Industry Directory | Manufacturer
Reflow ovens for automated SMT PCB assembly, specializing in lead free processing and nitrogen reflow. The best convection reflow ovens on the market.
Industry Directory | Consultant / Service Provider
PCB Electronics Manufacturing Automation Software for EMS, OEM & ODM manufacturers. Over 3000 customers worldwide!
Retrofit existing system with Innovative Dispensing Technology for Excellent Dispense Control and Repeatability Advanced pump technologies available for retrofitting include: True Volumetric Pump, Precision Auger Pump, Simplified Jetting Pump and Ti
High Precision Dispensers - MAX Series (Non-Heated) Max Series is capable of a wide variety of dispense applications including MicroVolume, Solder Paste and Conductive Adhesive, Underfill, Surface Mount Adhesive, Dam and Fill, Encapsulations, LED En
Electronics Forum | Wed Jul 25 23:35:18 EDT 2001 | mugen
my guys SOP : Round #1 1) take double-side tape, and peel it flat to the PCB. 2) process this PCB only through P&P SMT. 3) confirm the SMD placement Round #2 4) take thin plastic sheet and tape corners flat to the PCB. 5) solder paste print over t
Electronics Forum | Wed Jul 25 23:37:11 EDT 2001 | mugen
my guys SOP : Round #1 1) take double-side tape, and peel it flat to the PCB. 2) process this PCB only through P&P SMT. 3) confirm the SMD placement Round #2 4) take thin plastic sheet and tape corners flat to the PCB. 5) solder paste print over t
Used SMT Equipment | SPI / Solder Paste Inspection
Vintage: 2008 Description: 3D Solder Paste Inspection Details: • 3D sensing system w/ built-in fiducial camera and lighting • MicroPad Sensor • Mechanical board stop • Auto-width adjust conveyor • Max PCB width: 20” x 20” • Max inspection
Used SMT Equipment | Screen Printers
DEK 03iX Specs: • Process alignment capability 2 Cpk @ ± 25µm 6-Sigma • Machine alignment capability 2 Cpk @ ± 12.5µm 6-Sigma • 12 second cycle time • High Throughput Conveyor (option) , enables core cycle time reduction to just 11 seconds • DE
Industry News | 2014-09-06 19:18:17.0
Briefing Co-hosted by IPC as Part of Continuing Effort to Connect IPC Members with Policymakers.
Parts & Supplies | SMT Equipment
Wiping mechanism slider (1000150) Product Name: MPM slider 1000150 SLIDE Part Number: 1000150 Description: MPM wiping mechanism slider 1000150 SLIDE Applicable models: UP; AP Printing Presses MPM wiping mechanism slider 1000150 SLIDE
Parts & Supplies | Pick and Place/Feeders
SMT basic process components include: silk screen (or dispensing), placement (curing), reflow soldering, cleaning, testing, repair 1, silk screen: its role is to paste or patch solder paste printed on the PCB pad, the components f
Technical Library | 2020-01-28 00:23:58.0
This paper explores new advances in the reflow soldering process including vacuum technology and warpage mitigation systems. The first topic for discussion will be the implementation of a vacuum process directly in a conventional inline soldering system. The second topic presented is the mitigation of warpage on substrates or wafers.
Technical Library | 2023-01-17 17:58:36.0
Heterogeneous integration has become an important performance enabler as high-performance computing (HPC) demands continue to rise. The focus to enable heterogeneous integration scaling is to push interconnect density limit with increased bandwidth and improved power efficiency. Many different advanced packaging architectures have been deployed to increase I/O wire / area density for higher data bandwidth requirements, and to enable more effective die disaggregation. Embedded Multi-die Interconnect Bridge (EMIB) technology is an advanced, cost-effective approach to in-package high density interconnect of heterogeneous chips, providing high density I/O, and controlled electrical interconnect paths between multiple dice in a package. In emerging architectures, it is required to scale down the EMIB die bump pitch in order to further increase the die-to-die (D2D) communication bandwidth. Aa a result, bump pitch scaling poses significant challenges in the plated solder bump reflow process, e.g., bump height / coplanarity control, solder wicking control, and bump void control. It's crucial to ensure a high-quality solder bump reflow process to meet the final product reliability requirements. In this paper, a combined formic acid based fluxless and vacuum assisted reflow process is developed for fine pitch plated solder bumping application. A high-volume production (HVM) ready tool has been developed for this process.
Eliminate Body Stress with Versatile CF-8 GPD's CF-8 eliminates component body stress. Versatility is the key word for the CF-8. Simple tooling changes make short or long run production jobs quick and easy. Capabilities Meets exacting military s
High Precision Dispensers - MAX Series (Non-Heated) Max Series is capable of a wide variety of dispense applications including MicroVolume, Solder Paste and Conductive Adhesive, Underfill, Surface Mount Adhesive, Dam and Fill, Encapsulations, LED En
Training Courses | | | Other Courses
Other courses related to electronics manufacturing and assembly
Training Courses | | | PCB Inspection Courses
The PCB inspection courses focus on improving PCB yield and reliability through validation and detection of defects on electronics assemblies.
Events Calendar | Thu Apr 30 00:00:00 EDT 2020 - Thu Apr 30 00:00:00 EDT 2020 | ,
Screen Printing Key Factors
Events Calendar | Fri Sep 29 00:00:00 EDT 2023 - Fri Sep 29 00:00:00 EDT 2023 | Tamaulipas, Mexico
Northeast Mexico Chapter: Kickoff Meeting
Career Center | , Florida USA | Human Resources
SMT contract manufacturing environment. Responsible for developing manufacturing processes to deliver consistently high product quality. Technical representative on Customer Satisfaction Team responsible for reviewing and implementing ECO�s, provid
Career Center | Auckland, New Zealand | Engineering
NAVMAN PCBA NPI Engineer Reporting To: PCBA NPI Technical Leader Primary Objective: Transition of PCBs from R&D design to a manufacturable state conforming to all facets of PCBA production Secondary: Develop DFM & best practice guidelines Res
Career Center | hyd, andhra pradesh India | Engineering,Production,Research and Development,Technical Support
i have a experience in smt and i acan operate europlacer and mydata machines.
Career Center | kanchipuram, Tamilnadu India | Engineering,Maintenance,Research and Development,Technical Support
Experiences : Solectron (Ems) India Ltd. Yalahanka New town, Bangalore, India Duration: AUG 2007 to Sep 2009 Designation: Process Technician (SMT) NOKIA India Pvt Ltd Sipcot Industrial area, Sriperambadur, Chennai, Duration: Sep 2009 to
GPD Global | https://www.gpd-global.com/co_website/features-camera-max.php
. You can choose to turn on/off the automatic overwrite function when storage is full. The Process View Recorder option includes Process View Recorder, Remote Control, 8GB SD card, and User Guide
Heller Industries Inc. | https://hellerindustries.com/thermal/
. Our management team creates security for you through leadership… oven innovation… and customer satisfaction. Leadership in Thermal Process Innovation Since we introduced our first full convection reflow ovens in 1987, we have brought innovations and refinements to market at an accelerating rate
