Industry Directory | Manufacturer
Sprint Circuits,a high technology PCB manufacturing company,Since 2001.Our advantages are quick turn,Thick copper(up to 6oz) ,impendace control and high precision from 6layer to 12layer boards.
Agile Circuit Co., Ltd is an experienced professional supplier of printed circuits. We are specialized in meeting your needs in all PCBs
New Equipment | Fabrication Services
Rigid flex printed circuit boards (PCBs) are manufactured by combining rigid and flexible board technologies. These circuit boards are made up of multiple flexible circuit inner layers. An epoxy pre-preg bonding film is used to attach together these
PCB Separator Machine for Metal Board with Linear Blade Advantage: 1. Nice for cutting v cut metal board,Aluminium PCB,LED strip,Copper PCB etc . 2. Separate rigid and thick board fluently . 3. Use pneumatic-driven and electromagnetic valve to oper
Electronics Forum | Mon Apr 22 16:31:53 EDT 2013 | anvil1021
So, I was wondering how thick 2 oz. Copper is supposed to be? I have heard 60 microns and 70 microns, but the PCBs that we have that are supposed to be 2oz Copper are 68.5 microns, the Customer would like at least 60 microns, but what is the reality
Electronics Forum | Mon Apr 22 17:13:48 EDT 2013 | hegemon
Might want to double check my figures, but my notes have 2oz copper at 2.8 mils or 71.12 microns in thickness. 'hege
Used SMT Equipment | Semiconductor & Solar
Standard Machine features and system description: Ultra-fine pitch and small ball bonding capabilities High frequency transducer operating at 138 kHz Applicable wire size of 0.6mil-2.0mil High speed XY table with linear motor technology High ac
Parts & Supplies | Assembly Accessories
PC12P Inventory Material: Copper Clad FR4, Single Sided, 2 oz. Series: - Size Dimension: 18.00" x 12.00" (457.4mm x 304.8mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: Copper Clad, Positive Sensitized PC12P-E RFQ
Parts & Supplies | Circuit Board Assembly Products
1). FR-4 Material 2). 2 layer, 1.2mm thick 3). 5 oz copper weight. 4). LPI Green solder mask/White silk screen 5). Immersion gold over nickle
Technical Library | 2023-11-14 19:52:11.0
The continuous drive in the Electronics industry to build new and innovative products has caused competitive design companies to develop assemblies with consolidated PCB designs, decreased physical sizes, and increased performance characteristics. As a result of these new designs, manufacturers of electronics are forced to contend with many challenges. One of the most significant challenges being the processing of thru-hole components on high thermal mass PCBs having the potential to exceed 20 layers in thicknesses and have copper mass contents of over 40oz. High thermal mass PCBs, coupled with the use of mixed technologies, decreased component spacing, and the change from Tin Lead Solder to Lead Free Alloys has lead many manufacturing facilities to purchase advanced soldering equipment to process challenging assemblies with a high degree of repeatability.
Technical Library | 2019-06-20 00:09:49.0
It is well known that during service the layer of Cu6Sn5 intermetallic at the interface between the solder and a Cu substrate grows but the usual concern has been that if this layer gets too thick it will be the brittleness of this intermetallic that will compromise the reliability of the joint, particularly in impact loading. There is another level of concern when the Cu-rich Cu3Sn phase starts to develop at the Cu6Sn5/Cu interface and an imbalance in the diffusion of atomic species, Sn and Cu, across that interface results in the formation at the Cu3Sn/Cu interface of Kirkendall voids, which can also compromise reliability in impact loading. However, when, as is the case in some microelectronics, the copper substrate is thin in relation to the volume of solder in the joint an overriding concern is that all of the Cu will be consumed by reaction with Sn to form these intermetallics.This paper reports an investigation into the kinetics of the growth of the interfacial intermetallic, and the consequent reduction in the thickness of the Cu substrate in solder joints made with three alloys, Sn-3.0Ag-0.5Cu, Sn-0.7Cu-0.05Ni and Sn-1.5Bi-0.7Cu-0.05Ni.
Guillotine type V-cut PCB Cutting Machine Product Description 1. For internal strength generates during separation, Minimize it to value under 180uE ,to avoid solder crack or component damage 2. Able to separate edge of V-slot, minimum distance to
ML-550 Automatic Blade Moving PCB Separator Features ●Suitable for horizontal designed PCB with V-scored groove. ●Automatic feeding and precise positioning to separate PCBA. ●PCB material:FR4.Aluminum,Copper,etc. ●49 sets of PCB data can be stor
Career Center | Shen Zhen, China | Management,Sales/Marketing
Working in GLORYPCB for 10 years.knowing electronic supply chain very well. especially for PCB PCBA assembly and other Electronic Manufacturing Service.Glorypcb is a professional electronic manufacturer located in Shenzhen with three facilities.offe
SMTnet Express, May 17, 2018, Subscribers: 31,044, Companies: 10,939, Users: 24,723 Statistical Aspect on the Measuring of Intermetallic Compound Thickness of Lead Free Solders Azman Jalar, Maria Abu Bakar, Roslina Ismail, Abdul Razak Daud
SMTnet Express, June 20, 2019, Subscribers: 32,068, Companies: 10,815, Users: 24,854 Dissolution in Service of the Copper Substrate of Solder Joints Credits: Nihon Superior Co., Ltd. It is well known that during service the layer of Cu6Sn5
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/-/media/Files/Nordson/efd/Products/Data-Sheets/Thermal-Compound/Nordson_EFD_Thermal_Compound_Selector_Guide.pdf?la=en
. Mechanics of Heat Transfer Choosing the best thermal compound requires some understanding of the mechanics of heat transfer and how the thickness of the thermal compound layer, the bond line
