Industry Directory | Equipment Dealer / Broker / Auctions
CMTec is highly specialized in dealing with assembly equipment. We support BESI (ESEC, Datacon), Kulicke & Soffa, Hesse & Knipps, F&K Delvotec, Orthodyne, ASM, Dage and others. CMTec delivers 'turn-key' projects worldwide.
Electronics Forum | Mon Jan 25 01:24:27 EST 2010 | sparrow
If the bumps are so small, I do not see any reason for considering Mydata, Siemens or any SMT p&p machine. Datacon's die bonders are very good ones. In your case, I would keep using them.
Used SMT Equipment | Assembly Accessories
we need Besi Die Bond: Type: Datacon 2200 Evo 8800FC ,2200 APM+
Industry News | 2024-08-12 17:16:30.0
Bidding Begins Closing: August 14 @ 1:00pm EST
Are Separate Solder Flip-Chip Bonders Still Required? Are Separate Solder Flip-Chip Bonders Still Required? Increasing miniaturization is now encouraging manufacturers of handheld devices to stack bare dies or packages. As the process
winsouce.jpg)
