Industry Directory | Manufacturer
A Manufacturer of High Quality, Precision, Automated Fluid Dispensing and Conformal Coating Systems, SMT Cover Tape Peel Tester and Lead Forming machines for through-hole component preparation.
Industry Directory | Consultant / Service Provider / Manufacturer / Standards Setting / Certification / Training Provider
Blackfox is the industry leader in providing IPC Certifications, Solder Training, Customized Training Programs, and Counterfeit Component Training and Certification.
The World's Best Convection Reflow Oven The ultimate high volume production reflow oven with belt speeds up to 1.4 m/min to accommodate the fastest pick and place systems. Lead Free Certified reflow oven! Maintenance Free! Lowest Nitrogen &
The World's Best SMT Convection Reflow Ovens for Large Boards and Dual Lane 1826 Mark 5 reflow oven provides consistent performance for high volume reflow requirements while minimizing preventative maintenance and floorspace. Lead Free Certified!
Electronics Forum | Mon Aug 06 10:05:23 EDT 2007 | davef
IPC-A-610 has a section on high voltage soldering
Electronics Forum | Mon Aug 06 05:12:20 EDT 2007 | wayne_
Hi Is there any standard or requirement to test the solder under high power operation? For example, a power switching device, what is the failure mode of the solder joint after the whole equipment undergone a high power (current / voltage) environmen
Used SMT Equipment | Pick and Place/Feeders
2004 Mydata MY 12 SMT Pick and Place Power: 210 / 121VAC; 3 Phase Machine Dimensions: 132" x 48" x 60" Features: Electrical two-pole test Optical Centering HYDRA; HYDRA High Speed Z High Speed; Autoteach Line Scan Software Version 2.4.6b
Used SMT Equipment | Pick and Place/Feeders
Software: 2.9.x T3 Linear Table Electrical Two-Pole Test Electrical Transistor Test Optical Centering Conveyor Shared Databases Hydra Z High Speed Hydra High Speed Autoteach Linescan for Z Line Mode Fast Place Sequence
Industry News | 2023-10-18 17:43:18.0
HELLER's High UPH Vacuum Reflow Oven clinched the coveted "Step-by-Step Excellence Awards" - Innovation Award owing to its industry-leading product strength and outstanding performance.
Industry News | 2013-08-15 20:58:22.0
Heller Industries announced today that they have entered into a joint development agreement with International Business Machines Corporation (NYSE: IBM), to collaborate on the development of fluxless mass reflow furnace equipment and process for high volume manufacturing. The fluxless process utilizes gas phase formic acid to replace standard fluxing agents, and eliminates the need for pre-reflow fluxing and post-reflow flux cleanup steps.
Parts & Supplies | SMT Equipment
DSC01590 High-speed solenoid valve head
Parts & Supplies | SMT Equipment
DSC01589 High-speed solenoid valve head
Technical Library | 2023-01-17 17:58:36.0
Heterogeneous integration has become an important performance enabler as high-performance computing (HPC) demands continue to rise. The focus to enable heterogeneous integration scaling is to push interconnect density limit with increased bandwidth and improved power efficiency. Many different advanced packaging architectures have been deployed to increase I/O wire / area density for higher data bandwidth requirements, and to enable more effective die disaggregation. Embedded Multi-die Interconnect Bridge (EMIB) technology is an advanced, cost-effective approach to in-package high density interconnect of heterogeneous chips, providing high density I/O, and controlled electrical interconnect paths between multiple dice in a package. In emerging architectures, it is required to scale down the EMIB die bump pitch in order to further increase the die-to-die (D2D) communication bandwidth. Aa a result, bump pitch scaling poses significant challenges in the plated solder bump reflow process, e.g., bump height / coplanarity control, solder wicking control, and bump void control. It's crucial to ensure a high-quality solder bump reflow process to meet the final product reliability requirements. In this paper, a combined formic acid based fluxless and vacuum assisted reflow process is developed for fine pitch plated solder bumping application. A high-volume production (HVM) ready tool has been developed for this process.
Technical Library | 2023-01-17 17:35:07.0
After years of concentration on resolving productivity- related concerns such as increasing speed, consistency and throughput while reducing costs, many of the world's leading electronics manufacturers have added a new mandate to their agendas. They are seeking to minimize the environmental impacts of their assembly processes and final products without sacrificing the high levels of productivity and quality that have been achieved through decades of effort.
Increase productivity, improve quality, reduce costs with vertical format curing solutions from Heller Industries. Learn more: http://www.hellerindustries.com/755-Vertical-Oven.php
http://www.gpd-global.com Tilt-and-Rotate configuration is available. Full featured programming makes conformal coating processes quick and easy. 3-axis Conformal Coating System for printed circuit boards that provides a reliable robotic platform f
Training Courses | | | IPC J-STD-001 Trainer (CIT)
The Certified IPC J-STD-001 Trainer (CIT) courses prepare individuals as qualified trainers in the area of producing high quality soldered interconnections and prepares them to deliver Certified IPC J-STD-001 Specialist (CIS) training.
Training Courses | | | IPC J-STD-001 Space Trainer (CIT)
The IPC J-STD-001 Space Addendum (CIT) certification courses allow individuals to conduct Certified IPC J-STD-001 Space Addendum Specialist (CIS) training.
Events Calendar | Tue May 12 00:00:00 EDT 2020 - Thu May 14 00:00:00 EDT 2020 | Baltimore, Maryland USA
IPC High Reliability Forum
Events Calendar | Mon Nov 25 00:00:00 EST 2019 - Mon Nov 25 00:00:00 EST 2019 | ,
Webinar: Overcoming Challenging X-Ray Problems
Career Center | Rolling Meadows, Illinois USA | Production
Family-oriented specialized PCB test, rework and repair facility seeks several highly skilled technicians. If you are highly skilled then come work with among the best soldering and PCB test and repair technicians in the US. Relevant Work Experience
Career Center | Westbury, New York USA | Management
Job Location: Northeast U.S. Salary: $200,000+ package Company: An internationally recognized pioneer and leader in the manufacture of high-tech wireless, hand-held devices. Position Description: Provide manufacturing leadership and growth to
Career Center | GOBICHETTIPALAYAM, India | Engineering
PCB design, layout and packaging of high-speed, high-density, Mixed Technology Analog / Digital signals & RF signals, Flex, Rigid board, Commercial, Application Boards, based on client requirement and Quality Inspection of the design.
Career Center | Raymond, USA | Engineering,Maintenance,Management,Production,Technical Support
Expert knowledge of circuit board manufacturing for the through-hole and Surface Mount Technology industry, international and national field work to manufacturers. Provided high value technical assistance and formal training to industry standards. Sp
SMT Express, Volume 3, Issue No. 5 - from SMTnet.com Volume 3, Issue No. 5 Thursday, May 17, 2001 Featured Article Return to Front Page Book Review Reviewed by Dave Fish (davef ), Pandion Electronics, Inc. Title: High-Speed Digital System
Imagineering, Inc. | https://www.pcbnet.com/blog/high-temperature-pcb-considerations-for-high-heat-applications/
High Temperature PCB: Considerations for High-Heat Applications Skip to main content Resources Support Contact Us FAQs Live Chat My Account 847-806-0003 Menu PCB Capabilities Fabrication Technology Roadmap Materials
GPD Global | https://www.gpd-global.com/high-precision-dispenser.php
High Precision Dispenser Home Products Fluid Dispensing Equipment High Precision Dispenser - MAX Series Large Format Board Dispensing - DS Series Table Top Dispensing Equipment Loader
