Electronics Forum: issue due to glue printing (5)

No Clean OSP process cause ICT testing issue due to Flux building in testvia hole

Electronics Forum | Fri Mar 29 07:53:12 EDT 2019 | davef

Why are you printing paste on test via? In the old days, we probed soldered pads to cushion impact force of probing. Is that still a reasonable practice?

Solder Paste to Device (BGA) or PCB

Electronics Forum | Tue May 04 14:27:32 EDT 2004 | michasm2

Both are acceptable methods. - Printing on the board may give your operators a better ability to catch insufficient solder due to poor release; however if done right, printing directly onto the BGA ball is much more efficient and eliminates any compo

Industry News: issue due to glue printing (31)

IPC Offers Three One-day Seminars on Conflict Minerals Critical Issues Experts to present strategies and tools needed for compliance

Industry News | 2012-09-17 16:19:57.0

IPC — Association Connecting Electronics Industries® will hold three, one-day seminars, “Conflict Minerals Critical Issues,” on October 24, 2012, in Boston, Mass.; November 1, 2012,

Association Connecting Electronics Industries (IPC)

IPC Submits Comments to SEC on Conflict Metals

Industry News | 2010-11-24 16:02:14.0

IPC submitted comments to the U.S. Securities and Exchange Commission (SEC) regarding Section 1502 of the Dodd-Frank Wall Street Reform and Consumer Protection Act, Public Law 111-203, on the trade of conflict minerals.

Association Connecting Electronics Industries (IPC)

Technical Library: issue due to glue printing (1)

A Review of Models for Time-to-Failure Due to Metallic Migration Mechanisms

Technical Library | 2009-10-14 21:17:47.0

Electrochemical migration (ECM) is defined as the growth of conductive metal filaments across a printed circuit board (PCB) in the presence of an electrolytic solution and a DC voltage bias. ECM, also known as dendritic growth, is a critical issue in the electronics industry because the intermittent failure behavior of ECM is a likely root-cause of the high occurrence of field failures identified as no trouble found (NTF)/could not duplicate (CND)

DfR Solutions (acquired by ANSYS Inc)

Videos: issue due to glue printing (1)

How to Use and Read Humidity Indicator Card Type 2 - Humitector™

How to Use and Read Humidity Indicator Card Type 2 - Humitector™

Videos

A Sustainable Alternative - Humitector cards are halogen-free and cobalt dichloride free. Visit https://www.clariant.com/solutions/products/2017/10/31/00/12/humitector-type-2-nonreversible-humidity-indicator-card?utm_source=CLRYouTube&utm_medium=Vi

Clariant Cargo & Device Protection

Career Center - Resumes: issue due to glue printing (1)

Arturo C Jadear Jr

Career Center | binan city, Laguna Philippines | Engineering,Maintenance,Technical Support

6.5 Years Experience in Semiconductor Industry Specializing in Dispensing process and Equipment. 5.0 Years of Experience in Field Service Engineering. Machine Commissioning / Customer support 24 / 7, Technical Support for Customer machine and process

Express Newsletter: issue due to glue printing (1124)

Partner Websites: issue due to glue printing (111)

How to Tell if a Printed Circuit Board is Bad | Imagineering, Inc.

Imagineering, Inc. | https://www.pcbnet.com/blog/how-to-tell-if-a-printed-circuit-board-is-bad/

. High temperature PCB design is intended to withstand glass transition temperatures greater than 170°C. Repeated high temperature environmental use can cut into the lifespan of printed circuit boards due to melting

Imagineering, Inc.

Introduction to the working principle of Lyra Reflow Oven - I.C.T SMT Machine

| https://www.smtfactory.com/Introduction-to-the-working-principle-of-Lyra-Reflow-Oven-id45852477.html

Cleaning Machine Stencil Cleaning Machine PCB Protector PCBA Coating Machine Automatic Dispensing Machine Glue Potting Machine I.C.T Curing Oven IR Curing Oven UV Curing Oven Traceability Equipment Automatic Laser Marking Machine Automatic Label Mounter Automatic Inkjet Printing Machine Benchtop Robot Soldering Robot Screwing


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