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New Equipment | Industrial Automation
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Electronics Forum | Fri Dec 03 18:01:56 EST 1999 | M Cox
Usually the alignment problem comes from pad design. The ground pad (largest) is too small. If that is the case (and even if it isn't) try placing a dot of SMT adhesive before placement (it will cure before reflow and hold the part in place). Goo
Electronics Forum | Thu Dec 02 23:43:23 EST 1999 | Kantesh Doss
We have a serious misalignment problem of D-Pak components (Specifically Motorola's part number MJD-3055/MJD-2955)following reflow soldering process. We are using Alpha Metals UP78 solder paste. Our reflow oven is Nitrogen inerted and our oxygen leve
Used SMT Equipment | SMT Equipment
Video demonstration: http://www.youtube.com/watch?v=OviAm7d1S7g • One Y-direction servo motor, rather than two, overcomes misalignment problem; air actuate feeders instead head-punch in advance feeders • 3000-3500 estimated pph(parts per hour) • 21
Industry News | 2018-12-08 03:29:29.0
SMT Dictionary – Surface Mount Technology Acronym and Abbreviation
Industry News | 2008-04-07 23:18:22.0
MORRISVILLE, NC - March 31, 2008 - Juki Corporation, a world-leading provider of automated assembly products and systems, announces that its OPASS technology won a NPI Award in the Software category. The award was presented to the company during a Monday, March 31, 2008 ceremony that took place in the Mandalay Bay Resort & Convention Center in Las Vegas before the start of APEX 2008. OPASS, which stands for Offset Placement After Solder Screen Printing, was developed to address the problem of solder paste alignment errors.
Technical Library | 2008-10-29 18:45:53.0
Growing demand for compact, multi-function electronics products has accelerated component miniaturization and high-density placement, creating new challenges for the electronics manufacturing industry. It is no longer adequate to simply place parts accurately per a pre-defined CAD assembly program because solder paste alignment errors are increasing for numerous reasons. The solution to this problem is a system in which the placement machine can automatically detect and compensate for misalignment of the solder paste to produce high-quality boards regardless of the process errors beforehand.
Integrated Offset Placement in Electronics Assembly Equipment The Answer for Solder Paste Misalignment News Forums SMT Equipment Company Directory Calendar Career Center Advertising About FREE Company Listing! Integrated Offset
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