Electronics Forum | Tue Dec 02 11:34:54 EST 2003 | caldon
Adam- I would touch base with the three people I have listed below. Touching base with each one will net you every thing about Vapor Cleaning Equipment you would ever want to know. Ultronix Carl Wolf 800-553-7881 zoc@ultronix.com www.ultronix.com A
Electronics Forum | Tue Jan 16 20:34:17 EST 2007 | davef
DAVE�S BOOKSHELF ASSEMBLER�S ESSENTIALS Title: Soldering in ElectronicsAuthor: RJ Klein WassinkPublisher: Electrochemical PublicationsISBN: 090115024XPublication date: December 1989 I know, I know. The book was written in 1989!!!! I use this b
Industry News | 2011-04-29 17:28:45.0
Celebrating the best of electronic interconnection research being conducted by both industry leaders and academia, IPC announced the 2011 Best Industry Posters and the winners of the IPC Academic Poster Competition at IPC APEX EXPO, held April 12–14, 2011 in Las Vegas.
Industry News | 2010-04-23 21:51:55.0
BANNOCKBURN, Ill., USA — Celebrating the best of electronic interconnection research being conducted by both industry leaders and academia, IPC – Association Connecting Electronics Industries® announced the 2010 Best Industry Posters and the winners of the second annual IPC Academic Poster Competition at IPC APEX EXPO, held April 6–8, 2010 in Las Vegas.
Technical Library | 2012-08-16 22:38:05.0
First published in the 2012 IPC APEX EXPO technical conference proceedings. The physical mechanisms behind tin whisker formation in pure tin (Sn) films continue to elude the microelectronics industry. Despite modest advances in whisker mitigation techniqu
Technical Library | 2023-02-13 19:23:18.0
Spontaneously forming tin whiskers, which emerge unpredictably from pure tin surfaces, have regained prevalence as a topic within the electronics research community. This has resulted from the ROHS-driven conversion to "lead-free" solderable finish processes. Intrinsic stresses (and/or gradients) in plated films are considered to be a primary driving force behind the growth of tin whiskers. This paper compares the formation of tin whiskers on nanocrystalline and conventional polycrystalline copper deposits. Nanocrystalline copper under-metal deposits were investigated, in terms of their ability to mitigate whisker formation, because of their fine grain size and reduced film stress. Pure tin films were deposited using matte and bright electroplating, electroless plating, and electron beam evaporation. The samples were then subjected to thermal cycling conditions in order to expedite whisker growth. The resultant surface morphologies and whisker formations were evaluated.
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/06/Vacuum-Fluxless-Reflow-Technology-for-Fine-Pitch.pdf
,*, Liang He1, David Wright2, Hossein Madanipour1, Bret Halbe2, Jung Kyu1, Fred Tarazi2, Gang Duan1, Dror Trifon2, Rahul Manepalli1, David Heller2 Substrate Packaging Technology Development Assembly
Heller 公司 | http://hellerindustries.com.cn/Vacuum-Void-Reduction-Reflow.pdf
. THE EFFECT OF VACUUM REFLOW PROCESSING ON SOLDER JOINT VOIDING AND THERMAL FATIGUE RELIABILITY Richard Coyle1, Dave Hillman2, Michael Barnes3, David Heller3, Charmaine Johnson1, Richard Popowich1
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