Industry Directory | Consultant / Service Provider / Manufacturer
Since 1986, our focus on delivering quality PCB's and Assemblies hasn't changed. Our top priority has always been to understand what the customer values, evaluate their needs and deliver the best-in-class service and products.
Industry Directory | Manufacturer
XPCB is a PCB manufacturer with superior expertise in multilayer rigid-flex PCB and flex PCB, supporting special technology including VIPPO, stacked vias, buried vias, blind vias, unsymmetrical structure, and air gap structure.
New Equipment | Fabrication Services
Flexible PCB includes single sided FPC, double sided FPC and multilayer FPC, etc. Single FPC has chemically etched conductive pattern layer, the conductive pattern layer on the surface of the flexible insulating substrate is calendered copper foil. T
New Equipment | Fabrication Services
Aluminum PCB & Metal Core PCB & LED PCB Circuit board Aluminium PCB are metal-based, copper-clad laminates with a good heat dissipation function. Usually, Aluminium PCB is refer to LED PCB board, which is the most important part of LED display and l
Electronics Forum | Thu Sep 05 01:56:38 EDT 2013 | ciciswift
the Layers - > Add the Layers, or click the shortcut icon on the left toolbar, enter in the wake of a "Number of new the Layers" need to increase the Number of Layers. 2. Delete the layer: Edit - > the Layers - > Remove the Layers, and choose to dele
Electronics Forum | Fri Jul 30 16:41:14 EDT 2004 | Dave
Consider a 6 layer board. The Through via gets drilled from top layer to bottom layer. All 6 layers has the hole drilled in it. A blind via is a via that does not got through the entire 6 layers. It would go from layer 1 to layer 2. or layer 6 to lay
Used SMT Equipment | SMT Equipment
Product Name: FX-2 high speed modular chip mounter Product number: FX-2 Detailed product introduction Characteristic： Mount work efficiency is increased by 20%, *1 at the same time to make economic benefits, operating performance, reliability of
Used SMT Equipment | Pick and Place/Feeders
Product Name: FX-2 high speed modular chipmounter Product number: FX-2 Detailed product introduction Characteristic： Mount work efficiency isincreased by 20%, *1 at the same time to make economic benefits, operatingperformance, reliability of a h
Industry News | 2003-02-17 08:21:41.0
HDI Sales Made Up Larger Share of Net Sales in 4Q
Industry News | 2003-02-18 08:45:21.0
Reports 2002 Revenue at 92% of Target
Parts & Supplies | Pick and Place/Feeders
Juki Feeder Trolley: All are made in Stainless Steel; It can put 30-50 pcs/layer, totally two layers(It's according to customers' request); Usage: They are used to store Feeders. Outer Dimension: 800*600*1100mm(It can be made accordin
Parts & Supplies | Pick and Place/Feeders
GFC-Y03 YAMAHA Feeder Storage Cart Specification Dimension: 800 x 600 x 1100 mm, L x W x H Material: Full Stainless Steel Structure: 2 layers, 40pieces per layer With four metal flexible castors Feeder Model Compati
Technical Library | 2023-01-17 17:27:13.0
Reflow profile has significant impact on solder joint performance because it influences wetting and microstructure of the solder joint. The degree of wetting, the microstructure (in particular the intermetallic layer), and the inherent strength of the solder all factor into the reliability of the solder joint. This paper presents experimental results on the effect of reflow profile on both 63%Sn 37%Pb (SnPb) and 96.5%Sn 3.0%Ag 0.5%Cu (SAC 305) solder joint shear force. Specifically, the effect of the reflow peak temperature and time above solder liquidus temperature are studied. Nine reflow profiles for SAC 305 and nine reflow profiles for SnPb have been developed with three levels of peak temperature (230 o C, 240 o C, and 250 o C for SAC 305; and 195 o C, 205 o C, and 215 o C for SnPb) and three levels of time above solder liquidus temperature (30 sec., 60 sec., and 90 sec.). The shear force data of four different sizes of chip resistors (1206, 0805, 0603, and 0402) are compared across the different profiles. The shear force of the resistors is measured at time 0 (right after assembly). The fracture surfaces have been studied using a scanning electron microscopy (SEM) with energy dispersive spectroscopy (EDS)
Technical Library | 2012-12-17 22:05:22.0
Package on Package (PoP) has become a relatively common component being used in mobile electronics as it allows for saving space in the board layout due to the 3D package layout. To insure device reliability through drop tests and thermal cycling as well as for protecting proprietary programming of the device either one or both interconnect layers are typically underfilled. When underfill is applied to a PoP, or any component for that matter, there is a requirement that the board layout is such that there is room for an underfill reservoir so that the underfill material does not come in contact with surrounding components. The preferred method to dispensing the underfill material is through a jetting process that minimizes the wet out area of the fluid reservoir compared to traditional needle dispensing. To further minimize the wet out area multiple passes are used so that the material required to underfill the component is not dispensed at once requiring a greater wet out area. Dispensing the underfill material in multiple passes is an effective way to reduce the wet out area and decrease the distance that surrounding components can be placed, however, this comes with a process compromise of additional processing time in the underfill dispenser. The purpose of this paper is to provide insight to the inverse relationship that exists between the wet out area of the underfill reservoir and the production time for the underfill process.
FUJI-XP-243E 1. Multifunctional, high-speed, high-precision, compact design holographic small universal placement machine; 2. Mount 0603 (0201) chip; 3. Expand the number of nozzles stored, and you can always have nozzles or mechanical fixtures
FUJI-XP-243E 1. Multifunctional, high-speed, high-precision, compact design holographic small universal placement machine; 2. Mount 0603 (0201) chip; 3. Expand the number of nozzles stored, and you can always have nozzles or mechanical fixtures
Training Courses | | | IPC-6012 Trainer (CIT)
The Certified IPC-6012 Trainer (CIT) courses recognize individuals as qualified trainers in the area of design, fabrication and inspection of rigid printed boards and prepare them to deliver Certified IPC-6012 Specialist (CIS) training.
Training Courses | ON DEMAND | | IPC-600 Trainer (CIT)
The Certified IPC-600 Trainer (CIT) courses recognize individuals as qualified trainers in the area of quality assurance of bare printed circuit boards and prepare them to deliver Certified IPC-600 (CIS) training.
Events Calendar | Tue Aug 18 00:00:00 EDT 2020 - Tue Aug 18 00:00:00 EDT 2020 | ,
How to Minimize Humidity Interaction with PCBAs for Robustness
Events Calendar | Tue Jul 11 00:00:00 EDT 2023 - Tue Jul 11 00:00:00 EDT 2023 | Oshkosh, Wisconsin USA
Wisconsin Chapter In-Person Event: PCB Workshop and PCB Plant Tour
Career Center | Buffalo, New York USA | Engineering
This opportunity offers growth & visibility within the organization! You'll be challenged and asked to push the limits… flex/rigid boards, multi layer, mixed technologies (RF, power, digital) etc... • Design VERY complex, h
Career Center | Denver, Colorado USA | Engineering
Requirements: 5 plus years experience with active & passive components. Such as resistors, capacitors, diodes, transistors, IC'S, crystals, oscillators, asic's, relays, switches, memory modules, linear logic, mimics, RF discrete devices and multi lay
Career Center | Erode, Tamilnadu India | Engineering
Professional Summary 3+ years of experience in the PCB CAM engineering Exposure to FRONTLINE GENESIS 2000 Having exposure in UCAM Exposure to Create, Array & Panelize it for manufacturability Experienced in Creating impedance cou
Imagineering, Inc. | https://www.pcbnet.com/blog/the-importance-of-thermal-management-in-pcb-manufacturing/
. Thermal loads are most easily dissipated by the use of copper layering, vias placed under power components, the use of cold walls, thermal padding, and component spacing
ASCEN Technology | https://www.ascen.ltd/Blog/machine/Conformal_coating_machine/987.html
-cured.They are dispensed onto a glass slide in a thick or thin layering process. The whole selective conformal coating dispensing production line include
winsouce.jpg)
.gif)
