Industry Directory | Manufacturer's Representative / Manufacturer / Equipment Dealer / Broker / Auctions / Distributor / Consultant / Service Provider
DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD is a company which mainly provide used and new SMT parts, provide repair SMT key parts service,new/used SMT machine trading,SMT consumables and Peripherals equipment,Clean room, ESD..
Industry Directory | Manufacturer
Contract manufacturer for electronic assemblies for use in lasers, aerial monitoring and gaming equipment
Schematic Entry PCB Layout Power Circuit Design EMI and UL Knowledge Surface Mount, Thru-Hole, Mixed Technology, Flex Circuitry Library PCB and Scematic capture Fabrication
Schematic Entry PCB Layout Power Circuit Design EMI and UL Knowledge Surface Mount, Thru-Hole, Mixed Technology, Flex Circuitry Library PCB and Scematic capture Fabrication
Electronics Forum | Wed Jul 11 20:17:05 EDT 2001 | davef
I�ve written a review to be published in an up-coming SMTnet Newsletter of �Printed Circuit Assembly Design� Leonard Marks, James A. Caterina [Hardcover - 368 pages (July 26, 2000) McGraw Hill Text; ISBN: 0070411077]. In short, � In �Printed Circui
Electronics Forum | Sat Oct 05 07:29:48 EDT 2002 | davef
Design for the Environment (DFE) / Electromagnetic Compliance (EMC) ------------------------------------------------------------------- "Noise Reduction Techniques in Electronic Systems" Henry W. Ott, John Wiley & Sons, New York, 1976 Seltzer, G.S.
Used SMT Equipment | General Purpose Test & Measurement
FSP is the ideal partner for both development and production, featuring the smallest level measurement uncertainty in its class, as well as excellent RF characteristics. The FSP is outstanding for its innovative measurement functions and incorporates
Used SMT Equipment | General Purpose Test & Measurement
FSP is the ideal partner for both development and production, featuring the smallest level measurement uncertainty in its class, as well as excellent RF characteristics. The FSP is outstanding for its innovative measurement functions and incorporates
Industry News | 2003-03-24 09:46:41.0
Will feature a number of new technologies of interest to fabricators in printed circuit materials, laminate materials, polymer thick films and, most notably, its newest product line of embedded passive materials, DuPont Interra�.
Industry News | 2003-04-15 08:57:18.0
First Implementation of the Package Platform Delivers 50-percent Cost, 60-percent Height, and 75-percent Area Reductions over Conventional RF Module Technologies
Parts & Supplies | Pick and Place/Feeders
JUKI HR034202210 RESISTOR 1/10W 220 OHM FUJINTAI TECHNOLOGY CO.,LTD JUKI HR034202420 RESISTOR 1/10W 2.4K OHM www.fujintai.com JUKI HR034203310 RESISTOR 330 OHM FUJINTAI TECHNOLOGY CO.,LTD JUKI HR034203320 RESISTOR 3.3K OHM www.fujintai.com JUKI HR
Parts & Supplies | Pick and Place/Feeders
JUKI HN001490000 CLAMP FILTER(L) FUJINTAI TECHNOLOGY CO.,LTD JUKI HN00149000A CLAMP FILTER www.fujintai.com JUKI HN00167000A SURGE ABSORBER FUJINTAI TECHNOLOGY CO.,LTD JUKI HN001960000 NOISE FILTER www.fujintai.com JUKI HN001970000 SURGE ABSORBER
Technical Library | 2020-02-26 23:24:02.0
Shielding electronic systems against electromagnetic interference (EMI) has become a hot topic. Technological advancements toward 5G standards, wireless charging of mobile electronics, in-package antenna integration, and system-inpackage (SiP) adoption are driving the need to apply more effective EMI shielding and isolation to component packages and larger modules. For conformal shielding, EMI shielding materials for exterior package surfaces have mostly been applied with a physical vapor deposition (PVD) process of sputtering, leveraging front-end packaging technologies to back-end packaging applications. However, sputtering technology challenges in scalability and cost along with advancements in dispensable materials are driving considerations for alternative dispensing techniques for EMI shielding.
Technical Library | 2021-06-15 15:17:33.0
Shielding electronic systems against electromagnetic interference (EMI) has become a hot topic. Technological advancements toward 5G standards, wireless charging of mobile electronics, in-package antenna integration, and system-in-package (SiP) adoption are driving the need to apply more effective EMI shielding and isolation to component packages and larger modules. For conformal shielding, EMI shielding materials for exterior package surfaces have mostly been applied with a physical vapor deposition (PVD) process of sputtering, leveraging front-end packaging technologies to back-end packaging applications. However, sputtering technology challenges in scalability and cost along with advancements in dispensable materials are driving considerations for alternative dispensing techniques for EMI shielding.
If you are interested in our this product, please see more at http://www.cheersonic-liquid.cn/uam6000-ultrasonic-spraying-machine/ Ultrasonic spraying technology provides a cost-effective and efficient spraying method for the package-level EMI shie
For more on HyperLynx: http://www.mentor.com/pcb/xpedition/simulation For more on HyperLynx and SerDes design: http://www.mentor.com/pcb/xpedition/simulate-si/serdes Try HyperLynx PI in the Cloud: http://www.mentor.com/products/pcb-system-design/pr
Events Calendar | Wed Apr 26 00:00:00 EDT 2017 - Thu Apr 27 00:00:00 EDT 2017 | Paris, France
2017 RaMP Workshop and Tabletop Exhibition
International Microelectronics Assembly and Packaging Society (IMAPS)
Career Center | Rochester, New York USA | Engineering
Our high tech client located in the Western NY State area offers you the following challenge. Complete mechanical design responsibility from specification to the manufacturing process. We seek a candidate that has the following experience: Design
Career Center | Anaheim, California USA | Engineering
Required Skills: 7 to 10 years� experience with the electrical and mechanical design and / or oversight of power converters, power supplies or related products requiring magnetic devices for functionality. Demonstrated experience in the development
(EMI) has become a hot topic. Technological advanc
SMTnet Express, March 31, 2016, Subscribers: 24,152, Companies: 14,760, Users: 39,935 EMI-Caused EOS Sources in Automated Equipment Vladimir Kraz; OnFILTER, Inc. Electrical overstress causes damage to sensitive components, including latent damage
Imagineering, Inc. | https://www.pcbnet.com/blog/how-to-reduce-emi-in-printed-circuit-boards/
How to Reduce EMI in Printed Circuit Boards | Imagineering, Inc. Skip to main content Resources Support Contact Us FAQs Live Chat My Account 847-806-0003 Menu PCB Capabilities Fabrication Technology Roadmap Materials Available HDI Tolerances Certifications
| https://www.eptac.com/wp-content/uploads/eptac/datasheets/EPTAC_Brochure_PCD.pdf
. This profession is always evolving. Technology moves forward and so must the professional working in it. Someone once compared life’s challenges to a downward escalator and your goal is to ascend to the next floor
DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD is a company which mainly provide used and new SMT parts, provide repair SMT key parts service,new/used SMT machine trading,SMT consumables and Peripherals equipment,Clean room, ESD..
Manufacturer's Representative / Manufacturer / Equipment Dealer / Broker / Auctions / Distributor / Consultant / Service Provider
3th, Tangchang 3rd Road, Hengli, Dongguan City
Dongguan, China
Phone: 008615629932323
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