Industry Directory: heat cure type (31)

ETS, LLC

Industry Directory | Manufacturer

Manufacturer of Solder Reflow and Curing Ovens

IRphotonics

Industry Directory | Manufacturer

IRphotonics is a leader in the design, manufacture, and marketing of Infrared-based materials and systems.

New SMT Equipment: heat cure type (317)

860 Pressure Curing Oven (PCO)

860 Pressure Curing Oven (PCO)

New Equipment | Curing Equipment

A Pressure Cure Oven (PCO), or Autoclave, is used to minimize voiding and increase adhesion strength for bonding processes typically used in die attach and underfill applications. PCO pressurizes air into a rigid vessel and heats & cools with

Heller Industries Inc.

Time Pressure Liquid Dispensing Pump with Foot Switch or Dry Contact

Time Pressure Liquid Dispensing Pump with Foot Switch or Dry Contact

New Equipment | Dispensing

Time Pressure Liquid Dispensing Pump with Foot switch / Dry contact A great addition to Fully Automatic Dispensing System Time pressure is a versatile method of dispensing that functions across a wide range of viscosities. This dispensing method wo

GPD Global

Electronics Forum: heat cure type (731)

Conductive Adhesive and UV cure adhesives dispensing

Electronics Forum | Fri Feb 21 02:00:53 EST 2003 | successmani

Hi, I would like to know how Conductive adhesives and UV cure adhesives are dispensed. I know that nonconductive adhesives are dispensed through jetter, Auguer pump annd other contact type method. I am puzzled and curious to know whether there is any

High Temp (96/4) adhesive cure time/temp

Electronics Forum | Wed Feb 21 21:21:10 EST 2001 | davef

Gary: It doesn't matter what you use to cure your glue. SMA adhesives are thermosets. This means they become hard on cure and this is not reversible. A couple of things go on with SMA adhesives when you heat them. * Their rheology is temperature

Used SMT Equipment: heat cure type (83)

Hexi RFN1020/N

Hexi RFN1020/N

Used SMT Equipment | Soldering - Reflow

HEXI, Lead-Free reflow soldering machine, type RFN1020/N, s.n. 0611018, Left to Right, with 10 heating heads plus cooling head, lenght of heating zones 3365mm,max width of PCB 450 mm, width of conveyor 50 to 450 mm, height of conveyor 920 +/_ 20 mm,

Baja Bid

Essemtec 2022 Essemtec RO300FC Reflow O

Essemtec 2022 Essemtec RO300FC Reflow O

Used SMT Equipment | Soldering - Reflow

2022 Essemtec RO300FC Reflow Oven Demo Never Used in Production Reflow Oven The Essemtec RO300FC is a full convection reflow oven designed for the reflow soldering of lead-free solder pastes and the curing of adhesives. Here are some key features

Parker SMT

Industry News: heat cure type (373)

Heller Industries Mark 5 Wins 2012 VISION Award

Industry News | 2012-05-11 20:35:45.0

Heller Industries has been awarded a 2012 SMT VISION Award in the category of Soldering Reflow for its 1936 Mark 5 Reflow Oven. The award was presented on April 25, 2012 at the Nepcon China Exhibition.

Heller Industries Inc.

Heller Industries Commended by Frost & Sullivan for Delivering Unmatched Customer Value through Its Reflow Soldering Technology

Industry News | 2019-12-09 14:44:26.0

The SMT Reflow Soldering Equipment (Global) award was awarded to Heller Industries by Frost & Sullivan.

Heller Industries Inc.

Parts & Supplies: heat cure type (69)

Assembleon AX ETX BOARD WITH HEAT SINK

Assembleon AX ETX BOARD WITH HEAT SINK

Parts & Supplies | SMT Equipment

5322 276 20502 SWITCH ACCESSARY 1 151.38 Service Parts - New 5322 276 20503 MAIN SWITCH 210.84 Service Parts - New 5322 276 80336 INT.KEYBOARD ASSY 3,524.15 Service Parts - New 5322 277 11041 SWITCH, OTHERS 404.33 Service Parts - New 5322 277 110

Qinyi Electronics Co.,Ltd

Panasonic Panasonic bm123 BM221 0402 0603 0805 M ML

Panasonic Panasonic bm123 BM221 0402 0603 0805 M ML

Parts & Supplies | SMT Equipment

Panasonic bm123 BM221 0402 0603 0805 M ML Parameters: Brand:panasonic Type:0402 0603 0805 M ML nozzle Application:bm123 BM221 smt machine Nozzle advantage: 1.The body adopts imported material, processing and heat treatment, durable. 2.The no

KingFei SMT Tech

Technical Library: heat cure type (13)

Optimizing Reflowed Solder TIM (sTIMs) Processes for Emerging Heterogeneous Integrated Packages

Technical Library | 2023-01-17 17:12:33.0

Reflowed indium metal has for decades been the standard for solder thermal interface materials (solder TIMs or sTIMs) in most high-performance computing (HPC) TIM1 applications. The IEEE Heterogeneous Integration Thermal roadmap states that new thermal interface materials solutions must provide a path to the successful application of increased total-package die areas up to 100cm2. While GPU architectures are relatively isothermal during usage, CPU hotspots in complex heterogeneously-integrated modules will need to be able to handle heat flux hotspots up to 1000W/cm2 within the next two years. Indium and its alloys are used as reflowed solder thermal interface materials in both CPU and GPU "die to lid/heat spreader" (TIM1) applications. Their high bulk thermal conductivity and proven long-term reliability suit them well for extreme thermomechanical stresses. Voiding is the most important failure mode and has been studied by x-ray. The effects of surface pretreatment, pressure during reflow, solder flux type/fluxless processing, and preform design parameters, such as alloy type, are also examined. The paper includes data on both vacuum and pressure (autoclave) reflow of sTIMs, which is becoming necessary to meet upcoming requirements for ultralow voiding in some instances.

Heller Industries Inc.

Precision Control in Electronic Assembly: Selective Wave Soldering Machine

Technical Library | 2024-02-26 09:08:23.0

Precision Control in Electronic Assembly: Selective Wave Soldering Machine Discover the technical features of I.C.T's Selective Wave Soldering Machines, including precision flux application and innovative preheating systems. Learn how these machines redefine efficiency and reliability in electronic assembly. Introduction: Enhancing Precision Soldering: Technical Features of Selective Wave Soldering Machines by I.C.T Explore the innovative design and operation of I.C.T's Selective Wave Soldering Machines, featuring a seamless PCB handling system and modular design for enhanced assembly line flexibility. Experience precision control and efficiency with comprehensive PC controls, allowing easy adjustment of solder parameters like temperature and flux type. Automatic calibration and CCD mark positioning ensure consistent soldering quality. Detail Excellence: Enhancing Selective Wave Soldering Technology Flux System Mastery German high-frequency pulse injection valve ensures precise flux application. Optional flux nozzle jam detection simplifies maintenance. Pressure tank and precision pressure flow meter ensure consistent flux control. Preheat System Excellence Bottom IR preheating system ensures stability and efficiency. Maintenance is simplified with a tool-free mode and plug-in design. Soldering System Innovation Swedish "PRECIMETER" electromagnetic pump coil ensures stability. Stainless steel soldering pot prevents tin liquid leakage. N2 online heating system reduces solder dross. Transmission System Mastery Specially designed material profiles ensure operational stability. Thickened customized rails guarantee flawless operation. Control and Intelligence Keyence PLC+module high-end bus control system ensures stability. Industry 4.0 compliance allows guided programming and real-time data visualization. Market Promotion and Success Stories: Elevating Selective Wave Soldering Machine I.C.T's strategic market positioning has led to global success across diverse industries. Success stories from European clients highlight reliability and trust in the machine. Over 70 units sold across 20+ countries since 2022, establishing its industry-leading position. Conclusion Conclusion: I.C.T's Selective Wave Soldering Machine combines technical excellence with global market success, solidifying its leadership in precision soldering technology.

I.C.T ( Dongguan ICT Technology Co., Ltd. )

Videos: heat cure type (130)

General curing, die attach curing, underfill curing, film & tape bonding, wafer laminating.

General curing, die attach curing, underfill curing, film & tape bonding, wafer laminating.

Videos

General curing, die attach curing, underfill curing, film & tape bonding, wafer laminating.

Heller Industries Inc.

Time Pressure with Real Time Process Control FPC

Time Pressure with Real Time Process Control FPC

Videos

Time Pressure Liquid Dispensing Pump with Foot switch / Dry contact A great addition to Fully Automatic Dispensing System Time pressure is a versatile method of dispensing that functions across a wide range of viscosities. This dispensing method wo

GPD Global

Training Courses: heat cure type (4)

BGA Inspection, Rework and Repair Course

Training Courses | | | PCB Inspection Courses

The PCB inspection courses focus on improving PCB yield and reliability through validation and detection of defects on electronics assemblies.

ACI Technologies, Inc.

Circuit Card Assembly Online Course

Training Courses | ONLINE | | PCB Assembly Courses

The PCB assembly courses provide knowledge of different processes and equipment used in TH and SMT assembly of printed circuit boards.

Automated Learning

Events Calendar: heat cure type (4)

Webinar: BGA and Area Array Process Defects - Causes & Cures

Events Calendar | Tue Feb 12 00:00:00 EST 2019 - Tue Feb 12 00:00:00 EST 2019 | ,

Webinar: BGA and Area Array Process Defects - Causes & Cures

Surface Mount Technology Association (SMTA)

Europe Chapter Webinar: Tombstoning Components during Reflow Soldering - Causes & Cures

Events Calendar | Mon Apr 12 00:00:00 EDT 2021 - Mon Apr 12 00:00:00 EDT 2021 | ,

Europe Chapter Webinar: Tombstoning Components during Reflow Soldering - Causes & Cures

Surface Mount Technology Association (SMTA)

Career Center - Jobs: heat cure type (3)

Manufacturing Engineer, Process Engineer, Aerospace Structures

Career Center | , Mississippi USA | Engineering,Production

About The Company: This company is a supplier of aerospace and defense products to the U.S. Government and its allies and major prime contractors. This company holds market leadership positions in munitions, smart weapons and precision capabilities

PASS Network

Maintenance Technician

Career Center | Meridian, Idaho USA | Maintenance

Western Electronics, a high tech contract manufacturing company is currently recruiting for a Maintenance Technician responsible for overall maintenance and repair of production equipment. Position responsibilities include: Troubleshoot and debu

Western Electronics

Career Center - Resumes: heat cure type (6)

SMT Engineer

Career Center | Cavite, Philippines | Engineering,Technical Support

I had 15 years Handling SMT Equipment.

Pedro Gomes

Career Center | , Portugal | Engineering,Maintenance,Production,Quality Control,Technical Support

SMT Process engineer Quality Efficiency Continuous improvement 11 years of experience in high volume production in a Japanese corporation Expertise in: Solder paste printing (DEK, Panasonic) Adhesive dispensing (FUJI, Panasonic) Components Pick and p

Express Newsletter: heat cure type (551)

Thermal Spot Curing of Adhesives with Photonic Energy; a novel fiber delivery method of radiant heating to accelerate the polymerization of thermally active adhesives

Thermal Spot Curing of Adhesives with Photonic Energy; a novel fiber delivery method of radiant heating to accelerate the polymerization of thermally active adhesives Thermal Spot Curing of Adhesives with Photonic Energy; A novel fiber delivery

Partner Websites: heat cure type (3198)

Select Cure UV-9 Cure Oven | Nordson ASYMTEK

ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/asymtek/products/curing/select-cure-uv-9-cure-oven

:2015 Contact Us Order Spare Parts Get Technical Service Contact Sales Get Local Support Global Locations Back  | Nordson ASYMTEK Home Product Type Curing Equipment Select Cure UV-9 Cure Oven Related Information Brochures Select Cure UV-9 - English Select Cure UV-9 Cure Oven Nordson ASYMTEK's Select Cure ®

ASYMTEK Products | Nordson Electronics Solutions

High Temperature PCB: Considerations for High-Heat Applications

Imagineering, Inc. | https://www.pcbnet.com/blog/high-temperature-pcb-considerations-for-high-heat-applications/

: heat distribution, and materials that are able to withstand extreme heat. Because materials play such a critical role in this type of PCB design, the process is also known as High-Tg PCB manufacturing, and requires expertise in thermal design

Imagineering, Inc.


heat cure type searches for Companies, Equipment, Machines, Suppliers & Information

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Circuit Board, PCB Assembly & electronics manufacturing service provider

High Precision Fluid Dispensers
pressure curing ovens

High Throughput Reflow Oven
Fluid Dispensing, Staking, TIM, Solder Paste

Software programs for SMT placement and AOI Inspection machines from CAD or Gerber.
SMT feeders

World's Best Reflow Oven Customizable for Unique Applications
design with ease with Win Source obselete parts and supplies

Training online, at your facility, or at one of our worldwide training centers"