Connect2it offers unique solutions to standard and high frequency test applications. Products include: Interposers, Conductive polymers and elastomers, test clips, Micron semiconductor test probes, spring contact test probes and vision systems.
New Equipment | Rework & Repair Services
BGA Rework Services Offered BGA Remove and Placement Level Three Pad Repair Wire Add Trace Repair BGA Re-Balling BGA Inspection We Rework PBGA (Plastic Ball Grid Array) TBGA (Tape Ball Grid Array) uBGA (Micro BGA) CCGA (Ceramic Colum
New Equipment | Rework & Repair Services
Many Fortune 500 clients, and numerous other OEMs and contract manufacturers of micro-electronics rely on Process Sciences to service, modify, reclaim, upgrade, and/or repair their circuit assemblies and array devices. PSI knows solder! Please rememb
Electronics Forum | Tue Sep 10 08:22:36 EDT 2002 | davef
I doubt that the interposer is FR4, it's more likely to be BT. Warp during reflow is a function of material a reflow recipe. Your ramp is too fast and is causing the interposer to bend like a potato chip.
Electronics Forum | Thu Jul 10 22:46:08 EDT 2008 | davef
We'd like to see pads on the board that closely resemble those on the interposer.
Industry News | 2003-06-10 08:39:25.0
New from Unitek Eapro is a series of desktop systems for hot bar bonding applications.
Industry News | 2013-06-20 19:24:42.0
IPC – Association Connecting Electronics Industries® has released the agenda for IPC Conference on Component Technology: Closing the Gap in the Chip to PCB Process, an event designed to help the PCB supply chain and chip manufacturers better meet industry demands for reliability and performance.
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Parts & Supplies | AOI / Automated Optical Inspection
Universal AI part Scissor Knife Set 43871702 44241906 ARM,KICKOUT 5MM,RH 44241908 ARM,KICKOUT STD RH N 44241909 ARM,KICKOUT 5MM RH N 44241910 REPLACED BY: 44241909 44241911 ARM,KICKOUT 5MM RH N 44241912 ARM,KICKOUT STD RH N 44241913 ARM,
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Parts & Supplies | AOI / Automated Optical Inspection
Universal plug-in machine guide wheel 18164000 44241906 ARM,KICKOUT 5MM,RH 44241908 ARM,KICKOUT STD RH N 44241909 ARM,KICKOUT 5MM RH N 44241910 REPLACED BY: 44241909 44241911 ARM,KICKOUT 5MM RH N 44241912 ARM,KICKOUT STD RH N 44241913 AR
Technical Library | 2016-08-11 15:49:59.0
The challenge for 3D IC assembly is how to manage warpage and thin wafer handling in order to achieve a high assembly yield and to ensure that the final structure can pass the specified reliability requirements. Our test vehicles have micro-bumped die having pitches ranging from 60um down to 30um. The high density of pads and the large die size, make it extremely challenging to ensure that all of the micro-bump interconnects are attached to a thin Si-interposer. In addition, the low standoff between the die and interposer make it difficult to underfill. A likely approach is to first attach the die to the interposer and then the die/interposer sub-assembly to the substrate. In this scenario, the die/interposer sub-assembly is comparable to a monolithic silicon die that can be flip chip attached to the substrate. In this paper, we will discuss various assembly options and the challenges posed by each. In this investigation, we will propose the best method to do 2.5D assembly in an OSAT(Outsourced Assembly and Test) facility.
Technical Library | 2017-08-10 01:23:22.0
This paper demonstrates the high frequency performance and thermo-mechanical reliability of through vias with 25 μm diameter at 50 μm pitch in 100 μm thin glass substrates. Scaling of through via interconnect diameter and pitch has several electrical performance advantages for high bandwidth 2.5D interposers as well as mm-wave components for 5G modules.
Training Courses | | | PCB Design Courses
The PCB design courses teach students the process, techniques and tools needed to design layout of printed circuit boards.
Events Calendar | Mon Jan 30 00:00:00 EST 2023 - Thu Feb 02 00:00:00 EST 2023 | Kauai, Hawaii USA
Pan Pacific Microelectronics Symposium
Events Calendar | Mon Jan 31 00:00:00 EST 2022 - Thu Feb 03 00:00:00 EST 2022 | Honolulu, Hawaii USA
Pan Pacific Microelectronics Symposium
Interposers Sukhadha Viswanathan, Tomonori Ogawa, K
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dima/products/bonding-and-soldering-systems/c-drive-head
English Bond heads and thermode options English Interposer Modules and Tapes English Process Calibration Tools English C-Drive Head The C-Drive Bond Head is designed to deliver quality solder joints and Heat Seal bonds consistently
Surface Mount Technology Association (SMTA) | https://www.smta.org/panpac/
& Test Techniques Interposer & Packaging Technology Materials & Reliability Nanotechnology Applications Trends, Roadmaps, and more... Steering Committee Phil Isaacs, IBM Corporation, Chair Charles E. Bauer, Ph.D
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