Industry Directory | Consultant / Service Provider / Events Organizer / Media / Publisher / Online Resource / Training Provider
On site and online Training and consultancy in electronics manufacture. Wide range of training products which are solder worldwide by IPC, SMTA, SMART Group and others
SMD Pick and Place Machines for All Levels of SMT Assembly T8 Product Description 1. What is T8? The homophonic of T8 is Post Hegemony. It is the real” Patch Overlord” in SMT industry in the future. 2. T8 is also the eighth mounting products of T
New Equipment | Assembly Services
introduction: ZH series is a fully automatic SMT placement machine, it can be mounted various of component through a vacuum nozzle, it is currently on the market cost-effective automatic placement equipment. The machine is suitable for most of the
Electronics Forum | Sat May 04 01:39:28 EDT 2013 | ultimatejoker
Does anyone know what are the available type for LF solder balls? I only know LF35. Is there any other types besides this? Does anyone have the data for the hardness of SAC type and LF type solder ball? Many thanks in advance
Electronics Forum | Wed Jan 30 06:45:01 EST 2002 | yaq
Hi, Has anyone done some research (measurement/simulation) on the effect of PWB vias on solder ball temperature of the component? Would this have some effect on solder joint reliability especially during power cycling? Any comments will be appreciat
Industry News | 2003-02-17 08:40:25.0
To Meet Government Environmental Standards and Individual Company Policies, While Satisfying Production Requirements
Industry News | 2018-10-18 08:04:17.0
Influences of the solder material for the wave soldering machine soldering quality
Technical Library | 2007-02-01 09:57:15.0
The rapid assimilation of Ball Grid Array (BGA) and other Area Array Package technology in the electronics industry is due to the fact that this package type allows for a greater I/O count in a smaller area while maintaining a pitch that allows for ease of manufacture.
Technical Library | 2013-06-13 15:31:24.0
Electromigration (EM) is a mass transportation mechanism driven by electron wind force, thermal gradient, chemical potential and stress gradient. According to Moore’s law, number of transistors on integrated circuits (ICs) doubles approximately every 2 years. Moore’s law holds true since its introduction in 1970s. This insatiable demand for smaller ICs size, larger integration and higher Input/Output (IO) count of microelectronics has made ball grid array (BGA) the most promising connection type in electronic packaging industry. This trend, however, renders EM reliability of solders joints a major bottleneck to hinder further development of electronics industry...
Electronic Packaging Laboratory, State University of New York
Lyra Reflow Oven is a soft soldering that realizes the mechanical and electrical connection between the solder ends of surface mount components or the pins and the printed board pads by remelting the solder paste pre-distributed on the printed board
ACI Technologies Inc. (ACI) is a scientific research corporation dedicated to the advancement of electronics manufacturing processes and materials for The Department of Defense and industry. This video provides an overview of our commercial service
Training Courses | | | PCB Inspection Courses
The PCB inspection courses focus on improving PCB yield and reliability through validation and detection of defects on electronics assemblies.
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Events Calendar | Thu Oct 03 00:00:00 EDT 2019 - Thu Oct 03 00:00:00 EDT 2019 | ,
IPC Tech Ed Webinar Series: Ball Grid Array (BGA) and Bottom Termination Component (BTC) Design and Assembly Challenges: Reflow Profiling to Achieve Low Defect Rates and Successful Assembly! – Part 2
Events Calendar | Mon Jan 14 00:00:00 EST 2019 - Mon Jan 14 00:00:00 EST 2019 | ,
Webinar: Crimp Inspection, Quality Control in the Real World of Manufacture
Career Center | Wesley Chapel, Florida USA | Engineering,Management,Quality Control
15 years of experience on Electronic Manufacturing. Certified SMT Process Engineer TQM Knowledge Statistics DOE Screen Printer Thermal Process Knowledge JIT International Project Engineering Experience
Career Center | ORLANDO, Florida USA | Engineering,Maintenance,Production,Technical Support
Manufacturing tech/eng for a contract manufacture for 10+ years. Been working in the SMT industry for a total of 20yrs. Have done everything from operator to process work. Most familiar with Assembleon, MPM, DEK, BTU,Electrovert, SLIM-KIC, SUPER-MOLE
SMT Express, Volume 2, Issue No. 3 - from SMTnet.com Volume 2, Issue No. 3 Thursday, March 16, 2000 Featured Article Return to Front Page Curtailing Voids in Fine Pitch Ball Grid Array Solder Joints by Gary Morrison and Kevin Lyne
Heller Industries Inc. | https://hellerindustries.com/solder-ball-defects/
Solder Ball Defects - Heller Home » Solder Ball Defects Re-printed in partnership with ITM Solder Ball Defects Defect: solder balls Solder balls are very small fines of solder that have separated from the main body that forms the joint
Imagineering, Inc. | https://www.pcbnet.com/blog/how-to-prevent-a-solder-ball-defect/
Close Search How to Prevent a Solder Ball Defect By Behind the Work March 29, 2022 August 7th, 2023 Blog , Industry News No Comments Soldering is an essential step in the creation of printed circuit