Schematic Capture, Printed Circuit Board Design, Printed CIrcuit Board Layout, Circuit Simulation, Programmable Logic Design, PLD Programming, Reverse Engineering, Advanced Packaging, Logic Design
PMC, a digital manufacturing, engineering, and operations productivity solutions firm providing solutions in laser scanning, 3D/2D CAD, dynamic simulation, industrial engineering, material handling, program management, IE services
EasyCoat® 6 software for conformal coating systems delivers intuitive visual programming Nordson ASYMTEK's EasyCoat® software provides precise conformal coating with process control, traceability, and intuitive visual programming for conformal coati
Ayrshire Electronics can provide a wide range of engineering services, including but not limited to: Design Services Hardware and Software Development Printed Circuit Board Layout Prototypes Rapid Response Center Design for Manufacturability
Electronics Forum | Thu Oct 30 21:06:20 EDT 2008 | ashley
Hello mickd, For Fuji practice, the primary tooling hole preferably be 5mm from the edge of the PCB (lower right hand corner). This is the reference X0, Y0 co-ordinates in the Fuji program where placing co-ordinates going LEFT will be -ve value & go
Electronics Forum | Sat Nov 01 04:12:53 EDT 2008 | ashley
Hello mickd, The Fiducial Marks are normally etched along the vertical side of the PCB, therefore it will not be block by the XY table clamping rails. p.s. try to have a Shiny & Round Fiducial Mark as recommended by Fuji....so that you need not inp
Used SMT Equipment | Turnkey Lines
Functional Pre-Owned Complete SMT Assembly Line - Still Operational (Subject to prior sell, I am listing this on other venues) Up for sale is a full turnkey SMT line and all of it's accessories, of which there are a lot, fe
Industry News | 2003-02-04 08:49:40.0
John Was the Product Manager for Orcad's Schematic Capture and PCB Layout Programs from 1994 to 2001
Industry News | 2003-03-25 09:24:51.0
The Cadstar Universal package enables educational establishments to provide multiple licences of current generation PCB design solutions for students at a cost equivalent to a standard single licence.
Parts & Supplies | Circuit Board Assembly Products
PULANG TECHNOLOGY CO,.LTDOffers electronic manufacturing services including PCB designing, electronic contract manufacturing including electronic product design, electronic product development, electronic product repair, PCB manufacturing, electronic
Technical Library | 2012-12-17 22:05:22.0
Package on Package (PoP) has become a relatively common component being used in mobile electronics as it allows for saving space in the board layout due to the 3D package layout. To insure device reliability through drop tests and thermal cycling as well as for protecting proprietary programming of the device either one or both interconnect layers are typically underfilled. When underfill is applied to a PoP, or any component for that matter, there is a requirement that the board layout is such that there is room for an underfill reservoir so that the underfill material does not come in contact with surrounding components. The preferred method to dispensing the underfill material is through a jetting process that minimizes the wet out area of the fluid reservoir compared to traditional needle dispensing. To further minimize the wet out area multiple passes are used so that the material required to underfill the component is not dispensed at once requiring a greater wet out area. Dispensing the underfill material in multiple passes is an effective way to reduce the wet out area and decrease the distance that surrounding components can be placed, however, this comes with a process compromise of additional processing time in the underfill dispenser. The purpose of this paper is to provide insight to the inverse relationship that exists between the wet out area of the underfill reservoir and the production time for the underfill process.
Technical Library | 2007-11-29 17:20:31.0
Programs have been developed to predict the expected yield of flip chip assemblies, based on substrate design and the statistics of actual manufactured boards, as well as placement machine accuracy, variations in bump sizes, and possible substrate warpage. These predictions and the trends they reveal can be used to direct changes in design so that defect levels will fall below the acceptable limits. Shapes of joints are calculated analytically, or when this is not possible, numerically by means of a public domain program called Surface Evolver. The method is illustrated with an example involving the substrate for a flip chip BGA.
In-line or stand-alone fluxer/pre-heater This compact modular in-line system utilises the same design concept as the new generation Synchrodex soldering cell and offers the user significantly reduced process time when compared to using a single sold
The newly redesigned EasyCoat® 6 software for conformal coating combines several powerful capabilities to deliver a simplified programming experience that reduces programming time, increases throughput and productivity, and achieves high quality coat
Training Courses | | | PCB Design Courses
The PCB design courses teach students the process, techniques and tools needed to design layout of printed circuit boards.
Training Courses | | | IPC Designer Certification CID
The Certified IPC Designer CID (Certified Interconnect Designer) course is the industry's premier professional development program for experienced PCB design professionals.
Events Calendar | Wed Mar 07 00:00:00 EST 2018 - Wed Mar 07 00:00:00 EST 2018 | ,
Solder Paste Qualification Testing - SMTA Webinar
Career Center | Gloucester, Massachusetts USA | Engineering
Designs & develops membrane keypads by performing the following duties: Analyzes data to determine feasibility of product proposal. Confers with research personnel to clarify or resolve problems & develops design. Prepares or directs preparation or
Career Center | Blackwood, New Jersey USA | Production
Responsibilities include the following: Improve the cost effectiveness, efficiency, and quality of production processes. Develop methods, practices, and processes used to manufacture circuit assemblies. Program Surface Mount Equipment for printed ci
Career Center | Torrington, Connecticut | Engineering,Management,Production,Quality Control,Sales/Marketing,Technical Support
MECHANICAL AND ELECTRONIC CAD TECHNOLOGY-CERTIFICATION • TECHNICAL DRAFTING: Equipment Use, Orthographic Projection, Dimensioning, Auxiliary Views, Fasteners, Manufacturing Processes and Fits and Tolerances • POWER TRANSMISSION/ANSI 14.5 1994: Bearin
Career Center | Palm Bay, Florida USA | Engineering,Production
1 year of SMT production experience in a low/med volume, high mix environment. IPC-A-610 Certified Specialist. Reflow profiling experience Heavy CAM programming experience with prototypes and new products
| http://etasmt.com:9060/cc?ID=te_news_media,21761&url=_print
to add a new Full Auto SMT Lines to expand productivity. ETA team provided professional advice from SMT total solution to the layout of the workshop, which was recognized by the customer
1st Place Machinery Inc. | http://www.firstplacemachinery.com/smt_pcb_aoi_crtechnology.html
. The workstation layout includes a load/unload sample table, multiple cameras, lighting, monitor, image processor and operator controls
