Industry Directory | Manufacturer's Representative
Manufacturers Representatives for SMT Equipment and Materials serving Southern California and Baja, MX
M.O.L.E.® MAP is ECD's current software for setup, download, analysis, prediction and data storage that ships with the all new SuperM.O.L.E.® Gold 2 thermal profiler, the MEGAM.O.L.E.® 20, the V-M.O.L.E.®, the PTP® VP-8 and the SuperM.O.L.E.® Gold, E
Time and temperature are very important variables in soldering printed circuit boards. It is important to bring the circuit board assemblies up to a high enough temperature for a long enough period to effectively solder the components to the board. G
Electronics Forum | Fri Apr 02 11:23:44 EST 2004 | pjc
ECD has some advantages in terms of upgrade path. Once you buy the ECD SuperM.O.L.E., you can use it in a OvenRIDER, WaveRIDER and ReworkRIDER products. The OR, WR and RR are solder machine management devices for solder process control. Where profile
Electronics Forum | Fri Apr 02 15:59:04 EST 2004 | russ
Matt, are you still just doing SIPAD? If so, Manncorp has a profiler for about $1k It requires a p.c. to be hooked up while profiling and it won't take data points any faster than 1 point every 2 seconds. but could be adequate for your needs. (www.
ECD M.O.L.E. Lot comes with the following, everything is complete and fully functional, manuals included, plus and spare parts. 1) ECD M.O.L.E. Xpert 3 profile module 2) ECD Xpert 3 Docking station 3) SUPER M.O.L.E. Gold thermocouple system. 4) ECD O
Used SMT Equipment | Soldering - Reflow
12 Heated Zone (160") & 4 Cooling Zones (54") Pin Chain Conveyor with Center Board Support: N2 Ready Software Version 3.3.0c * Includes ECD XPERT Mole Profiling Unit with internal ECD computer profiling software (Overwatch 1.12B and SuperMole Gol
Industry News | 2012-11-05 14:21:13.0
ECD is digging deep to find the oldest M.O.L.E.® so scour your plant for a vintage, working M.O.L.E.® thermal profiler and enter our contest to Win a New SuperM.O.L.E.® Gold 2 Kit
Industry News | 2012-05-31 14:49:02.0
Upholding its promise to continuously advance thermal profiling technology, ECD has announced the release of M.O.L.E. ® MAP 3.00 (MAP 3.00) software designed to provide even greater levels of machine-assembly-process optimization.
New features highlight the ability for the customer to control what Process features are available.
This wizard guides a user through the communications setup process so the software and M.O.L.E. can communicate. Categories: OvenRIDER, OvenRIDER SPC (v5.2x)
| https://www.eptac.com/faqs/ask-helena-leo/ask/information-and-training-on-reflow-profiling-setup
. You can also get some information on how to thermocouple the board itself from the suppliers of thermocouple equipment, such as: KIC, Manncorp, ECD
