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New Equipment | Rework & Repair Equipment
Patented Inductive-Convection Heating Technology Provides Ultimate Thermal Performance Conventional resistance coil heating technology has been successfully used in convective rework stations for decades to install and remove a variety of BGA, QFN,
Electronics Forum | Tue Mar 26 06:07:58 EDT 2019 | pooja_4t
Hi i am referring Tin whisker report JESD201A class 2 standard from Vishay. i can see at TC -55/85C using pbfree reflow there are 0 growth at 500&1000 cycles. for snpb reflow and the same temperature and same cycle significant growth can be found. my
Electronics Forum | Fri Jun 07 12:34:30 EDT 2019 | teejsd
C3 just uses heated DI water that it applies, then pulls back into a disposable cartridge. Machine then applies a 10V charge to the sample & measures leakage current(nA,I think) over time(sec). If the leakage current is high enough/fast enough, you
Industry News | 2019-12-09 14:44:26.0
The SMT Reflow Soldering Equipment (Global) award was awarded to Heller Industries by Frost & Sullivan.
Industry News | 2020-02-01 05:16:10.0
IPC announced today the December2019findings from its North American Printed Circuit Board (PCB) Statistical Program.The book-to-bill ratiostands at1.09.
Technical Library | 2019-05-29 16:04:52.0
Scheugenpflug focuses on e-mobility and autonomous driving and, with its high-quality dispensing solutions, is accompanying an imminent turn of events in the growth field of mobility.
Technical Library | 2019-06-20 00:09:49.0
It is well known that during service the layer of Cu6Sn5 intermetallic at the interface between the solder and a Cu substrate grows but the usual concern has been that if this layer gets too thick it will be the brittleness of this intermetallic that will compromise the reliability of the joint, particularly in impact loading. There is another level of concern when the Cu-rich Cu3Sn phase starts to develop at the Cu6Sn5/Cu interface and an imbalance in the diffusion of atomic species, Sn and Cu, across that interface results in the formation at the Cu3Sn/Cu interface of Kirkendall voids, which can also compromise reliability in impact loading. However, when, as is the case in some microelectronics, the copper substrate is thin in relation to the volume of solder in the joint an overriding concern is that all of the Cu will be consumed by reaction with Sn to form these intermetallics.This paper reports an investigation into the kinetics of the growth of the interfacial intermetallic, and the consequent reduction in the thickness of the Cu substrate in solder joints made with three alloys, Sn-3.0Ag-0.5Cu, Sn-0.7Cu-0.05Ni and Sn-1.5Bi-0.7Cu-0.05Ni.
TI New and Origina INA146UA in Stock IC SOP8, 2019+ package INA146UA High Voltage Programmable Gain Differential Amplifier Today's Hot Deals： ATSAML21J18B-UUT WLCSP-64 MICROCHIP 22+ L9678P LQFP-64 ST 20+ TSS-44 SMD MINI-CIRCUITS 19+ SPH-002
Microchip New and Origina 24AA04T-I/SN in Stock IC SOP8, 2019+ package 24AA04T-I/SN 4K/8K1.8VI2CSerialEEPROMs Today's Hot Deals： ATSAML21J18B-UUT WLCSP-64 MICROCHIP 22+ L9678P LQFP-64 ST 20+ TSS-44 SMD MINI-CIRCUITS 19+ SPH-002T-P0.5S JST N/
Events Calendar | Thu Jan 17 00:00:00 EST 2019 - Thu Jan 17 00:00:00 EST 2019 | St Paul, Minnesota USA
SMTA Upper Midwest Chapter - Designing Flexible Circuits with Successful Assembly in Mind
Events Calendar | Wed Dec 01 00:00:00 EST 2021 - Wed Dec 01 00:00:00 EST 2021 | ,
Wine Down Wednesday: Driving Innovation through Intrapreneurship
Career Center | Buffalo, New York USA | Engineering
This opportunity offers growth & visibility within the organization! You'll be challenged and asked to push the limits… flex/rigid boards, multi layer, mixed technologies (RF, power, digital) etc... • Design VERY complex, h
Career Center | Buffalo, New York USA | Production
GNR has been retained by a leading High-Tech SMT Electronics organization searching for an experience individual to Lead Manufacturing & Process req’s for very complex products. This is a fast-paced, high mix – low volume environme
Career Center | Lalkua, India | Engineering,Maintenance,Production,Quality Control,Research and Development,Technical Support
Machine maintenance Service and support knowledge with customer satisfactory. Deal with customers at all level via phone,remote and mail.Sound knowledge of PCB fabrication machine.
Career Center | Chandigarh, India | Engineering,Maintenance,Management,Production,Technical Support
1.Installation of Machines at Customer Workshop / Work area. 2.Provide training to the customer on Machines after Installation. 3.Meticulously Maintaining the AMC contract, spare parts inventory of the all SMT Machines. 4.Ensuring maximum customer s
SMTnet Express, June 20, 2019, Subscribers: 32,068, Companies: 10,815, Users: 24,854 Dissolution in Service of the Copper Substrate of Solder Joints Credits: Nihon Superior Co., Ltd. It is well known that during service the layer of Cu6Sn5
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/select/about/news/nordson-select-announces-new-north-american-facility-to-accommodate-growth
Growth Nordson SELECT Announces New North American Facility to Accommodate Growth 2019-04-02 New Liberty Lake facility greatly expands capabilities to serve global customers throughout Asia, Europe, and the Americas
| https://www.eptac.com/blog/how-iot-will-affect-oems-in-2019
. Several weeks into 2019, it’s important for OEMs to appreciate the growth of IoT across industries and recognize the opportunity that lays in the increased demand for capable devices and consumer products
