Industry Directory | Consultant / Service Provider / Manufacturer / Other
Taiwan Dry Tech Corp. manufacturer of Eureka Dry Tech Fast Super Dryers for moisture/humidity proof protective storage of PCB, MSD, IC packages, meets IPC/JEDEC J-STD-033 & IPC-1601.
Industry Directory | Association / Non-Profit
An independent body of ESD experts with the mission to review the ESD robustness requirements of modern IC products for allowing safe handling and mounting
New Equipment | Board Handling - Storage
Eureka TUS-1001 Fast Super Dryer Dry Cabinet Specs: http://eurekadrytech.com/fast-super-dryer/tus-1001 Model: TUS-1001 Fast Super Dryer Capacity: 657 Liters Humidity Range: 10%-50% Recovery Time: Recovers to ≤ 20% RH within 2 hours after accessing
MSD (Moisture Sensitive Device) control is widely recognized as the most critical and difficult material tracking application. MSD has a direct impact on the near- and long-term reliability of the finished product. Cogiscan��s MSD Control offers t
Electronics Forum | Wed Nov 29 20:49:14 EST 2006 | davef
According to J-STD-033B, 3.1 Requirements: The levels are determined per J-STD-020 and/or per JESD22-A113 plus reliability testing. Look here: http://www.jedec.org/download/search/jstd020c.pdf
Electronics Forum | Sun Sep 28 16:06:21 EDT 2003 | Keith Petersen
I am a QA engineer in a telecommunications company. I am searching for both electrical and mechanical reliability standards that govern chip on board tests. Are there similar standards to IPC or JEDEC for COB in rugged commercial applications? I a
Used SMT Equipment | Pick and Place/Feeders
Yamaha Mounter YSM10 basic specifications: 1. Target board size: L510 x W460 mm ~ L50 x W50 mm. Use optional accessories, can correspond to L610mm substrate 2, placement capacity: HM placement head (10 nozzles) specifications HM5 placement he
Used SMT Equipment | Pick and Place/Feeders
Make: ASM Model:ASM TX2i Details:1.High Speed: Achieves a placement speed of up to 96,000 cph in a footprint of only 1 meter × 2.3 meters.2.High Precision: Placement accuracy reaches 25 µm @ 3 sigma, suitable for 0201 metric components.3.Compact Foo
Industry News | 2012-02-07 00:45:44.0
IPC and JEDEC have released the C revision of IPC/JEDEC J-STD-033, Handling, Packing, Shipping and Use of Moisture/Reflow and/or Process Sensitive Components. With an expanded scope, the document now covers the handling, packing and shipping of non-IC electronic components that have been classified per EIA/IPC/JEDEC J-STD-075, Classification of Non-IC Electronic Components for Assembly Processes.
Industry News | 2011-12-14 15:35:33.0
Manufacturing processes, handling and printed circuit assembly (PCA) test can put a lot of mechanical stresses on packages, causing failures. As grid array packages get larger, identifying how to set safe levels for these steps becomes more difficult. A new quantitative test methodology within IPC/JEDEC-9707, Spherical Bend Test Method for Characterization of Board Level Interconnects, lets users determine how much strain packages can take before reliability degradation.
Technical Library | 2010-03-30 21:51:23.0
This paper presents the drop test reliability results for edge-bonded 0.5mm pitch lead-free chip scale packages (CSPs) on a standard JEDEC drop reliability test board.
ACI Technologies Inc. (ACI) is a scientific research corporation dedicated to the advancement of electronics manufacturing processes and materials for The Department of Defense and industry. This video provides an overview of our commercial service
A Sustainable Alternative - Humitector™ Type 2 cards are halogen-free and cobalt dichloride free. For more information on Type 2 Humidity Indicators, visit https://www.clariant.com/solutions/products/2017/10/31/00/12/humitector-type-2-nonreversible-
Career Center | Pullman, Washington USA | Engineering
The Opportunity: Schweitzer Engineering Laboratories (SEL) seeks a professional, innovative and detailed individual for our Senior Process Engineering positions. If you are looking for an opportunity to support a growing, world-class manufacturin
Career Center | Orange County, California USA | Quality Control
Job Description: Summary: Reporting to the COO/CTO the VP of Quality role will involve creating and/or augmenting the Quality system and programs to be a pro-active vs. a reactive structure. This will involve creating an overall quality vision, se
Career Center | Mysore, India | Engineering,Production,Quality Control,Technical Support
· New Product production line setup, Risk assessment, quality system deployment. · Process Engineering activities, PCB Design review w.r.t Design for manufacturability in Pilot lot. · Printed wiring Assembly Process Improvement (Stencil, PCB type, sc
Career Center | Phoenix, Arizona | Engineering,Management,Production,Quality Control,Research and Development,Sales/Marketing,Technical Support
• Highly motivated, solution oriented professional with proven record synergizing scientific, engineering, and business administration backgrounds to drive and sustain customer satisfaction and long term improvements. • Articulate communicator that a
Imagineering, Inc. | https://www.pcbnet.com/blog/everything-you-need-to-know-about-moisture-sensitive-devices-msds/
: IPC/JEDEC J-STD-020E and IPC/JEDEC J-STD-033D. IPC/JEDEC J-STD-020E – This standard offers a classification system to determine initial reliability qualification
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/test-types/fatigue?con=t&page=13
. Failure by fatigue is a major factor in reliability and fatigue testing provides valuable data to compare materials for resistance and assess a component’s lifetime
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