Industry Directory: copper joints (3)

Nihon Superior Co., Ltd.

Industry Directory | Manufacturer

Nihon has been a leader in soldering and brazing since 1966. Nihon manufactures SMT solder joining materials e.g. lead-free solder (SN100C:Sn-Cu-Ni-Ge etc): solder paste, solder spheres, flux cored solder wire, solder bar, etc.

Shengyi Technology Co., Ltd.

Industry Directory | Manufacturer

Shengyi is the biggest manufacturer of copper clad laminates in China. Its products are used for making single side, double side, and multilayer printed circuits boards.

New SMT Equipment: copper joints (24)

Rigid-flex PCB, Rigid flex circuit board manufacturer, Flex rigid PCB -- Hitech Circuits Co., Limited

Rigid-flex PCB, Rigid flex circuit board manufacturer, Flex rigid PCB -- Hitech Circuits Co., Limited

New Equipment | Fabrication Services

Rigid flex printed circuit boards (PCBs) are manufactured by combining rigid and flexible board technologies. These circuit boards are made up of multiple flexible circuit inner layers. An epoxy pre-preg bonding film is used to attach together these

Hitech Circuits Co., Limited

PCB Footprint Expert - Tens of Millions of Parts; 25 CAD Formats!

PCB Footprint Expert - Tens of Millions of Parts; 25 CAD Formats!

New Equipment | Software

The PCB Footprint Expert is a powerful CAD library development tool powered by our own proprietary CAD LEAP Technology (Libraries Enhanced with Automated Preferences). It is packed with very powerful advanced library management features that cuts foo

PCB Libraries, Inc.

Electronics Forum: copper joints (255)

beryllium copper

Electronics Forum | Tue Mar 14 16:26:45 EST 2006 | patrickbruneel

BeCu is not solderable without plating Cu, Sn, Ag, Ni etc. The solder joint will only be as strong as the bond strength of the solderable plating to the BeCu Pat

hybrid solder joints

Electronics Forum | Thu May 13 21:45:14 EDT 1999 | ardis

I am seeing reflow around my signal pins after being subjected to a profile of 204c for 1 minute and 225c for a min of 30 seconds. Signal pins are soldered into a copper plated alum. case with SB5 and then silver plated. The pins have a hot oil tin

Industry News: copper joints (184)

SQC in Electronics Manufacturing

Industry News | 2003-06-10 08:16:44.0

The following text describes the application of NWA Quality Analyst to quality control in the assembly of electronic components.

SMTnet

Wave soldering process defectives and handling solution

Industry News | 2018-10-18 07:56:58.0

Wave soldering process defectives and handling solution

Flason Electronic Co.,limited

Parts & Supplies: copper joints (11)

Yamaha YAMAHA AIR JOINT feeder air seat KG2-M3407-A0X

Yamaha YAMAHA AIR JOINT feeder air seat KG2-M3407-A0X

Parts & Supplies | Pick and Place/Feeders

YAMAHA AIR JOINT feeder air seat KG2-M3407-A0X Model: KG2-M3407-A0X YAMAHA AIR JOINT Model: Yamaha Mounter Specification: JOINT feeder Air Seat Part Number: KG2-M3407-A0X Name: JOINT Air Seat K46-M1374-10X YAMAHA machine door shutter K46-M91

ZK Electronic Technology Co., Limited

Yamaha Bit KHY-M7154-01 For YS 34W Vacuum Air Valve Yellow Copper Inner Bit KHY-M7154-01X

Yamaha Bit KHY-M7154-01 For YS 34W Vacuum Air Valve Yellow Copper Inner Bit KHY-M7154-01X

Parts & Supplies | Assembly Accessories

Description: 1, Part Name: Bit 2, Part Number: KHY-M7154-01 KHY-M7154-01X 3, Brand: Yamaha 4, Machine Model: YS24 machine 5, Application: 34W valve Inner Parts Yamaha Bit KHY-M7154-01 For YS 34W Vacuum Air Valve Yellow Copper Inner Bit KH

KingFei SMT Tech

Technical Library: copper joints (17)

Copper/Epoxy Joints in Printed Circuit Boards: Manufacturing and Interfacial Failure Mechanisms

Technical Library | 2020-01-09 00:00:30.0

PCBs have a wide range of applications in electronics where they are used for electric signal transfer. For a multilayer build-up, thin copper foils are alternated with epoxy-based prepregs and laminated to each other. Adhesion between copper and epoxy composites is achieved by technologies based on mechanical interlocking or chemical bonding, however for future development, the understanding of failure mechanisms between these materials is of high importance. In literature, various interfacial failures are reported which lead to adhesion loss between copper and epoxy resins. This review aims to give an overview on common coupling technologies and possible failure mechanisms. The information reviewed can in turn lead to the development of new strategies, enhancing the adhesion strength of copper/epoxy joints and, therefore, establishing a basis for future PCB manufacturing.

Polymer Competence Center Leoben GmbH

Low Cycle Fatigue Behaviour of Multi-joint Sample in Mechanical Testing

Technical Library | 2013-03-21 21:24:49.0

This paper explores the behaviour of a copper test vehicle with multiple reflowed solder joints, which has direct relevance to ball grid arrays (BGA) and high density interconnect structures. The paper explores the relative stress conditions on the distributed joints and the sensitivity to ball joint shape... First published in the 2012 IPC APEX EXPO technical conference proceedings

National Physical Laboratory

Videos: copper joints (7)

PCB Footprint Expert

PCB Footprint Expert

Videos

The PCB Footprint Expert is a powerful CAD library development tool powered by our own proprietary CAD LEAP Technology (Libraries Enhanced with Automated Preferences). It is packed with very powerful advanced library management features that cuts foo

PCB Libraries, Inc.

How to Use and Read Humidity Indicator Card Type 2 - Humitector™

How to Use and Read Humidity Indicator Card Type 2 - Humitector™

Videos

A Sustainable Alternative - Humitector cards are halogen-free and cobalt dichloride free. Visit https://www.clariant.com/solutions/products/2017/10/31/00/12/humitector-type-2-nonreversible-humidity-indicator-card?utm_source=CLRYouTube&utm_medium=Vi

Clariant Cargo & Device Protection

Events Calendar: copper joints (2)

SMTA China East Conference 2018

Events Calendar | Mon Apr 23 00:00:00 EDT 2018 - Thu Apr 26 00:00:00 EDT 2018 | Shanghai, China

SMTA China East Conference 2018

Surface Mount Technology Association (SMTA)

Capital Chapter Webinar: Next Gen Lead Free Solders for High Reliability & SMT Yield improvement

Events Calendar | Tue Apr 06 00:00:00 EDT 2021 - Tue Apr 06 00:00:00 EDT 2021 | ,

Capital Chapter Webinar: Next Gen Lead Free Solders for High Reliability & SMT Yield improvement

Surface Mount Technology Association (SMTA)

Express Newsletter: copper joints (333)

SMTnet Express - January 8, 2020

SMTnet Express, January 8, 2020, Subscribers: 33,435, Companies: 10,958, Users: 25,498 Copper/Epoxy Joints in Printed Circuit Boards: Manufacturing and Interfacial Failure Mechanisms Credits: Polymer Competence Center Leoben GmbH PCBs have a wide

SMTnet Express March 21 - 2013, Subscribers: 26266

SMTnet Express March 21, 2013, Subscribers: 26266, Members: Companies: 13317, Users: 34462 Low Cycle Fatigue Behaviour of Multi-joint Sample in Mechanical Testing by: C.P. Hunt, O. Thomas, D. Di Maio, E. Kamara, H. Lu; National Physical Laboratory

Partner Websites: copper joints (171)

Are Voids in Solder Joints Really an Issue?

| https://www.eptac.com/blog/are-voids-in-solder-joints-really-an-issue

Are Voids in Solder Joints Really an Issue? Looking for solder training standards, manuals, kits, and more? Visit soldertraining.com Training Training Materials Locations Resources Ask Helena

Quality Requirements and Formation Process of Reflow Solder Joints-News-Reflow oven,SMT Reflow Solde

| http://etasmt.com/cc?ID=te_news_bulletin,19361&url=_print

Quality Requirements and Formation Process of Reflow Solder Joints-News-Reflow oven,SMT Reflow Soldering Oven-cmsadmin Reflow oven,SMT Reflow Soldering Oven 当前位置: Home >> News


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