013-02-28 17:14:36.0
While it has long been known that the Cu6Sn5 intermetallic that plays a critical role in the reliability of solder joints made with tin-containing alloys on copper substrates exists in two different crystal forms over the temperature range to which electronics circuitry is exposed during assembly and service, it has only recently been recognized that the change from one form to the other has implications for solder joint reliability. (..) In this paper the authors report a study of the effect of cooling rates on Cu6Sn5 crystals. Cooling rates from 200°C ranged from 10°C/minute to 100°C/minute and the effect of isothermal ageing at intermediate temperatures was also studied. The extent of the phase transformation after each regime was determined using synchrotron X-ray diffraction. The findings have important implications for the manufacture of solder joints and their in-service performance... First published in the 2012 IPC APEX EXPO technical conference proceedings....
1809 MK5 - Heller Advanced In-Line Vacuum Reflow Oven Nitrogen System with Balanced Flow Technology 9 Top And Bottom Heated Zones - highest zone count per linear foot in the industry! 100" Heated Length - for super throughput! 2 Internal C
Lyra Reflow Oven is a soft soldering that realizes the mechanical and electrical connection between the solder ends of surface mount components or the pins and the printed board pads by remelting the solder paste pre-distributed on the printed board
SMTnet Express February 28, 2013, Subscribers: 26214, Members: Companies: 13305, Users: 34373 Effect of Cooling Rate on the Intermetallic Layer in Solder Joints While it has long been known that the Cu6Sn5 intermetallic that plays a critical role
1st Place Machinery Inc. | http://www.firstplacemachinery.com/firstplace_envirotronics_humidity_oven_sh27.html
: -23C to 177C Accuracy: +/- .1 Degree Cooling Rate: +75 to -40 F in 30 minutes Interior Dimensions: 36 x 36 x 36 Exterior Dimensions
| https://www.smtfactory.com/Introduction-to-the-working-principle-of-Lyra-Reflow-Oven-id45852477.html
? At this stage, the temperature of Lyra Reflow Oven is cooled below the solid phase temperature to solidify the solder joints. The cooling rate will affect the strength of the solder joints
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