Industry Directory | Consultant / Service Provider / Manufacturer
C-Tech Systems, B.V. [formerly Nordson DIMA] supplies Hot Bar Bonding and Soldering equipment that is supported by a global service network. We offer customer-inspired solutions in a range of industries.
At Advantage Plastic Products, our many years of processing experience translate to quality products manufactured to your specifications on a consistent basis. We work with many engineering and commodity grade resins including but not limited to Nylo
Antennas exist in all communication equipment and in a broad range of electronics. The industries that use antennas range from telecom to medical industry to military applications. Current antennas are much smaller than previous generations and, in m
Electronics Forum | Tue May 28 18:23:15 EDT 2019 | slthomas
TDK makes the CGA series "soft termination" caps. The p/n we use is CGA3E3X7S1A225K080AE, which will get you in the ball park for datasheets. We have moved to this to counter some variability in a heat staking machine (that we have yet to work out
Electronics Forum | Wed Sep 23 13:27:55 EDT 1998 | Dave F
All y'all, We use two methods to secure/stake jumper wires to boards: 1 Jumper wires that "magically" bond themselves when heated with a "U" shaped tip on a soldering iron. 2 Loctite 382 Tak Pak We use Tak Pak "99&44/100ths" more often than the "magi
Industry News | 2003-04-15 08:23:22.0
Metral TINT back panel receptacles are compatible with standard pin-in-paste SMT processes, eliminating costly secondary assembly operations including heat staking, wave soldering or press fitting.
Industry News | 2017-07-17 19:09:09.0
Nordson DIMA has launched a new web site, www.nordsondima.com. The newly designed site makes it easier for visitors to learn about Nordson DIMA's full line of hot bar reflow soldering, heat seal bonding, ACF laminating, and heat staking solutions. A second website, www.dimadispensing.eu, was updated to cover the dispensing product lines that are exclusively available for the European region.
| https://www.eptac.com/wp-content/uploads/2021/11/webinar_eptac_05_19_10.pdf
Added moisture sensitive and process sensitive component usage – 3.8 Changed gold removal process - 4.5.1 Added heat shrinkable soldering devices - 4.19
