New Equipment | Rework & Repair Equipment
Patented Inductive-Convection Heating Technology Provides Ultimate Thermal Performance Conventional resistance coil heating technology has been successfully used in convective rework stations for decades to install and remove a variety of BGA, QFN,
Wouldn't it be nice to see into the future? With Sherlock by DfR Solutions, you can. Sherlock is a new Automated Design Analysis Tool that allows you to predict product failure earlier in the design process, allowing you to design reliability right
Electronics Forum | Sat Jan 21 13:49:14 EST 2023 | pcbsino
perhaps we can help you for this SMT and THT part soldering problem, better not bend it not too hard. Electronic manufacturing pcbsino.com
Electronics Forum | Wed Dec 29 15:42:34 EST 1999 | Mike Naddra
Justin, I would be currious as to your customers application, and if the temperature delta and rate are great enough to cause solder joint failures as a function of mismatched Tce then you may want to consider that even if you are able to identify
Industry News | 2018-10-18 09:46:58.0
Analysis of how to spot welding process
Industry News | 2018-12-08 03:25:54.0
Basic Soldering Guide – How to Solder Electronic Components
Technical Library | 2009-04-22 21:13:19.0
An optimal reflow profile is one of the most critical factors in achieving quality solder joints on a printed circuit board (PCB) assembly with surface mount components. A profile is a function of temperatures applied to the assembly over time. When graphed on a Cartesian plane, a curve is formed that represents the temperature at a specific point on the PCB, at any given time, throughout the reflow process.
Technical Library | 2010-09-10 09:47:06.0
An optimal reflow profile is one of the most critical factors in achieving quality solder joints on a printed circuit board (PCB) assembly with surface mount components. A profile is a function of temperatures applied to the assembly over time. When graphed on a Cartesian plane, a curve is formed that represents the temperature at a specific point on the PCB, at any given time, throughout the reflow process.
Dennis Odonnell , Vice President of Precision PCB Services, Inc., Oroville CA Explains How to Evaluate a BGA Rework Station ! #BGA Rework Stations http://www.pcb-repair.com/bga-rework-station/
Dennis Odonnell , Vice President of Precision PCB Services, Inc., Oroville CA Explains How to Evaluate a BGA Rework Station ! #BGA Rework Stations http://www.pcb-repair.com/bga-rework-station/
Imagineering, Inc. | https://www.pcbnet.com/blog/how-to-prevent-a-solder-ball-defect/
How to Prevent a Solder Ball Defect | Imagineering, Inc. Skip to main content Resources Support Contact Us FAQs Live Chat My Account 847-806-0003 Menu PCB Capabilities Fabrication Technology Roadmap Materials Available HDI Tolerances Certifications
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/Vacuum-Void-Reduction-Reflow.pdf
]. His analysis, summarized in Figure 1, shows that there are multiple types of voids and multiple void formation mechanisms. Voids can be differentiated with respect to how they are formed, where they reside in the solder joint and how they affect the reliability of the solder joint
