Industry Directory | Manufacturer
Professional manufacturer of Tactile Switch. Jianfu Electronics has passed ISO 9001:2015 quality management system and ISO 14001:2015 environmental management system certificate. Any interest please contact me steven@jian-fu.com
Industry Directory | Consultant / Service Provider
JY offers a great quality production or solution with a reasonable price on a short lead-time. we are not only producing products but also giving out a better solution for testing or connecting.
Electronics Forum | Fri May 30 01:40:32 EDT 2003 | Narong tungthongchai
Dear Zhang JianJun My company just bought in two MVT GS-1 by auction. Unfortunately, there is no technical manual or reference document. I appreciate your help to make a copy of manual for me. Please let me know the cost of them.
Industry News | 2009-12-17 18:14:47.0
MINNEAPOLIS, MN - The SMTA is pleased to announce the Best Papers from SMTA International 2009. As speakers at SMTA International, individuals make contributions to the industry by sharing their research and findings. To reward exceptional achievement, $1,000 awards and plaques are given for the Best of Conference Presentation, Best of Proceedings Paper, and the Best International Paper.
Industry News | 2016-09-07 18:25:28.0
SMTA China held its 10th Anniversary Celebration Reception and Long Service Awards presentation at the show floor of NEPCON South China 2016, which took place on Tuesday, August 30, 2016 at the Shenzhen Convention & Exhibition Center. Founding officers and members were being recognized with the Long Service Award.
Parts & Supplies | Repair/Rework
Repair parts include: CPU circuit board repair and maintenance of the I / O board, servo circuit board repair, the image processing circuit board repair, industrial CCD camera repair, frequency converter repair, PLC repair, touch screen repair, laser
Technical Library | 2017-07-06 15:50:17.0
Head-in-pillow (HiP) is a BGA defect which happens when solder balls and paste can't contact well during reflow soldering. Package warpage was one of the major reasons for HiP formation. In this paper, package warpage was measured and simulated. It was found that the package warpage was sensitive to the thickness of inside chips. A FEM method considering viscoelastic property of mold compound was introduced to simulate package warpage. The CTE mismatch was found contributes to more than 90% of the package warpage value when reflowing at the peak temperature. A method was introduced to measure the warpage threshold, which is the smallest warpage value that may lead to HiP. The results in different atmospheres showed that the warpage threshold was 50μm larger in N2 than that in air, suggesting that under N2 atmosphere the process window for HiP defects was larger than that under air, which agreed with the experiments.
SMTnet Express, July 6, 2017, Subscribers: 30,558, Companies: 10,626, Users: 23,470 Effects of Package Warpage on Head-in-Pillow Defect Zhenyu Zhao, Chuan Chen, Yuming Wang, Lei Liu, Guisheng Zou, Jian Cai and Qian Wang - Tsinghua University
ORION Industries | http://orionindustries.com/pdfs/frfilm.pdf
-794-8563 (Fax) B e i j i n g GE Plastics Citic Building, 3rd Floor No. 19 Jian Guo Men Wai Av e n u e Beijing 100004 China (86) 10-6500-6538 (86) 10-6500-6476 (Fax) G u a n g z h o u GE Plastics Guangzhou Room 1212, Yi An Plaza No. 38, Jian She 6 Road
Surface Mount Technology Association (SMTA) | https://www.smta.org/smtai/best_papers.cfm
: Jean-Paul Clech, EPSI Inc.; Gregory Henshall and Jian Miremadi, HP Company "Closed-Form, Strain-Energy Based Acceleration Factors for Thermal Cycling of Lead-Free Assemblies" 2008
