Industry Directory | Manufacturer
The largest tin/lead secondary smelter in the western hemisphere, with a focus on recycling industrial metal waste streams. Areas of expertise include electronics dross, solder paste, solder wire, solder bar.
Industry Directory | Distributor
Manufacturer of soldering materials, paste solder
New Equipment | Solder Materials
Whether you are a hobbyist, sheet metal fabricator, or an electronics assembler, StellarTechincal.com provides quality solder for you, including lead-free solder wire. When you shop online at our business, you’ll be able to get a solder bar, babbit f
With the July2006 ROHS deadline approaching SigmaPrint Technologies are now able to supply colour coded �green� Squeegee assemblies. Colour coded squeegees are of great help to customers who are exempt from the directive, helping to ensure that the
Electronics Forum | Mon Feb 19 15:32:42 EST 2007 | blnorman
We use SnPb paste and bar with leaded and non-leaded component finishes. The predominant finish on components we use is Tin, there are a few NiPdAu. We've had no problems with the component finishes used in the SnPb process.
Electronics Forum | Mon May 22 11:28:56 EDT 2006 | Rob
Hi Pat, The main driver for the UK on Lead-Free is to avoid leachate in our drinking water & in the food chain. Whilst John Burke's report is compelling & I agree with him on the points he has raised, regarding the leachate issue he has referenced
Industry News | 2018-12-08 03:24:24.0
RoHS Guide in Electronics: RoHS, WEEE and Lead-Free FAQ
Industry News | 2010-09-20 20:34:52.0
The U.S. Securities and Exchange Commission (SEC) is drafting new reporting requirements on the use of conflict minerals. “These new reporting requirements could have a significant impact on the entire electronics industry supply chain, much like the lead-free requirements of RoHS,” according to Mikel Williams, chairman of the IPC Government Relations Committee and president and CEO of DDi Corp.
Parts & Supplies | Assembly Accessories
Detailed Product Description Brand: DEK Material: Metal Machine: Printer Machine Part Name: Pressure Sensor Model: 183452 Apllication: DEK Squeegee DEK Squeegee pressure Sensor 183452 BOM ASSY^STRAIN GAUGE BEAM (TXT ) for DEK printing machine
Parts & Supplies | Assembly Accessories
DEK VISION Y AXIS SERVO MOTOR 133128/160706/145520 D-160706/D-145520/ D-133128 DEK RISING TABLE SERVO MOTOR 160708/140737 D-160708/D-140737 DEK VISION X AXIS SERVO MOTOR 133127/160704/145817 D-160704/D-14
Technical Library | 2023-02-13 19:23:18.0
Spontaneously forming tin whiskers, which emerge unpredictably from pure tin surfaces, have regained prevalence as a topic within the electronics research community. This has resulted from the ROHS-driven conversion to "lead-free" solderable finish processes. Intrinsic stresses (and/or gradients) in plated films are considered to be a primary driving force behind the growth of tin whiskers. This paper compares the formation of tin whiskers on nanocrystalline and conventional polycrystalline copper deposits. Nanocrystalline copper under-metal deposits were investigated, in terms of their ability to mitigate whisker formation, because of their fine grain size and reduced film stress. Pure tin films were deposited using matte and bright electroplating, electroless plating, and electron beam evaporation. The samples were then subjected to thermal cycling conditions in order to expedite whisker growth. The resultant surface morphologies and whisker formations were evaluated.
Technical Library | 2020-10-27 02:07:31.0
For companies that choose to take the Pb-free exemption under the European Union's RoHS Directive and continue to manufacture tin-lead (Sn-Pb) electronic products, there is a growing concern about the lack of Sn-Pb ball grid array (BGA) components. Many companies are compelled to use the Pb-free Sn-Ag-Cu (SAC) BGA components in a Sn-Pb process, for which the assembly process and solder joint reliability have not yet been fully characterized. A careful experimental investigation was undertaken to evaluate the reliability of solder joints of SAC BGA components formed using Sn-Pb solder paste. This evaluation specifically looked at the impact of package size, solder ball volume, printed circuit board (PCB) surface finish, time above liquidus and peak temperature on reliability. Four different BGA package sizes (ranging from 8 to 45 mm2) were selected with ball-to-ball pitch size ranging from 0.5mm to 1.27mm. Two different PCB finishes were used: electroless nickel immersion gold (ENIG) and organic solderability preservative (OSP) on copper. Four different profiles were developed with the maximum peak temperatures of 210oC and 215oC and time above liquidus ranging from 60 to 120 seconds using Sn-Pb paste. One profile was generated for a lead-free control. A total of 60 boards were assembled. Some of the boards were subjected to an as assembled analysis while others were subjected to an accelerated thermal cycling (ATC) test in the temperature range of -40oC to 125oC for a maximum of 3500 cycles in accordance with IPC 9701A standard. Weibull plots were created and failure analysis performed. Analysis of as-assembled solder joints revealed that for a time above liquidus of 120 seconds and below, the degree of mixing between the BGA SAC ball alloy and the Sn-Pb solder paste was less than 100 percent for packages with a ball pitch of 0.8mm or greater. Depending on package size, the peak reflow temperature was observed to have a significant impact on the solder joint microstructural homogeneity. The influence of reflow process parameters on solder joint reliability was clearly manifested in the Weibull plots. This paper provides a discussion of the impact of various profiles' characteristics on the extent of mixing between SAC and Sn-Pb solder alloys and the associated thermal cyclic fatigue performance.
Dinghua Technology-- the leading manufacturer of BGA rework station, Automatic screw locking machine, Automatic soldering station and non-standard equipment. For more details, please just contact John, WhatsApp/Wechat:+86 1576811 4827 , Skype: si
Ruichi Standard Soldering Robot R351. Soldering Tip can be designed according to your products.
Career Center | Rochester, New York USA | Engineering
I have done my undergraduate studies in Mechanical Engineering. I am pursuing my Master's Program in Electronics Packaging. I am currently working as a Research Assistant for RIT-CEMA (Center for Electronics Manufacturing and Assembly). My research
Career Center | Phoenix, Arizona | Engineering,Management,Production,Quality Control,Research and Development,Sales/Marketing,Technical Support
• Highly motivated, solution oriented professional with proven record synergizing scientific, engineering, and business administration backgrounds to drive and sustain customer satisfaction and long term improvements. • Articulate communicator that a
SMTnet Express, August 1, 2019, Subscribers: 32,197, Companies: 10,845, Users: 24,998 Tin Whiskers: Risks with Lead Free | Part I Credits: ACI Technologies, Inc. Tin (Sn) metal displays the characteristic of growing "tin whiskers" from pure tin
Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/webinars.cfm
! 2010 Status of the Proliferation of Lead-Free Alloys: 2010 Ronald Lasky, Ph.D., P.E. Free! 2010 Reducing Head-in-Pillow with Tin-Lead and Lead-Free Solder Paste Development Jasbir Bath Free! 2009 Practical Guidelines for Moisture Sensitive
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/resource-center/solder-selection-guide
. lead-free Many applications have a requirement for use of lead-free solder alloy. Sometimes this is due to the product falling under the RoHS
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