Industry Directory | Consultant / Service Provider / Equipment Dealer / Broker / Auctions
AllSurplus is the world's leading marketplace for business surplus, ranging from heavy equipment and industrial machinery to electronic manufacturing and aerospace surplus. A scalable platform to manage buying or selling surplus.
MEI specializes in low-to-medium volume, higher complexity electronic assemblies.
Affordable Manufacturing Execution System (MES), Shop Floor Automation and Integration Software CELLS WORKFLOW Product Tracking MES is an affordable full Manufacturing Process Control Software System providing Plant Intelligence for any industry.
New Equipment | Selective Soldering
Higher Yield - Higher Productivity - Fewer Operators with the Model ZM-R8000B Hot Air BGA Rework Station from Precision PCB Services, Inc. Automatic BGA Rework Station uses machine vision to automatically align component to the circuit board. Nit
Electronics Forum | Thu Jun 08 16:46:07 EDT 2006 | proy
I would like to use a no clean paste on an assembly, but seams most no cleans only get to SIR values of 10 E10 or so. Can anybody recommend something with a higher SIR residue? Peter
Electronics Forum | Mon Jun 12 10:34:47 EDT 2006 | Bob R.
What's wrong with 10E10? 100 Mohms (1E8) is a pretty standard lower limit so you're a few orders of magnitude better than needed.
Used SMT Equipment | SMT Equipment
Product Name: FX-2 high speed modular chip mounter Product number: FX-2 Detailed product introduction Characteristic： Mount work efficiency is increased by 20%, *1 at the same time to make economic benefits, operating performance, reliability of
Used SMT Equipment | Pick and Place/Feeders
Product Name: FX-2 high speed modular chip mounter Product number: FX-2 Detailed product introduction Characteristic： Mount work efficiency is increased by 20%, *1 at the same time to make economic benefits, operating performance, reliability of
Industry News | 2011-01-12 17:48:44.0
GPD Global will highlight its Positive Cavity Displacement (PCD) Dispensing in Booth #6111 at the upcoming Automation and Technology West Expo (ATX), scheduled to take place February 8-10, 2011 at the Anaheim Convention Center in Anaheim, CA.
Industry News | 2011-02-04 01:47:14.0
GPD Global will highlight its Positive Cavity Displacement (PCD) Dispensing at the upcoming SMTA Dallas Expo & Tech Forum, scheduled to take place Tuesday, March 1, 2011 at the Richardson Civic Center in Richardson, TX.
Parts & Supplies | Pick and Place/Feeders
Universal GSM 08MPFX small plate nozzle Head Type: Flexjet 07/07+/09 (7-Spindle) Type: Nozzle Nozzle Part #: 48503409 Description: 08MPFX Ceramic Vented Multi-Port Nozzle (FJ) Nozzle Style: Standard Nozzle ID: 08MPFX Nozzle Description: 08MPF
Parts & Supplies | SMT Equipment
SMT Cleanroom Microfibre Wiper paper Applications: Superior for spill control and general wiping in Class10~1,000 environments; Cleaning and polishing the products TFT-LCD, Optical and other critical industries etc.request; Maintaining critica
Technical Library | 2023-01-17 18:07:31.0
To achieve higher levels of consistency in PCB output, process engineers are able to maintain tighter controls and reduce process-related defects by using closed-loop process controls. At every stage of assembly, from screen printing through placement to reflow, closed-loop systems help control the variable factors that can have adverse effects on the process.
Technical Library | 2023-01-17 17:58:36.0
Heterogeneous integration has become an important performance enabler as high-performance computing (HPC) demands continue to rise. The focus to enable heterogeneous integration scaling is to push interconnect density limit with increased bandwidth and improved power efficiency. Many different advanced packaging architectures have been deployed to increase I/O wire / area density for higher data bandwidth requirements, and to enable more effective die disaggregation. Embedded Multi-die Interconnect Bridge (EMIB) technology is an advanced, cost-effective approach to in-package high density interconnect of heterogeneous chips, providing high density I/O, and controlled electrical interconnect paths between multiple dice in a package. In emerging architectures, it is required to scale down the EMIB die bump pitch in order to further increase the die-to-die (D2D) communication bandwidth. Aa a result, bump pitch scaling poses significant challenges in the plated solder bump reflow process, e.g., bump height / coplanarity control, solder wicking control, and bump void control. It's crucial to ensure a high-quality solder bump reflow process to meet the final product reliability requirements. In this paper, a combined formic acid based fluxless and vacuum assisted reflow process is developed for fine pitch plated solder bumping application. A high-volume production (HVM) ready tool has been developed for this process.
www.unisoft-cim.com/cells.html - CELLS WORKFLOW is affordable, simple to setup & use yet powerful product & job tracking software for fast New Product Introduction (NPI). The CELLS WORKFLOW software provides total traceability in manufacturing floor
The MPM Momentum II is a proven, highly productive printer platform with a new set of enhanced technologies for further improvement around machine productivity, yield, ease of use, and flexibility.
Training Courses | | | PCB Assembly Courses
The PCB assembly courses provide knowledge of different processes and equipment used in TH and SMT assembly of printed circuit boards.
Training Courses | | | PCB Design Courses
The PCB design courses teach students the process, techniques and tools needed to design layout of printed circuit boards.
Events Calendar | Tue Apr 21 00:00:00 EDT 2020 - Thu Apr 23 00:00:00 EDT 2020 | Amsterdam, Netherlands
Electronics in Harsh Environments Conference
Events Calendar | Tue Jul 17 00:00:00 EDT 2018 - Wed Jul 18 00:00:00 EDT 2018 | ,
Fan Out Packaging- Technology Overview and Evolution - SMTA Webtorial
Career Center | Clinton, Connecticut USA | Production
Assembler position available for contract manufacturer of printed circuit board assemblies. Includes soldering and mechanical assembly. Full time position with good benefits. Higher pay for those applicants that have or can display soldering skills.
Career Center | Clinton, Connecticut USA | Production
Assembler position available for contract manufacturer of printed circuit board assemblies. Includes soldering and mechanical assembly. Full time position with good benefits. Higher pay for those applicants that have or can display soldering skills.
Career Center | sabarinathan95, India | Engineering,Maintenance,Quality Control
i am sabarinathan ap working in AVALON TECH PVT LTD at chennai as a QUALITY CONTROLLER and also have a knowledge in DEBUGGING and TESTING .i have 1 year experience in quality field.
Career Center | sabarinathan95, India | Engineering,Maintenance,Quality Control,Engineering,Maintenance,Quality Control,Engineering,Maintenance,Quality Control,Engineering,Maintenance,Quality Control
i am sabarinathan ap working in AVALON TECH PVT LTD at chennai as a QUALITY CONTROLLER and also have a knowledge in DEBUGGING and TESTING .i have 1 year experience in quality field.
Dermid Inc. Higher functionality, higher performanc
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110-E6134706000 Juki 32mm Feeder Higher Column Smt Spare Parts Juki Feeder Parts Leave a Message We will call you back soon! Your message must be between 20-3,000 characters
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. In addition to higher temperatures, most lead-free solder pastes require an extended period of time at liquidus — usually 60 to 90 seconds — rather than the traditional
