New Equipment | Rework & Repair Equipment
BEST HeatShield Gel™ is a thermal shield water-based gel designed to be used in the PCB rework/repair or board assembly areas in order to provide thermal protection of electronic components. It is truly a revolutionary means to protect components. It
New Equipment | ESD Control Supplies
High performance fluxophobic stencil treatments wipes Enhance your stencil performance in seconds! Aculon is pleased to announce the launch of their latest generation of stencil coating technology. Aculon’s proprietary technology treats the undersi
Electronics Forum | Tue Feb 22 10:17:11 EST 2011 | huei23
Hi everyone, Our FA team recieved the defect unit from our customer, and the issue is GF discoloration. EDX was conducted and Na element was detected on the discolored area. We're currently working with the customer to determine the rootcause. Pleas
Electronics Forum | Thu Feb 26 21:35:21 EST 2015 | flyingsnow
Hi, has anyone experienced discoloration of cured non-conductive epoxy? It turned from white to deep red. The parts were returned from customer and we noticed the color change and wondered what could cause epoxy discoloration.Thank you!
Industry News | 2010-04-30 18:47:15.0
SMTA China announces that it presented awards for the 10 best papers/presentations and two best exhibits at the SMTA China East 2010 Conference Award Presentation Ceremony, held on Wednesday, April 21, 2010 at the Shanghai Everbright International Hotel in conjunction with the SMTA China Annual Breakfast Reception.
Industry News | 2018-10-18 08:55:30.0
Nitrogen Protection Reflow Oven
Technical Library | 2014-06-23 14:50:52.0
It was unusual to see chip terminations change colors when tin lead solders were used but with the introduction of lead free reflow soldering and the corresponding increases in reflow temperatures terminations are now changing colors. Two conditions are present when reflow temperatures are increased for lead free solder alloys that leads to discoloration. Reflow temperatures are above the melting point of tin (Sn MP is 232oC). Air temperatures commonly used in forced convection reflow systems are high enough to both melt the tin plating on the termination allowing it to be pulled into the solder joint due to solder joint liquid solder surface tension leaving behind the exposed nickel barrier. Now those metal oxide colors will be visible due to high air temperatures during reflow.
The LIRM is a dual workstation inline laser singulation machine specially designed to handle FR4 / FR2 and flex PCBA's up to 1.6mm in thickness. It comes in 2 versions which handles different panel sizes. The system employs a green laser source
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generation of the solder balls, to avoid bridging to obtain good welding quality Get better welding quality is particularly important and can use a lower-activity flux paste, but also can improve the performance of the joints, to reduce the discoloration of
Heller Industries Inc. | https://hellerindustries.com/causes-defects-reflow-soldering/
Intermetallics Appearance Component Cracking Bridging Grainy Solder Laminate Discoloration Leaching Halo Effect Discolored Joint help@hellerindustries.com 1-800-394-OVEN 1-800-394-OVEN Company About News Events Careers Heller Blog Certifications Equipment Convection Reflow Ovens New