New Equipment | Solder Paste Stencils
DESEN Classic 1008 SPECIFICATIONS Process Parameters Specification Machine Alignment Capability ≥2 Cpk@±25μm@,6σ Process Alignment Capability ≥2 Cpk@±10μm@,6σ Cycle Time 7s Maximum
New Equipment | Solder Paste Stencils
DESEN Hito SPECIFICATIONS Process Parameters Specification Machine Alignment Capability ≥2 Cpk@±18μm@,6σ Process Alignment Capability ≥2 Cpk@±8μm@,6σ Cycle Time 7s Maximum Print Area 400mm
Electronics Forum | Tue Mar 02 22:40:52 EST 2004 | pdeuel
To clean up other replys I will add that some most all machines have global correction. Most placements are an off sets from pcb 0,0 usually the lower left corner of the board. When the machine locates the fiduitals and these fids are not exactly whe
Electronics Forum | Wed Jan 31 17:30:54 EST 2007 | GS
Thanks a lot flipit, I am not directly involved in this "problem" but is my friend that have his CM rejecting PCBs because it says the "+" mark (spokes lengths) are out of tolerances. It seams CM bonder's require tolerance +/- 0,05(? not sure). I d
Used SMT Equipment | Screen Printers
Right; Right->Left; Left-> Left; Right->Right details icon Details Print Pressure : 0kg to 20kg Print Speed : 2mm/sec to 300mm/sec Print Gap : 0mm to 6mm Squeegee : Clamped double trailing edge squeegee (1 set included) Squeeg
Used SMT Equipment | Pick and Place/Feeders
AIMEX III Flexible Placement Platforms The AIMEX III is designed for component flexibility, PCB flexibility and production flexibility. FEATURES Production for Large Panels or Simultaneous Production of Two Models The AIMEX III can support larg
Industry News | 2018-03-22 21:11:24.0
Nordson ASYMTEK introduces the new Helios™ SD-960 Series Automated Dispensing System for medium and bulk volume deposits of single- (1K) and two-component (2K) materials in electronics manufacturing and printed circuit board assembly. The Helios system is ideal to deposit volumes greater than 1cc, and line widths and dots that exceed 1mm, but it can deposit volumes down to 0.3cc and line widths as narrow as 0.3mm. The system supports highly abrasive thermal interface materials (TIM), silicones, epoxies, and grease for applications such as potting, sealing, gasketing, and structural adhesives.
Industry News | 2009-06-09 04:57:14.0
Maximum Flexibility and Reproducibility in Selective Soldering
Parts & Supplies | Pick and Place/Feeders
1. Special feature 1.1 Placing heads ("auto-tools") are exchanged automatically during production：The XPF is the world's first machine to feature dynamic head exchange.The machine can switch between a high-speed placing head and a multi-purpose hea
Parts & Supplies | Pick and Place/Feeders
Brand: FUJI Name: High Speed Multi Purpose Mounter Number Of Nozzles: 12pcs Supported Parts: 0402(1005) Lntelligent Feeders: Support For 4, 8, 12, 16, 24, 32, 44, 56, 72, 88, And 104 Mm Wide Tape Weight: 1860KG High-speed Multi-Purpose Mounter XPF
FUJI SMT Placement AIMEX III If you could not find any similar items you want, you may send some photos to us. because our catalog and website haven't included allof our products. Pick and place machine, SMT pick and place machine, FUJI SMT m
The Thermaltronics Robotic System incorporates innovative design concepts and precision components to ensure accuracy. The combination of high precision hardware and intelligent software ensures precision soldering and low operator training costs.
PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/ipc7351-padstack-naming-convention_topic36_post3503.html
= Rounded Rectangular 2mm X 1mm X 0.05mm radius corners r200_100c10 = Chamfered Rectangular 2mm X 1mm X 0.1mm chamfered corners v30h15l3-6 where “v” denotes a
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/asymtek/about-us/news/nordson-asymtek-introduces-helios-automated-fluid-dispensing-platform
) materials in electronics manufacturing and printed circuit board assembly. The Helios system is ideal to deposit volumes greater than 1 cc, and line widths and dots that exceed 1mm, but it can deposit volumes down to
