Industry Directory | Manufacturer
A leader in automated fluid dispensing, jetting, and conformal coating. Products include stand-alone dispensing workstations and fully automated, in-line conveyorized systems with advanced process controls.
Industry Directory | Consultant / Service Provider / Manufacturer
Waffletechnology� (patent pending) cleaning cards dramatically outperform normal flat cleaning cards.
New Equipment | Rework & Repair Services
BGA Rework Services Offered BGA Remove and Placement Level Three Pad Repair Wire Add Trace Repair BGA Re-Balling BGA Inspection We Rework PBGA (Plastic Ball Grid Array) TBGA (Tape Ball Grid Array) uBGA (Micro BGA) CCGA (Ceramic Colum
New Equipment | Rework & Repair Services
BGA Reballing and Solder Bumping for all types of SMD's Lead, Lead Free and Solder Alloy Conversion. Package types include but are not limited to: PBGA (Plastic Ball Grid Array) TBGA (Tape Ball Grid Array) uBGA (Micro BGA) CCGA (Ceramic Colum
Electronics Forum | Wed Feb 16 17:28:14 EST 2005 | davef
Greg: As we understand it, in your situation: * One 0805 lead solders to board properly * Another 0805 lead does not solder On the 0805 lead does not solder, there does the solder go? * On the pad * On the component lead A common solderability test
Electronics Forum | Sun Feb 28 13:51:56 EST 2021 | bengill
We have a unique connector with flat leads, i.e. the leads leave the connector body flat parallel to the pads. The leads are without a heel, they are flush with the connector body. Moreover, one can't solder beneath the connector because the leads ar
Used SMT Equipment | Soldering - Reflow
HEXI, Lead-Free reflow soldering machine, type RFN1020/N, s.n. 0611018, Left to Right, with 10 heating heads plus cooling head, lenght of heating zones 3365mm,max width of PCB 450 mm, width of conveyor 50 to 450 mm, height of conveyor 920 +/_ 20 mm,
Used SMT Equipment | AOI / Automated Optical Inspection
MIRTEC MV-7U AOI, MV 7 Series In-Line AOI Machine • In Line Type Vision Inspector for Large Boards• Windows 7 Intel Core2 Duo PC• Five Camera In-Line AOI System• 10 MP cameras with ISIS Vision• 13.4 micron um/pixel Telecentric Compound Lenses• Board
Industry News | 2003-06-18 08:04:27.0
Recently purchased and installed a new DP-1500-2X Dual-Sided Photoimageable Ink Coater from Circuit Automation
Industry News | 2003-02-13 08:16:35.0
SMT China Will be the First Magazine in China Focused Specifically on the Major Technologies and Products Used in PCB Assembly
Parts & Supplies | SMT Equipment
YAMAHA KHJ-MC10F-00 SCREW FLAT HEAD SS YAMAHA SS / YS FEEDER ELECTRIC LEAD SCREW FIXED
Parts & Supplies | SMT Equipment
YAMAHA KHJ-MC10F-00 SCREW FLAT HEAD SS YAMAHA SS / YS FEEDER ELECTRIC LEAD SCREW FIXED Kindly contact me if you are interested. Email: alice@ksunsmt.com Skype: alice@ksunsmt.com Whats app: +86 13170471806 Face book:
Technical Library | 2011-06-09 20:28:30.0
QFN Description: A QFN package is a QUAD-FLAT-NO LEAD device. This package is small and lightweight and has no leads (unlike a gull wing or J-leaded device). QFN’s have a thermal pad (paddle) on the bottom side of the part that offers heat dissipation and
Technical Library | 2011-04-07 14:50:29.0
Quad Flat No Leads (QFN) package designs receive more and more attention in electronic industry nowadays. This package offers a number of benefits including (1) small size, such as a near die-sized footprint, thin profile, and light weight; (2) easy PCB t
MPM Printer: EdgeLoc™ uses software-controlled pressure for optimal board holding force, automatically adapts to the programmed board thickness, and firmly holds the board without the use of top clamps for optimum accuracy and repeatability.
00818028-01 HOLDER 3SB19 FOR 3 SWITCH ELEMENTS 3SB1 00818084-01 PROXIMITY SWITCH 3RG4 / M14 / sn=2,5mm 00818096-01 PROXIMITY SWITCH SME-3-LED-24 00818130-01 Service-tool LZ-5 lamp puller 00833078S01 AIR PRESSURE FILTER/VALVE LFR-1/4-S7B 00
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Training Courses | | | IPC J-STD-001 Trainer (CIT)
The Certified IPC J-STD-001 Trainer (CIT) courses prepare individuals as qualified trainers in the area of producing high quality soldered interconnections and prepares them to deliver Certified IPC J-STD-001 Specialist (CIS) training.
Events Calendar | Wed Dec 02 00:00:00 EST 2020 - Fri Dec 04 00:00:00 EST 2020 | Chiba, Japan
FINETECH JAPAN - FPD Exhibition & Conference
Events Calendar | Wed Sep 11 00:00:00 EDT 2019 - Fri Sep 13 00:00:00 EDT 2019 | Ho Chi Minh City, Vietnam
NEPCON Vietnam - SMT, Testing Technologies Expo
Career Center | San Jose, California USA | Engineering,Research and Development
www.srqconsultants.com : for job reqs Type of job background: Design for Test (DFT), with ATE Test development experience, and an IC design generalist. Job Summary Must have +5 years industry experience combination in IC Design and ATE test. Som
Career Center | , | Engineering,Maintenance,Technical Support
Dear Sir/Madam, I am having the 10 years exprience in SMT field. Currently I am working in Service industry as Senior Engineer. Specially I am exprience and trained in FUJI and Speedline machines. Earlier I worked with Manufacturing Industry.
Career Center | Dargaha Road Zameen Pallavaram Chennai, Tamilnadu India | Maintenance,Technical Support
CURRENT JOB: • Responsible for four sub department as Production support, Preventive maintenance activity, Spare parts control and NPI (New product Introduction) under one Equipment department. • Take care of OEE (Overall Equipment Efficiency), MTTR
Controlling Copper Build Up in Automatic Soldering Equipment Using Lead-Free Solder News Forums SMT Equipment Company Directory Calendar Career Center Advertising About FREE Company Listing! Controlling Copper Build Up
Controlling Copper Build Up in Automatic Soldering Equipment Using Lead-Free Solder News Forums SMT Equipment Company Directory Calendar Career Center Advertising About FREE Company Listing! Controlling Copper Build Up
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)) component is usually smaller than its through-hole counterpart because it has either smaller leads or no leads at all. It may have short pins or leads of various styles, flat contacts, a matrix of solder balls (BGAs
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