New Equipment | Solder Paste Stencils
Eliminate hours of solder mask damage repair time for bga sites while improving rework yield. Are you frustrated by the time it takes to repair mask damage underneath the BGA during the rework process? Are you squeezed for space on the PCB in an
Quickturn PCB quote please sent E-mail to quotes@huanyupcb.com. ItemCapability Production TypeAlum PCB/Multilayer PCB 1-14L LaminationFR4. CEM-3. Halogen Free PCB ThicknessInner layer: min 0.1mm outer layer: 0.2-3.2mm Copper ThicknessH/
Electronics Forum | Tue Jan 26 19:43:02 EST 1999 | Ross Berntson
| hi, | i am working towards developing a no-clean process for a customer at contract manufacturing facility. the assemblies have gold fingers on them. these are masked to prevent from any damage to them during reflow soldering. the earlier proces
Electronics Forum | Tue Jan 26 19:43:26 EST 1999 | Ross Berntson
| hi, | i am working towards developing a no-clean process for a customer at contract manufacturing facility. the assemblies have gold fingers on them. these are masked to prevent from any damage to them during reflow soldering. the earlier proces
StencilQuik demonstration video. This breakthrough method allows you to simplify placement/replacement saving 50% or more of time required to rework BGAs or CSPs.This is a well developed BGA rework method. More on the StencilQuik(TM) process here:
