Industry Directory | Manufacturer
Manufacturer of PCB depaneling and PCB soldering machines since 2005, products include CE approval V-groove PCB depanelizer, PCB router, PCB punching machine, laser depaneling, hot bar soldering machines and soldering robots.
Industry Directory | Training Provider
Oniste solder training IPC certified or customized. Master IPC trainer, train the trainer programs available. Let us come to you, cost effective, no travel.
New Equipment | Rework & Repair Equipment
Standard Flat Reamer/Straight Fork Tip (SH-20A) (5 1/2") Description: Straight Flat Reamer Miniature (left) & Standard (right) Tools with the Miniature Straight Flat Reamer: SH-20C, SH-20E Tools with the Standard Straight Flat Reamer: SH
New Equipment | Rework & Repair Equipment
Standard Flat Reamer/Straight Fork Tip (SH-20A) (8") Description: Straight Flat Reamer Miniature (left) & Standard (right) Tools with the Miniature Straight Flat Reamer: SH-20C, SH-20E Tools with the Standard Straight Flat Reamer: SH-20A
Electronics Forum | Wed Jun 12 04:02:00 EDT 2019 | liyunqiong
SMT reflow soldering temperature setting and process flow: The influence of SMT reflow process parameters on the key parameters of reflow soldering temperature curve provides reference for the setting and adjustment of reflow soldering process para
Electronics Forum | Mon Nov 01 21:50:32 EST 1999 | chartrain
No clean flux is really a misnomer. What is often taken to mean no residue in effect means no visible residue. Because you can't see it doesn't mean it isn't here. Many manufacturers have been through this same learning curve. The goal with a no clea
Used SMT Equipment | Soldering - Selective
Hot Bar Soldering Flex Circuit to PCB Ribbon Cable to PCB Coaxial Cables Fine Pitch SM Devices Edge Connectors to PCB Thermocompression Bonding Tab to PCB, HSC to LCD or tab More information pjbril@smtunion.com m.madera@smtunion.com W
Used SMT Equipment | Soldering - Selective
Thermode Length 100mm, Stroke 50mm, Flex Bond 1/2inch Force 10 to 100N @ Bar Preheat/Reflow 0-200 Seconds Work Area 260X200mm Temp Range 25 to 400c in 1 degree Intervals Voltage 110/220 CCD Camera System with Monitor Condi
Industry News | 2016-02-27 22:07:08.0
GPD Global will exhibit in Booth#1818 at the upcoming IPC APEX EXPO 2016 Conference and Exhibition. See a live demonstration of 01005 dispensing on the MAX series high precision dispenser, the intuitively programmed Island series benchtop dispenser, and a full range of dispense pumps used on GPD dispense systems.
Industry News | 2003-06-10 08:39:25.0
New from Unitek Eapro is a series of desktop systems for hot bar bonding applications.
Parts & Supplies | Assembly Accessories
Detailed Product Description Features: 7 Channel Brand: KIC Part Name: X5 Reflow Profiler Model: X5 Condition: Original New Leadtime: 7days KIC X5 Thermal Profiler with SPC software and RF capability For Reflow Track More Data Points With 7,
Parts & Supplies | Pick and Place/Feeders
101004 TRANSISTOR BC108 NPN 101020 POWER SUPPLY – UPRATED CURRENT 101047 SQUEEGEE MATERIAL 9.5 X 9.5 85-90 101081 CONNECTOR CIRCULAR 14WAY 97-3102A 101142 FRONT SQUEEGEE CARRIAGE 101143 OUTER MTG SQUEEGEE BLOCK 101145 COVER (TXT) 101146
Technical Library | 2023-05-02 19:16:57.0
1.5 with a 150μm specification window. For 0201 components, the minimum requirement is CpK > 2.0 with a 100μm specification window. The spec window may need to be reduced down to 75μm if the controls for high volume manufacturing are insufficient. Also directly impacting the placement quality is the ability to apply sufficient solder consistently to the board. The goal is to maintain current printing practices, but the effect of powder size will be examined. This paper will evaluate the impact of placement accuracy and solder powder size on 0201 manufacturing quality.
Technical Library | 2022-12-19 18:59:51.0
Material and Process Characterization studies can be used to quantify the harmful effects that might arise from solder flux and other process residues left on external surfaces after soldering. Residues present on an electronic assembly can cause unwanted electrochemical reactions leading to intermittent performance and total failure. Components with terminations that extend underneath the package can trap flux residue. These bottom terminated components are flush with the bottom of the device and can have small solderable terminations located along the perimeter sides of the package. The clearance between power and ground render high electrical forces, which can propagate electrochemical interactions when exposed to atmospheric moisture (harsh environments). The purpose of this research is to predict and understand the functional performance of residues present under single row QFN component packages. The objective of the research study is to develop and collect a set of guidelines for understanding the relationship between ionic contamination and electrical performance of a BTC component when exposed to atmospheric moisture and the trade-offs between electrical, ionic contamination levels, and cleanliness. Utilizing the knowledge gained from undertaking the testing of QFN components and associated DOE, the team will establish a reference Test Suite and Test Spec for cleanliness.
Yamaha YSM40R High-Speed Modular SMT Chip Mounter ❙ Features of Yamaha YSM40R Yamaha Ultra-High speed modular pick and place machine YSM40R, Yamaha modular chip mounter, Achieves revolutionary productivity of 200,00
Yamaha YSM10 Pick and Place High-speed Modular SMT Placement ❙ Features of Yamaha SMT Placement Yamaha fastest SMT placement machines , Yamaha SMT pick and place machine, Yamaha chip mounter, for SMT assembly system. pleas
Training Courses | ON DEMAND | | IPC J-STD-001 Specialist (CIS)
The Certified IPC J-STD-001 Specialist (CIS) training focuses on the knowledge and hand skills employees need to produce high-quality soldered interconnections.
Training Courses | | | IPC-A-610 Specialist (CIS)
The Certified IPC-A-610 Specialist (CIS) training focuses on the acceptance requirements for the manufacture of electrical and electronic assemblies
Career Center | , New Jersey USA | Engineering
Process Engineers SMT- Knowledge of all SMT lines. Flip Chip, BGA, experience. Skilled in Solder Paste, Pick and Place, Reflow and BGA rework equipment. Develop and analyze complex designs and develop specs and procedures
Career Center | Warminster, Pennsylvania USA | Quality Control
Inspects electronic systems, assemblies, subassemblies, components, and parts for conformance to specifications and identify/implement corrective actions among production and other staff. The Inspector should have some experience with board Inspe
Career Center | Laguna, Calabarzon Philippines | Engineering,Maintenance,Production,Technical Support
Base on my experience more on line sustaining and preventive maintenance in equipment and testing machine for electronics and semicon company Some slight skills in surface grinding,soldering and LAN connection and installation. Can submit report
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Bar Solder For Wave Soldering Toggle menu Call Us! 469-200-1289 Login or Sign Up 0 Search × Search × Main Menu Shipping & Returns Contact Us Blog Shop By Category Hand Soldering
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: n Process time: Generally 120 min or User ’ s spec n Operating temp: 60oC ~ 200oC n Maximum temp: 220oC n Operating pressure: 1 bar – 10 bar n Capacity: 24 Magazines (typical) n Cooling method: PCW (17oC – 23oC) n Cooling water pressure
