Industry Directory | Consultant / Service Provider / Distributor / Equipment Dealer / Broker / Auctions / Manufacturer
ZK Electronic Technology Co., Limited professional in Surface-Mount Technology area and supports most major brands of electronic asembly equipments with a large selections of compatible SMT.
World leader of internet services for manufacturing printed circuit boards, two sites for producing either prototypes or production level quantities. Online pricing available and files can be submitted for quotes.
Simplify Dispensing with GPD Global’s Island Series Dispense Platforms Island Series robots give you versatility to do simple, repetitive automation jobs. Work areas range from 300 mm x 400 mm to 400 mm x 400 mm. All Island Series robots are compati
Precision Dispensing System for Heated Dispense Applications The GPD Global MAX II is a compact; high-accuracy system designed for today’s advanced heated dispensing applications. The frame is molded from “liquid rock” which gives the system a stabl
Electronics Forum | Wed Feb 14 16:03:54 EST 2001 | lileubie
Do you have a stencil wipe step after every six boards? If so, the wipe either automatic or manual needs to be optimized. Either less solvent or more time for the solvent to evaporate off.
Electronics Forum | Fri Mar 24 09:37:23 EST 2006 | mrduckmann2000
Our company is looking into purchasing an in-line conformal coating machine. We have narrowed the field down to 2 machines the USI Prism Ultra-coat 350 and the Asymtek C-740, anybody have either machine. Good points or bad about either machine? Th
Used SMT Equipment | Other Equipment
The machine is an in line router with servo grippers so you can pick up basically any size board you can design grippers for. We were routing some fairly small boards ranging from .3 inch by 1 inch to 2 inch by 4inch in small arrays. That is why all
Used SMT Equipment | AOI / Automated Optical Inspection
- 8 CAMERAS(5 MEGA PIXEL CAMERA) • High performance inspection for 01005 components • New 5.0 megapixel CMOS color cameras • 17 micron camera resolution • Dual-core dual-processor computer • Line-speed inspection for demanding cell phone and
Industry News | 2017-11-07 23:20:25.0
GPD Global offers a cost-effective, automated Conformal Coating System (SimpleCoat) with excellent repeatability for just under $40,000!!!
Industry News | 2017-03-09 22:28:20.0
GPD Global introduces its NEW Conformal Coating System (SimpleCoat), an Inline and Cost-effective Conformal Coating System with full featured programming - making conformal coating processes quick and easy.
Parts & Supplies | Repair/Rework
The RocHard 1 MilProbe is a 0.3" long Micro-tip in a 4 3/8" long hex shape stainless steel handle. The Micro-tip is tapered to a one mil diameter tip for TAB, BGA, and other ultra fine pitch rework. The tip is either straight (SH-341) or 50? angled a
Parts & Supplies | SMT Equipment
Lead Cutting Machine - Capacitor Cutter 301 Specifications This lead forming machine is used to lead-cutting and forming of taped resistors, diodes, and other axial components. FEATHERS 1. It is used to cut radial leads of bulk radial
Technical Library | 2009-04-23 08:14:37.0
No SMT equipment can place accurately and run efficiently without quality nozzles and feeders. These two factors are the core of the pick and place process. If the machine is either unable to pick parts consistently or hold on to the components during the transport from feeder to PCB, defects will result.
Technical Library | 2012-12-17 22:05:22.0
Package on Package (PoP) has become a relatively common component being used in mobile electronics as it allows for saving space in the board layout due to the 3D package layout. To insure device reliability through drop tests and thermal cycling as well as for protecting proprietary programming of the device either one or both interconnect layers are typically underfilled. When underfill is applied to a PoP, or any component for that matter, there is a requirement that the board layout is such that there is room for an underfill reservoir so that the underfill material does not come in contact with surrounding components. The preferred method to dispensing the underfill material is through a jetting process that minimizes the wet out area of the fluid reservoir compared to traditional needle dispensing. To further minimize the wet out area multiple passes are used so that the material required to underfill the component is not dispensed at once requiring a greater wet out area. Dispensing the underfill material in multiple passes is an effective way to reduce the wet out area and decrease the distance that surrounding components can be placed, however, this comes with a process compromise of additional processing time in the underfill dispenser. The purpose of this paper is to provide insight to the inverse relationship that exists between the wet out area of the underfill reservoir and the production time for the underfill process.
This elevator format oven utilizes vertical space to accomodate curing applications of up to 4 hours while only occupying 96" (2.5m) of floorspace. Perfect for underfill and encapsulant.
Simplify Dispensing with GPD Global’s Island Series Dispense Platforms Island Series robots give you versatility to do simple, repetitive automation jobs. Work areas range from 300 mm x 400 mm to 400 mm x 400 mm. All Island Series robots are compati
Training Courses | | | IPC-600 Specialist (CIS)
The Certified IPC-600 Specialist (CIS) training targets quality assurance and acceptance of bare printed circuit boards.
Training Courses | | | Cable and Wire Harness Assembly Training Courses
Browse training and certification programs for wire harness cable and connector assembly.
Events Calendar | Tue Apr 13 00:00:00 EDT 2021 - Tue Apr 13 00:00:00 EDT 2021 | ,
Boston Chapter Webinar: Cleaning Chemistry For PWB and Rework - Part 2, session 1
Events Calendar | Tue Apr 13 00:00:00 EDT 2021 - Tue Apr 13 00:00:00 EDT 2021 | ,
Boston Chapter Webinar: Cleaning Chemistry For PWB and Rework - Part 2, session 2
Career Center | Tupelo, Mississippi USA | Quality Control
Quality engineer for SMT electronics assembly operation. Will work to perform and identify opportunity for process improvements, drive continuous improvement, collect and interpret quality data, and work with assigned customers on quality issues. Ex
Career Center | Milwaukee, Wisconsin USA | Engineering
Responsible for all Wire and die bond process within this fast growing Microelectronics company. Company is constantly upgrading equipment and processes to compete in the fiber optics arena. Company will either hire fulltime or a contract worker who
Career Center | Rochester, New York USA | Engineering
I have done my undergraduate studies in Mechanical Engineering. I am pursuing my Master's Program in Electronics Packaging. I am currently working as a Research Assistant for RIT-CEMA (Center for Electronics Manufacturing and Assembly). My research
Career Center | FARIDABAD, HARYANA India | Engineering,Maintenance,Management,Production,Quality Control
SMT Maintenance ( Samsung Techwin Screen Printers, Solder Paste Inspection, Panasonic & Fuji Chip Mounters & Multi Mounters, Heller Reflow Machines, Functional Testing Inline Machines, Epoxy Dispensors, Underfill Reflow, Routers) Industrial Enginee
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PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/topic568&OB=DESC.html
. The current dimension in FPX for lead width (b) requires a proper dimension as either min/max or nom/tol +/tol -. Some datasheets for axial and radial components specify a wire gauge size in either SWG or AWG, for example this TE fuse: http
| https://unisoft-cim.com/view-markup_quoting_solder-joint-count-defect-per-million-operations-dpmo-report.html
= total pin count Part #'s - 6 = total part numbers Method 2) This method exports a standardized BOM by either part number or reference designator. To use
