New SMT Equipment: crack epoxy (3)

Aluminum PCB; Metal Core PCB; LED PCB Circuit board -- Hitech Circuits Co., Limited

Aluminum PCB; Metal Core PCB; LED PCB Circuit board -- Hitech Circuits Co., Limited

New Equipment | Fabrication Services

Aluminum PCB & Metal Core PCB & LED PCB Circuit board Aluminium PCB are metal-based, copper-clad laminates with a good heat dissipation function. Usually, Aluminium PCB is refer to LED PCB board, which is the most important part of LED display and l

Hitech Circuits Co., Limited

Current and Voltage Sensors epoxy potting machine

Current and Voltage Sensors epoxy potting machine

New Equipment | Dispensing

About 2 part silicone Metering, Mixing and Dispensing System The 2 part silicone Metering, Mixing and Dispensing System accurately meters, mixes and dispenses two-component materials like potting compounds, encapsulants, casting materials and adhesi

Guangzhou Daheng Automation Equipment Co.,LTD

Electronics Forum: crack epoxy (51)

Epoxy crack causing intermittent failure

Electronics Forum | Thu Feb 22 13:11:51 EST 2001 | keithtbe

Silver epoxy is used to joint the LED beam lead and the trace of the flexi circuit. Due to the LED mounted skew upward or downward unconsistently, the strength of the joint weakened and causing the LED lights up intermittently. I would like to ask fo

BGA chip corner epoxy / adhesive?

Electronics Forum | Wed Dec 06 22:35:05 EST 2006 | davef

Questions are: * When you say, "corner of some board's BGA chips", is it on the top of the package or between the board and the bottom of the package? * If between the board and the bottom of the package, does it span the distance between the board a

Industry News: crack epoxy (17)

Printed Circuit Board (PCB) for Surface Mount Technology (SMT)

Industry News | 2018-12-08 03:27:35.0

Printed Circuit Board (PCB) for Surface Mount Technology (SMT)

Flason Electronic Co.,limited

SMT Dictionary – Surface Mount Technology Acronym and Abbreviation

Industry News | 2018-12-08 03:29:29.0

SMT Dictionary – Surface Mount Technology Acronym and Abbreviation

Flason Electronic Co.,limited

Technical Library: crack epoxy (6)

Underfill Dispensing For Aerospace Military And Defense

Technical Library | 2023-08-16 18:20:44.0

One of our defense customers planned to dispense underfill material for small and large die, using Hysol FP4545FC epoxy encapsulant. This process dissipates stress on solder joints and prevents cracking and fracturing between the bottom of the die and the surface of the substrate.

GPD Global

PCB Fabrication Processes and Their Effects on Fine Copper Barrel Cracks

Technical Library | 2015-12-23 16:57:27.0

The onset of copper barrel cracks is typically induced by the presence of manufacturing defects. In the absence of discernible manufacturing defects, the causes of copper barrel cracks in printed circuit board (PCB) plated through holes is not well understood. Accordingly, there is a need to determine what affects the onset of barrel cracks and then control those causes to mitigate their initiation.The objective of this research is to conduct a design of experiment (DOE) to determine if there is a relationship between PCB fabrication processes and the prevalence of fine barrel cracks. The test vehicle used will be a 16-layer epoxy-based PCB that has two different sized plated through holes as well as buried vias.

Raytheon

Express Newsletter: crack epoxy (103)

Partner Websites: crack epoxy (9)

Construction & Architecture | Nordson Sealant Equipment

ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sealant-equipment/solutions/construction-and-architecture

 / prefabricated home construction projects. Joint and Crack Filling Applications Include: Highways Runways Tunnels Sidewalks In-Ground Pools Concrete Walls Parking Decks Flooring Bonding and Sealing Applications Include

ASYMTEK Products | Nordson Electronics Solutions

BookStore

Surface Mount Technology Association (SMTA) | https://www.smta.org/store/book_store.cfm

and biomedical packaging, MEMS and wafer level chip scale packaging, and packaging materials such as lead-free solders, flip chip underfills, epoxy molding compounds, and conductive adhesives have all been updated with the latest developments in the

Surface Mount Technology Association (SMTA)


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