Electronics Forum | Fri Mar 29 07:53:12 EDT 2019 | davef
Why are you printing paste on test via? In the old days, we probed soldered pads to cushion impact force of probing. Is that still a reasonable practice?
Electronics Forum | Tue May 04 14:27:32 EDT 2004 | michasm2
Both are acceptable methods. - Printing on the board may give your operators a better ability to catch insufficient solder due to poor release; however if done right, printing directly onto the BGA ball is much more efficient and eliminates any compo
Industry News | 2012-09-17 16:19:57.0
IPC — Association Connecting Electronics Industries® will hold three, one-day seminars, “Conflict Minerals Critical Issues,” on October 24, 2012, in Boston, Mass.; November 1, 2012,
Industry News | 2010-11-24 16:02:14.0
IPC submitted comments to the U.S. Securities and Exchange Commission (SEC) regarding Section 1502 of the Dodd-Frank Wall Street Reform and Consumer Protection Act, Public Law 111-203, on the trade of conflict minerals.
Technical Library | 2009-10-14 21:17:47.0
Electrochemical migration (ECM) is defined as the growth of conductive metal filaments across a printed circuit board (PCB) in the presence of an electrolytic solution and a DC voltage bias. ECM, also known as dendritic growth, is a critical issue in the electronics industry because the intermittent failure behavior of ECM is a likely root-cause of the high occurrence of field failures identified as no trouble found (NTF)/could not duplicate (CND)
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Imagineering, Inc. | https://www.pcbnet.com/blog/how-to-tell-if-a-printed-circuit-board-is-bad/
. High temperature PCB design is intended to withstand glass transition temperatures greater than 170°C. Repeated high temperature environmental use can cut into the lifespan of printed circuit boards due to melting
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