Industry Directory | Consultant / Service Provider / Manufacturer / Other
Taiwan Dry Tech Corp. manufacturer of Eureka Dry Tech Fast Super Dryers for moisture/humidity proof protective storage of PCB, MSD, IC packages, meets IPC/JEDEC J-STD-033 & IPC-1601.
Industry Directory | Consultant / Service Provider / Manufacturer
Eureka Dry Tech's IPC/JEDEC J-Std-033c Ultra Low Humidity Dry Cabinets provides moisture/humidity controlled storage of MSD，PCB, IC packages. Drying technology trusted by millions in replacing baking, nitrogen & desiccant packs.
The MSL baking process at OX3 Corporation, (�MSL� stands for Moisture Sensitivity Level), is in accordance with IPC and JEDEC Standard "J-STD-033A," the joint industry standard for semiconductor handling, packing, shipping and the use of moisture/ref
New Equipment | Board Handling - Storage
Intelligent Dry Storage Cabinets for Moisture Sensitive Devices The control of moisture sensitive devices (MSDs) prior to reflow soldering is a topic at the forefront of electronics manufacturing. Assemblers are adopting moisture management solutio
Electronics Forum | Wed Sep 23 13:20:02 EDT 2015 | emeto
Depends on the MSL(Moisture sensitivity level) and how far you will use them in production. Here you should be able to get all the answers: http://www.jedec.org/sites/default/files/docs/jstd033b01.pdf
Electronics Forum | Thu Aug 26 08:54:17 EDT 1999 | Dave F
| Having implemented the process of handling moisture sensitive devices our logistics department tries to classify all parts according to their moisture level. | Going through datasheets wasn�t that helpfull, so does anyone know of a source for that
Industry News | 2012-02-07 00:45:44.0
IPC and JEDEC have released the C revision of IPC/JEDEC J-STD-033, Handling, Packing, Shipping and Use of Moisture/Reflow and/or Process Sensitive Components. With an expanded scope, the document now covers the handling, packing and shipping of non-IC electronic components that have been classified per EIA/IPC/JEDEC J-STD-075, Classification of Non-IC Electronic Components for Assembly Processes.
Industry News | 2003-04-17 11:35:44.0
Honored for their contributions to IPC and the electronics industry
Technical Library | 2022-09-12 14:07:47.0
Unique component handling issues can arise when an assembly factory uses highly-moisture sensitive surface mount devices (SMDs). This work describes how the distribution of moisture within the molded plastic body of a SMD is an important variable for survivability. JEDEC/IPC [1] moisture level rated packages classified as Levels 4-5a are shown to require additional handling constraints beyond the typical out-of-bag exposure time tracking. Nitrogen or desiccated cabinet containment is shown as a safe and effective means for long-term storage provided the effects of prior out-of-bag exposure conditions are taken into account. Moisture diffusion analyses coupled with experimental verification studies show that time in storage is as important a variable as floor-life exposure for highly-moisture sensitive devices. Improvements in floor-life survivability can be obtained by a handling procedure that includes cyclic storage in low humidity containment. SMDs that have exceeded their floor-life limits are analyzed for proper baking schedules. Optimized baking schedules can be adopted depending on a knowledge of the exposure conditions and the moisture sensitivity level of the device.
Technical Library | 2021-11-26 14:34:07.0
The use of desiccant bags filled with Silica Sand and or Clay beads used in conjunction with a Moisture Barrier Bag to control moisture for storage of printed circuit boards has long been an accepted practice and standard from both JEDEC and IPC organizations. Additionally, the use heated ovens for baking off moisture using the evaporation process has also been a long#2;standing practice from these organizations. This paper on alternative drying methods will be accompanied by completed independent, unbiased tests conducted by Vinny Nguyen, an engineering student (now graduated) from San Jose State University. The accompanied paper will examine the performance levels of different technologies of desiccant bags to control moisture in enclosed spaces. The tests and equipment set were reviewed by an engineer and consultant to the Lockheed Martin Aerospace Division and the IPC - TM-650 2.6.28 test method was review by engineer from pSemi. The tests were designed to mimic performance tests outlined in Mil Spec 3464, which both IPC and JEDEC have adopted for their respective standards. The test examined variables including absorption capacity rates, weight gain and release of moisture back into the enclosed area. The presentation will also address and highlight: • Similarities of PCBs and Heavy Equipment as it applies to Inspections, Causes of Failure, Types of Corrosion and Moisture Collection Points. • Performance Attributes of Different Desiccant Technologies as it applies to shape, texture, change outs, labeling and regeneration. • Venn Diagram of Electromechanical Failure with the circles 1. Current 2. Contamination 3. Humidity Presentation Available
ML-XC1000 Microfocus X-Ray Parts Counter This equipment is mainly used for the rapid counting of the reel type of material in SMT industry. Material types include all RC materials and IC materials. It is based on the high industrial 4.0 standard,
Humitector™ Type 2 Humidity Indicator Card, used together with a Desi Pak® desiccant, can help provide a complete history of a dry pack environment for moisture sensitive surface mount devices (SMD's) (MSD - moisture sensitive
Imagineering, Inc. | https://www.pcbnet.com/blog/everything-you-need-to-know-about-moisture-sensitive-devices-msds/
. This can be difficult to detect visually when in forms on the bottom side, where it occurs most often. How Manufacturers Are Tackling Moisture Sensitivity in PCB Manufacturing Currently, IPC/JEDEC J-STD-020E and IPC/JEDEC J-STD-033D offer the best information around how manufacturers and end users can
| https://pcbasupplies.com/humidity-controlled-storage-cabinets-at-smta-long-island/
. XDry and PIT will present the company’s line of humidity-controlled cabinets designed to displace moisture from multiple substrates, materials and mediums
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